Silicon N Channel MOSFET ANHI ASW60R029EFD Suitable for Phase Shift Bridge LLC and AHB Applications

Key Attributes
Model Number: ASW60R029EFD
Product Custom Attributes
Configuration:
Half-Bridge
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
90A
RDS(on):
29mΩ@10V,28A
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4.8V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
0.44pF
Number:
1 N-channel
Output Capacitance(Coss):
165.6pF
Pd - Power Dissipation:
500W
Input Capacitance(Ciss):
8.001nF
Gate Charge(Qg):
153.3nC@10V
Mfr. Part #:
ASW60R029EFD
Package:
TO-247
Product Description

Product Overview

The ASW60R029EFD is a Silicon N-Channel MOSFET designed for soft switching applications. It is ideal for use in Boost PFC, HB, AHB, and LLC half-bridge and full-bridge topologies, including phase-shift-bridge (ZVS) and LLC configurations. This MOSFET is well-suited for demanding applications such as Server Power, Telecom Power, EV Charging, and Solar Inverters. Key features include a low drain-source on-resistance (RDS(ON) = 0.025 typ.), easy gate control, and enhancement mode operation with a threshold voltage (Vth) of 3.2 to 4.8 V.

Product Attributes

  • Brand: ASW
  • Type: Silicon N-Channel MOS
  • Mode: Enhancement mode

Technical Specifications

Parameter Symbol Value Unit Note / Test Condition
Drain-source breakdown voltage V(BR)DSS 605 V VGS=0V, ID=250uA
Gate threshold voltage V(GS)th 3.2 - 4.8 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS - 5 uA VDS=600V, VGS=0V, Tj=25C
Gate-source leakage current IGSS - 100 nA VGS=30V, VDS=0V
Drain-source on-state resistance RDS(on) 0.025 - 0.029 VGS=10V, ID=28A, Tj=25C
Gate resistance (Intrinsic) RG - 3.3 f=1MHz, open drain
Continuous drain current ID - 90 A TC=25C, Limited by Tj,max. Maximum Duty Cycle D = 0.50
Pulsed drain current ID,pulse - 270 A TC=25C, Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS - 414 mJ Tc=25,VDD=50V,L=10mH, RG=25
Avalanche current, single pulse IAR - 9.1 A Tc=25,VDD=50V,L=10mH, RG=25
MOSFET dv/dt ruggedness dv/dt - 80 V/ns VDS=0...400V
Gate source voltage (static) VGS -20 - 20 V static
Gate source voltage (dynamic) VGS -30 - 30 V AC (f>1 Hz)
Power dissipation Ptot - 500 W TC=25C
Storage temperature Tstg -55 - 150 C -
Operating junction temperature Tj -55 - 150 C -
Soldering Temperature TL - 260 C Distance of 1.6mm from case for 10s
Reverse diode dv/dt dv/dt - 50 V/ns VDS=0...400V, ISD<=45A, Tj=25C
Thermal resistance, junction - case RthJC - 0.25 C/W -
Thermal resistance, junction - ambient RthJA - 62 C/W device on PCB, minimal footprint
Input capacitance Ciss - 8001 pF VGS=0V, VDS=400V, f=1MHz
Output capacitance Coss - 165.6 pF VGS=0V, VDS=400V, f=1MHz
Reverse transfer capacitance Crss - 0.44 pF VGS=0V, VDS=400V, f=1MHz
Turn-on delay time td(on) - 33 ns VDD=400V,VGS=10V,ID=28A RG=3.4
Rise time tr - 55 ns VDD=400V,VGS=10V,ID=28A RG=3.4
Turn-off delay time td(off) - 147 ns VDD=400V,VGS=10V,ID=28A RG=3.4
Fall time tf - 6.4 ns VDD=400V,VGS=10V,ID=28A RG=3.4
Gate to source charge Qgs - 37.6 nC VDD =400V, ID =28A, VGS =10V
Gate to drain charge Qgd - 54.9 nC VDD =400V, ID =28A, VGS =10V
Gate charge total Qg - 153.3 nC VDD =400V, ID =28A, VGS =10V
Gate plateau voltage Vplateau - 5.6 V VDD =400V, ID =28A, VGS =10V
Diode forward voltage VSD - 0.63 V VGS=0V, IF=1A, Tj=25C
Reverse recovery time trr - 180 ns Vr=400v,IF=28A,di/dt=100A/us
Reverse recovery charge Qrr - 1.62 uC Vr=400v,IF=28A,di/dt=100A/us
Peak reverse recovery current Irrm - 16.44 A Vr=400v,IF=28A,di/dt=100A/us
Part Name Package Marking
ASW60R029EFD TO247 ASW60R029EFD

2410121615_ANHI-ASW60R029EFD_C19192886.pdf

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