AUP034N10 Silicon MOSFET with TO220 Package Featuring Low RDSon and High Speed Switching Performance

Key Attributes
Model Number: AUP034N10
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
195A
Operating Temperature -:
-55℃~+175℃
RDS(on):
3.4mΩ@10V,20A
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
280pF
Output Capacitance(Coss):
-
Pd - Power Dissipation:
330W
Input Capacitance(Ciss):
10nF
Gate Charge(Qg):
138nC@10V
Mfr. Part #:
AUP034N10
Package:
TO-220
Product Description

Product Overview

The AUP034N10, AUB034N10, and AUR030N10 are N-Channel MOSFETs designed for high-efficiency applications. These devices feature low drain-source on-resistance, high-speed power switching, and enhanced body diode dv/dt capability. They are ideal for synchronous rectification in Switch Mode Power Supplies (SMPS), as well as hard switching and high-speed DC/DC converters in telecommunications and industrial sectors. Key performance parameters include a VDS of 100V and low RDS(on) values of 2.8m (typ.) for TO220/TO263 packages and 2.4m (typ.) for the TOLL-8L package.

Product Attributes

  • Brand: Not specified
  • Origin: Not specified
  • Material: Silicon N-Channel MOS
  • Color: Not specified

Technical Specifications

Part Name Package Marking VDS @ Tj,max (V) RDS(on),max TO220&TO263 (m) RDS(on),max TOLL (m) Qg,typ (nC) ID,pulse (A)
AUP034N10 TO220 AUP034N10 100 3.4 - 138 856
AUB034N10 TO263 AUB034N10 100 3.4 - 138 856
AUR030N10 TOLL AUR030N10 100 - 3.0 138 856
Parameter Symbol Value Unit Note / Test Condition
Continuous drain current at silicon ID 214 A TC=25C, limited by Tj,max
Continuous drain current at package ID 195 A TC=25C, limited by Tj,max
Continuous drain current at silicon ID 151 A TC=100C, limited by Tj,max
Pulsed drain current ID,pulse 856 A TC=25C, pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS 512 mJ Tc=25, VDD=40V, Vgs=10V, L=1mH, RG=25
Avalanche current, single pulse IAR 32 A Tc=25, VDD=40V, L=1mH, RG=25
Gate source voltage (static) VGS 20 V static
Power dissipation Ptot 330 W TC=25C
Storage temperature Tstg -55 to 175 C -
Operating junction temperature Tj -55 to 175 C -
Soldering Temperature TL 300 C Distance of 1.6mm from case for 10s
Drain-source breakdown voltage V(BR)DSS 100 V VGS=0V, ID=250uA
Gate threshold voltage V(GS)th 2 to 4 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS 1 uA VDS=100V, VGS=0V, Tj=25C
Gate-source leakage current IGSS 100 nA VGS=20V, VDS=0V
Drain-source on-state resistance (TO220&TO263) RDS(on) 2.8 to 3.4 m VGS=10V, ID=20A, Tj=25C
Drain-source on-state resistance (TOLL) RDS(on) 2.4 to 3.0 m VGS=10V, ID=20A, Tj=25C
Gate resistance (Intrinsic) RG 2.6 f=1MHz, open drain
Transconductance Gfs 197.2 S VDS=5V, ID=90A
Input capacitance Ciss 10000 pF VGS=0V, VDS=25V, f=1MHz
Output capacitance Coss 2900 pF VGS=0V, VDS=25V, f=1MHz
Reverse transfer capacitance Crss 280 pF VGS=0V, VDS=25V, f=1MHz
Turn-on delay time td(on) 38 ns VDD=50V, VGS=10V, ID=80A, RG=2.5
Rise time tr 50 ns VDD=50V, VGS=10V, ID=80A, RG=2.5
Turn-off delay time td(off) 69 ns VDD=50V, VGS=10V, ID=80A, RG=2.5
Fall time tf 33 ns VDD=50V, VGS=10V, ID=80A, RG=2.5
Gate to source charge Qgs 58 nC VDD=50V, ID=80A, VGS=10V
Gate to drain charge Qgd 44 nC VDD=50V, ID=80A, VGS=10V
Gate charge total Qg 138 nC VDD=50V, ID=80A, VGS=10V
Continuous Source Current at silicon ISD 214 A -
Diode forward voltage VSD 1.2 V VGS=0V, Is=80A, Tj=25C
Reverse recovery time trr 95 ns Vgs=0V, IF=80A, diF/dt=100A/s
Reverse recovery charge Qrr 143 nC Vgs=0V, IF=80A, diF/dt=100A/s
Package Type Thermal Resistance Junction-Case (RthJC) (C/W) Thermal Resistance Junction-Ambient (RthJA) (C/W)
TO263&TO252 0.46 63 (device on PCB, minimal footprint)
TOLL 0.28 48 (device on PCB, minimal footprint)

2410121510_ANHI-AUP034N10_C18199768.pdf

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