SOD123 Plastic Package Schottky Diode BLUE ROCKET B5817W Halogen Free with Low Forward Voltage Drop

Key Attributes
Model Number: B5817W
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
25A
Reverse Leakage Current (Ir):
1mA@20V
Voltage - DC Reverse (Vr) (Max):
20V
Diode Configuration:
Independent
Voltage - Forward(Vf@If):
750mV@3A
Current - Rectified:
1A
Mfr. Part #:
B5817W
Package:
SOD-123
Product Description

Product Overview

The B5817W-B5819W series are Schottky diodes housed in a SOD-123 plastic package. These diodes are characterized by a low positive pressure drop and are halogen-free (HF Product). They are designed for general-purpose rectification applications.

Product Attributes

  • Package Type: SOD-123 Plastic Package
  • Product Type: Schottky Diode
  • Certifications: HF Product (Halogen-Free)
  • Brand: fsbrec (indicated by website URL)

Technical Specifications

Parameter Symbol Rating (B5817W) Rating (B5818W) Rating (B5819W) Unit
Absolute Maximum Ratings (Ta=25)
Peak Repetitive Reverse Voltage VRRM 20 30 40 V
Working Peak Reverse Voltage VRWM 20 30 40 V
DC Reverse Voltage VR 20 30 40 V
RMS Reverse Voltage VRRMS 14 21 28 V
Average Rectified Forward Current IF 1 A
Non-Repetitive Peak Forward Surge Current IFSM 25 A
Power Dissipation PD 450 mW
Typical Thermal Resistance Junction to Ambient RJA 220 /W
Junction and Storage Temperature Range TJ,Tstg -65 to 125
Electrical Characteristics (Ta=25)
Parameter Symbol Test Conditions MIN MAX Unit
Forward Voltage VF IF=0.1A 0.32 0.35 V
IF=1A 0.45 0.55 V
IF=3A (t<5us) 0.75 0.875 V
Reverse breakdown voltage V(BR) IR=1mA 20 40 V
Instantaneous Reverse Current IRM VR=VRRM 1 mA
Junction Capacitance CJ VR=4V f=1.0MHZ 120 pF

Pinning

  • PIN1: Cathode
  • PIN2: Anode

Marking & hFE Classifications

Model Marking
B5817W HSJ
B5818W HSK
B5819W HSL

Packaging Specifications

Package Type Units/Reel Reels/Inner Box Units/Inner Box Inner Boxes/Outer Box Units/Outer Box Dimension (Reel) Dimension (Inner Box) Dimension (Outer Box)
SOD-123 3,000 10 30,000 6 180,000 78 180120180 390385205

Resistance to Soldering Heat Test Conditions

  • Temperature: 2605
  • Time: 101 sec.

Temperature Profile for IR Reflow Soldering (Pb-Free)

  • Preheating: 150~180, Time: 60~90 sec.
  • Peak Temp.: 2455, Duration: 50.5 sec.
  • Cooling Speed: 2~10/sec.

2108072030_BLUE-ROCKET-B5817W_C2844060.pdf

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