High Speed Power Switching Device AUP049N10 N Channel Silicon MOSFET with Robust Avalanche Ruggedness

Key Attributes
Model Number: AUP049N10
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
136A
RDS(on):
4.9mΩ@10V,20A
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
15.3pF
Number:
1 N-channel
Output Capacitance(Coss):
379pF
Pd - Power Dissipation:
161W
Input Capacitance(Ciss):
3.864nF
Gate Charge(Qg):
63.7nC@10V
Mfr. Part #:
AUP049N10
Package:
TO-220
Product Description

Product Overview

The AUP049N10 and AUB049N10 are N-Channel Silicon MOSFETs designed for high-speed power switching applications. They are particularly well-suited for synchronous rectification in Switched-Mode Power Supplies (SMPS), hard switching, and high-speed DC/DC converters in telecommunications and industrial sectors. Key features include low drain-source on-resistance, enhanced body diode dv/dt capability, and robust avalanche ruggedness, ensuring reliable performance in demanding environments.

Product Attributes

  • Brand: Not explicitly mentioned, but inferred from part numbers.
  • Material: Silicon N-Channel MOS
  • Available Packages: TO220, TO263

Technical Specifications

Model Package Marking VDS @ Tj,max (V) RDS(on),max (m) Qg,typ (nC) ID,pulse (A)
AUP049N10 TO220 AUP049N10 100 4.9 60.7 408
AUB049N10 TO263 AUB049N10 100 4.9 60.7 408
Parameter Symbol Value (Typ.) Unit Condition
Drain-source on-resistance (TO220) RDS(on) 4.3 m VGS=10V, ID=20A, Tj=25C
Drain-source on-resistance (TO263) RDS(on) 4.2 m VGS=10V, ID=20A, Tj=25C
Continuous drain current (TC=25C) ID 136 A Limited by Tj,max
Continuous drain current (TC=100C) ID 101 A Limited by Tj,max
Pulsed drain current ID,pulse 408 A TC=25C, Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS 282 mJ Tc=25, VDD=50V, Id=33.6A, L=0.5Mh, RG=25
Avalanche current, single pulse IAR 33.6 A Tc=25, VDD=50V, L=0.5Mh, RG=25
Gate source voltage (static) VGS -20 V static
Power dissipation (TO263,TO220) Ptot 161 W TC=25C
Storage temperature Tstg -55 to 150 C
Operating junction temperature Tj -55 to 150 C
Thermal resistance, junction - case RthJC 0.78 C/W
Thermal resistance, junction - ambient RthJA 62 C/W device on PCB, minimal footprint
Drain-source breakdown voltage V(BR)DSS 100 V VGS=0V, ID=250Ua
Gate threshold voltage V(GS)th 2.5 to 4.5 V VDS=VGS, ID=250Ua
Zero gate voltage drain current IDSS 1 Ua VDS=100V, VGS=0V, Tj=25C
Gate-source leakage current IGSS 100 Na VGS=20V, VDS=0V
Input capacitance Ciss 3864 Pf VGS=0V, VDS=50V, f=1MHz
Output capacitance Coss 379 Pf VGS=0V, VDS=50V, f=1MHz
Reverse transfer capacitance Crss 15.3 Pf VGS=0V, VDS=50V, f=1MHz
Turn-on delay time td(on) 30.5 ns VDD=50V,VGS=10V,ID=20A, RG=10
Rise time tr 57 ns VDD=50V,VGS=10V,ID=20A, RG=10
Turn-off delay time td(off) 72 ns VDD=50V,VGS=10V,ID=20A, RG=10
Fall time tf 45 ns VDD=50V,VGS=10V,ID=20A, RG=10
Gate to source charge Qgs 16.2 Nc VDD=50V, ID=20A, VGS=0 to 10V
Gate to drain charge Qgd 18.5 Nc VDD=50V, ID=20A, VGS=0 to 10V
Gate charge total Qg 63.7 Nc VDD=50V, ID=20A, VGS=0 to 10V
Diode forward voltage VSD 0.7 V VGS=0V, IF=1A, Tj=25C
Reverse recovery time trr 47 ns VR=30V, IF=20A, diF/dt=300A/s
Reverse recovery charge Qrr 221 Nc VR=30V, IF=20A, diF/dt=300A/s
Peak reverse recovery current Irrm 8.8 A VR=30V, IF=20A, diF/dt=300A/s

2410121521_ANHI-AUP049N10_C19192884.pdf

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