High Speed Power Switching Device AUP049N10 N Channel Silicon MOSFET with Robust Avalanche Ruggedness
Product Overview
The AUP049N10 and AUB049N10 are N-Channel Silicon MOSFETs designed for high-speed power switching applications. They are particularly well-suited for synchronous rectification in Switched-Mode Power Supplies (SMPS), hard switching, and high-speed DC/DC converters in telecommunications and industrial sectors. Key features include low drain-source on-resistance, enhanced body diode dv/dt capability, and robust avalanche ruggedness, ensuring reliable performance in demanding environments.
Product Attributes
- Brand: Not explicitly mentioned, but inferred from part numbers.
- Material: Silicon N-Channel MOS
- Available Packages: TO220, TO263
Technical Specifications
| Model | Package | Marking | VDS @ Tj,max (V) | RDS(on),max (m) | Qg,typ (nC) | ID,pulse (A) |
|---|---|---|---|---|---|---|
| AUP049N10 | TO220 | AUP049N10 | 100 | 4.9 | 60.7 | 408 |
| AUB049N10 | TO263 | AUB049N10 | 100 | 4.9 | 60.7 | 408 |
| Parameter | Symbol | Value (Typ.) | Unit | Condition |
|---|---|---|---|---|
| Drain-source on-resistance (TO220) | RDS(on) | 4.3 | m | VGS=10V, ID=20A, Tj=25C |
| Drain-source on-resistance (TO263) | RDS(on) | 4.2 | m | VGS=10V, ID=20A, Tj=25C |
| Continuous drain current (TC=25C) | ID | 136 | A | Limited by Tj,max |
| Continuous drain current (TC=100C) | ID | 101 | A | Limited by Tj,max |
| Pulsed drain current | ID,pulse | 408 | A | TC=25C, Pulse width tp limited by Tj,max |
| Avalanche energy, single pulse | EAS | 282 | mJ | Tc=25, VDD=50V, Id=33.6A, L=0.5Mh, RG=25 |
| Avalanche current, single pulse | IAR | 33.6 | A | Tc=25, VDD=50V, L=0.5Mh, RG=25 |
| Gate source voltage (static) | VGS | -20 | V | static |
| Power dissipation (TO263,TO220) | Ptot | 161 | W | TC=25C |
| Storage temperature | Tstg | -55 to 150 | C | |
| Operating junction temperature | Tj | -55 to 150 | C | |
| Thermal resistance, junction - case | RthJC | 0.78 | C/W | |
| Thermal resistance, junction - ambient | RthJA | 62 | C/W | device on PCB, minimal footprint |
| Drain-source breakdown voltage | V(BR)DSS | 100 | V | VGS=0V, ID=250Ua |
| Gate threshold voltage | V(GS)th | 2.5 to 4.5 | V | VDS=VGS, ID=250Ua |
| Zero gate voltage drain current | IDSS | 1 | Ua | VDS=100V, VGS=0V, Tj=25C |
| Gate-source leakage current | IGSS | 100 | Na | VGS=20V, VDS=0V |
| Input capacitance | Ciss | 3864 | Pf | VGS=0V, VDS=50V, f=1MHz |
| Output capacitance | Coss | 379 | Pf | VGS=0V, VDS=50V, f=1MHz |
| Reverse transfer capacitance | Crss | 15.3 | Pf | VGS=0V, VDS=50V, f=1MHz |
| Turn-on delay time | td(on) | 30.5 | ns | VDD=50V,VGS=10V,ID=20A, RG=10 |
| Rise time | tr | 57 | ns | VDD=50V,VGS=10V,ID=20A, RG=10 |
| Turn-off delay time | td(off) | 72 | ns | VDD=50V,VGS=10V,ID=20A, RG=10 |
| Fall time | tf | 45 | ns | VDD=50V,VGS=10V,ID=20A, RG=10 |
| Gate to source charge | Qgs | 16.2 | Nc | VDD=50V, ID=20A, VGS=0 to 10V |
| Gate to drain charge | Qgd | 18.5 | Nc | VDD=50V, ID=20A, VGS=0 to 10V |
| Gate charge total | Qg | 63.7 | Nc | VDD=50V, ID=20A, VGS=0 to 10V |
| Diode forward voltage | VSD | 0.7 | V | VGS=0V, IF=1A, Tj=25C |
| Reverse recovery time | trr | 47 | ns | VR=30V, IF=20A, diF/dt=300A/s |
| Reverse recovery charge | Qrr | 221 | Nc | VR=30V, IF=20A, diF/dt=300A/s |
| Peak reverse recovery current | Irrm | 8.8 | A | VR=30V, IF=20A, diF/dt=300A/s |
2410121521_ANHI-AUP049N10_C19192884.pdf
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