N Channel MOSFET ASE70R950E Designed for Power Switching in Flyback Converters and LED Lighting

Key Attributes
Model Number: ASE70R950E
Product Custom Attributes
Drain To Source Voltage:
750V
Current - Continuous Drain(Id):
6A
RDS(on):
950mΩ
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
3.5V
Reverse Transfer Capacitance (Crss@Vds):
4.55pF@50V
Number:
1 N-channel
Input Capacitance(Ciss):
377pF@50V
Pd - Power Dissipation:
37W
Gate Charge(Qg):
10.3nC
Mfr. Part #:
ASE70R950E
Package:
SOT223-2L
Product Description

Product Overview

The ASA70R950E, ASD70R950E, and ASE70R950E are N-Channel Silicon MOSFETs designed for efficient power switching applications. These enhancement-mode devices feature low drain-source on-resistance (RDS(ON) = 0.870 typ.) and are easy to control via gate switching. They are ideally suited for single-ended flyback converters, power adapters, LCD & PDP TVs, and LED lighting applications.

Product Attributes

  • Type: N-Channel Silicon MOSFET
  • Mode: Enhancement mode

Technical Specifications

Model Package Marking VDS @ Tj,max (V) RDS(on),max (m) Qg,typ (nC) ID,pulse (A)
ASA70R950E TO220F ASA70R950E 750 950 10.3 18
ASD70R950E TO252 ASD70R950E 750 950 10.3 18
ASE70R950E SOT223-2L ASE70R950E 750 950 10.3 18
Parameter Symbol Value Unit Note / Test Condition
Drain-source breakdown voltage V(BR)DSS 705 V VGS=0V, ID=250uA
Gate threshold voltage V(GS)th 2.8 - 4.2 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS - 1 uA VDS=700V, VGS=0V, Tj=25C
Gate-source leakage current IGSS - 100 nA VGS=30V, VDS=0V
Drain-source on-state resistance RDS(on) 0.87 - 0.95 VGS=10V, ID=2A, Tj=25C
Continuous drain current ID - 6 A TC=25C, Limited by Tj,max. Maximum Duty Cycle D = 0.50
Pulsed drain current ID,pulse - 18 A TC=25C, Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS - 180 mJ Tc=25,VDD=50V,L=10mH, RG=25
Avalanche current, single pulse IAS - 6 A Tc=25,VDD=50V,L=10mH, RG=25
MOSFET dv/dt ruggedness dv/dt - 36 V/ns VDS=0...400V
Gate source voltage (static) VGS -20 - 20 V static
Gate source voltage (dynamic) VGS -30 - 30 V AC (f>1 Hz)
Power dissipation (TO220F) Ptot - 26 W TC=25C
Power dissipation (TO252/SOT223) Ptot - 37 W TC=25C
Storage temperature Tstg -55 - 150 C -
Operating junction temperature Tj -55 - 150 C -
Soldering Temperature TL 260 C Distance of 1.6mm from case for 10s
Continuous diode forward current IS - 6 A TC=25C
Reverse diode dv/dt dv/dt - 15 V/ns VDS=0...400V, ISD<=48A, Tj=25C
Thermal resistance, junction - case (TO220F) RthJC - 4.9 C/W -
Thermal resistance, junction - ambient (TO220F) RthJA - 80 C/W device on PCB, minimal footprint
Thermal resistance, junction - case (TO252/SOT223) RthJC - 3.41 C/W -
Thermal resistance, junction - ambient (TO252/SOT223) RthJA - 62 C/W device on PCB, minimal footprint
Input capacitance Ciss - 377 pF VGS=0V, VDS=50V, f=10kHz
Output capacitance Coss - 33 pF VGS=0V, VDS=50V, f=10kHz
Reverse transfer capacitance Crss - 4.55 pF VGS=0V, VDS=50V, f=10kHz
Turn-on delay time td(on) - 8.4 ns VDD=400V,VGS=13V,ID=2.5A, RG=6.8
Rise time tr - 21.6 ns VDD=400V,VGS=13V,ID=2.5A, RG=6.8
Turn-off delay time td(off) - 45.2 ns VDD=400V,VGS=13V,ID=2.5A, RG=6.8
Fall time tf - 24.4 ns VDD=400V,VGS=13V,ID=2.5A, RG=6.8
Gate to source charge Qgs - 1.845 nC VDD=400V, ID=2.5A, VGS=0 to 10V
Gate to drain charge Qgd - 2.723 nC VDD=400V, ID=2.5A, VGS=0 to 10V
Gate charge total Qg - 10.3 nC VDD=400V, ID=2.5A, VGS=0 to 10V
Gate plateau voltage Vplateau - 6.4 V VDD=400V, ID=2.5A, VGS=0 to 10V
Diode forward voltage VSD - 0.77 V VGS=0V, IF=1A, Tj=25C
Reverse recovery time trr - 124 ns VR=400V, IF=2.5 A, diF/dt=100A/s
Reverse recovery charge Qrr - 0.88 uC VR=400V, IF=2.5 A, diF/dt=100A/s
Peak reverse recovery current Irrm - 10 A VR=400V, IF=2.5 A, diF/dt=100A/s

2410121525_ANHI-ASE70R950E_C5440015.pdf

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