Low Frequency Power Amplifier Transistor BLUE ROCKET 2SD669AD-C Silicon NPN Type with TO-252 Package
Product Overview
The 2SD669AD is a Silicon NPN transistor housed in a TO-252 plastic package. It serves as a complementary pair with the 2SB649AD and is designed for low-frequency power amplification applications. Key features include a continuous collector current of 1.5A and a collector-emitter breakdown voltage of 160V.
Product Attributes
- Brand: FSB (implied by URL and marking code 'BR')
- Product Type: Silicon NPN Transistor
- Package Type: TO-252 Plastic Package
- Complementary Pair: 2SB649AD
- Application: Low frequency power amplifier
- Marking Code: D669AD
Technical Specifications
| Parameter | Symbol | Rating / Test Conditions | Value | Unit |
|---|---|---|---|---|
| Absolute Maximum Ratings (Ta=25) | ||||
| Collector to Base Voltage | VCBO | 180 | V | |
| Collector to Emitter Voltage | VCEO | 160 | V | |
| Emitter to Base Voltage | VEBO | 5.0 | V | |
| Collector Current - Continuous | IC | 1.5 | A | |
| Collector Current Continuous(Pulse) | ICP | 3.0 | A | |
| Collector Power Dissipation | PC | 1.0 | W | |
| Collector Power Dissipation | PC(Tc=25) | 10 | W | |
| Junction Temperature | Tj | 150 | ||
| Storage Temperature Range | Tstg | -55150 | ||
| Electrical Characteristics (Ta=25) | ||||
| Collector to Base Breakdown Voltage | VCBO | IC=1.0mA, IE=0 | 180 | V |
| Collector to Emitter Breakdown Voltage | VCEO | IC=10mA, RBE= | 160 | V |
| Emitter to Base Breakdown Voltage | VEBO | IE=1.0mA, IC=0 | 5.0 | V |
| Collector Cut-Off Current | ICBO | VCB=160V, IE=0 | 10 | A |
| DC Current Gain | hFE(1) | VCE=5.0V, IC=150mA | 60320 | |
| DC Current Gain | hFE(2) | VCE=5.0V, IC=500mA | 30 | |
| Base to Emitter Voltage | VBE | VCE=5.0V, IC=150mA | 1.5 | V |
| Collector to Emitter Saturation Voltage | VCE(sat) | IC=500mA, IB=50mA | 1.0 | V |
| Transition Frequency | fT | VCE=5.0V, IC=150mA | 140 | MHz |
| Collector output capacitance | Cob | VCB=10V, IE=0, f=1.0MHz | 14 | pF |
Packaging Specifications
Reel Package
| Package Type | Units/Reel | Reels/Inner Box | Units/Inner Box | Inner Boxes/Outer Box | Units/Outer Box | Package Dimensions (mm) |
|---|---|---|---|---|---|---|
| TO-252 | 2,500 | 2 | 5,000 | 5 | 25,000 | 1316 |
Tube Package
| Package Type | Units/Tube | Tubes/Inner Box | Units/Inner Box | Inner Boxes/Outer Box | Units/Outer Box | Package Dimensions (mm) |
|---|---|---|---|---|---|---|
| TO-251/252 | 75 | 48 | 3,600 | 5 | 18,000 | 52620.55.25 |
Soldering Profile
Temperature Profile for IR Reflow Soldering (Pb-Free):
- Preheating: 25~150, Time: 60~90 seconds
- Peak Temp.: 2455, Duration: 50.5 seconds
- Cooling Speed: 2~10/sec
Resistance to Soldering Heat Test Conditions:
- Temperature: 2605
- Time: 101 sec
Marking Instructions
Format: BR **** D669AD B
- BR: Company Code
- D669AD: Product Type
- B: hFE Classifications Symbol
- ****: Lot No. Code (changes with Lot No.)
2410121236_BLUE-ROCKET-2SD669AD-C_C358470.pdf
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