Power Management P Channel Enhancement Mode MOSFET ANPEC APM2301CAC TRG with Low On State Resistance

Key Attributes
Model Number: APM2301CAC-TRG
Product Custom Attributes
Drain To Source Voltage:
20V
Current - Continuous Drain(Id):
2.8A
Operating Temperature -:
-55℃~+150℃
RDS(on):
70mΩ@4.5V,2.8A
Gate Threshold Voltage (Vgs(th)):
1V
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
75pF
Number:
1 P-Channel
Input Capacitance(Ciss):
580pF
Output Capacitance(Coss):
100pF
Pd - Power Dissipation:
830mW
Gate Charge(Qg):
7nC
Mfr. Part #:
APM2301CAC-TRG
Package:
SOT-23
Product Description

Product Overview

The APM2301CA is a P-Channel Enhancement Mode MOSFET designed for power management applications in notebook computers, portable equipment, and battery-powered systems. It offers reliable and rugged performance with low on-state resistance (RDS(ON)) at various gate-source voltages. This device is available in lead-free and green (RoHS compliant and halogen-free) options, ensuring environmental compliance.

Product Attributes

  • Brand: SINOPOWER
  • Product Type: P-Channel Enhancement Mode MOSFET
  • Certifications: RoHS Compliant, Lead Free, Green Devices Available
  • Package Type: SOT-23

Technical Specifications

Symbol Parameter Test Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDSS Drain-Source Voltage -20 V
VGSS Gate-Source Voltage ±12 V
ID * Continuous Drain Current -3 A
IDM * 300µs Pulsed Drain Current VGS=-4.5V -12 A
IS * Diode Continuous Forward Current -1.3 A
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 150 °C
PD * Maximum Power Dissipation TA=25°C 0.83 W
PD * Maximum Power Dissipation TA=100°C 0.3 W
RθJC Thermal Resistance-Junction to Case 75 °C/W
RθJA * Thermal Resistance-Junction to Ambient 150 °C/W
Electrical Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA -20 - - V
IDSS Zero Gate Voltage Drain Current VDS=-16V, VGS=0V - - -1 µA
IDSS Zero Gate Voltage Drain Current TJ=85°C - - -30 µA
VGS(th) Gate Threshold Voltage VDS= VGS, IDS=-250µA -0.5 -0.75 -1 V
IGSS Gate Leakage Current VGS=±12V, VDS=0V - - ±10 µA
RDS(ON) a Drain-Source On-State Resistance VGS=-4.5V, IDS=-3A - 56 70
VGS=-2.5V, IDS=-2A - 85 115
VGS=-1.8V, IDS=-1A - 135 250
VSD a Diode Forward Voltage ISD=-1.3A, VGS=0V - -0.75 -1.3 V
Gate Charge Characteristics
Qg Total Gate Charge VDS=-10V, VGS=-4.5V, IDS=-3A - 7 10 nC
Qgs Gate-Source Charge - 1.9 - nC
Qgd Gate-Drain Charge - 1.9 - nC
Dynamic Characteristics
Ciss b Input Capacitance VGS=0V, VDS=-10V, Frequency=1.0MHz - 580 - pF
Coss b Output Capacitance - 100 - pF
Crss b Reverse Transfer Capacitance - 75 - pF
td(ON) Turn-on Delay Time VDD=-10V, RL=10Ω, IDS=1A, VGEN=-4.5V, RG=6Ω - 4 7 ns
tr Turn-on Rise Time - 13 23 ns
td(OFF) Turn-off Delay Time - 35 63 ns
tf Turn-off Fall Time - 20 36 ns
trr Reverse Recovery Time ISD=-3A, dlSD/dt =100A/µs - 20 - ns
Qrr Reverse Recovery Charge - 7 - nC

Notes:

  • * Surface Mounted on 1in² pad area, t ≤ 10sec.
  • a Pulse test; pulse width≤300µs, duty cycle≤2%.
  • b Guaranteed by design, not subject to production testing.

2511271044_ANPEC-APM2301CAC-TRG_C60715.pdf

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