30 Volt N Channel MOSFET Bruckewell MSH30N039 Featuring Trench DMOS Technology and RoHS Compliance

Key Attributes
Model Number: MSH30N039
Product Custom Attributes
Drain To Source Voltage:
30V
Configuration:
-
Current - Continuous Drain(Id):
60A
Operating Temperature -:
-55℃~+150℃
RDS(on):
3.9mΩ@10V
Gate Threshold Voltage (Vgs(th)):
2.2V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
70pF@15V
Number:
1 N-channel
Pd - Power Dissipation:
25W
Input Capacitance(Ciss):
-
Gate Charge(Qg):
14.7nC@4.5V
Mfr. Part #:
MSH30N039
Package:
PDFN5x6-8
Product Description

Product Overview

The MSH30N039 is an N-Channel 30-V (D-S) MOSFET utilizing advanced trench DMOS technology. This technology is engineered to minimize RDS(ON), enhance switching performance, and provide robust high-energy pulse handling in avalanche and commutation modes. It is ideally suited for high-efficiency, fast-switching applications. The device meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval.

Product Attributes

  • Brand: Bruckewell Technology Corporation
  • Technology: Trench DMOS
  • Certifications: RoHS Compliant, Green Device Available
  • Package Type: PDFN 5X6
  • Packing: 3,000/Reel

Technical Specifications

Symbol Parameter Test Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage 30 V
VGS Gate-Source Voltage ±20 V
ID Continuous Drain Current (TC =25°C) 60 A
ID Continuous Drain Current (TC =100°C) 38 A
IDM Pulsed Drain Current 120 A
IAS Single Pulse Avalanche Current (L =0.1mH) 40 A
EAS Single Pulse Avalanche Energy (L =0.1mH) 80 mJ
PD Power Dissipation (TC =25°C) 25 W
TJ/TSTG Operating Junction and Storage Temperature -55 150 °C
Thermal Resistance Ratings
RθJA Maximum Junction-to-Ambient (Note 1) 65 °C/W
RθJC Maximum Junction-to-Case (Note 1) 5.0 °C/W
Electrical Characteristics (TJ=25°C unless otherwise specified)
VGS (th) Gate Threshold Voltage VDS =VGS, ID =250μA 1.2 2.2 V
BVDSS Drain-Source Breakdown Voltage VGS =0V, ID =250μA 30 V
IGSS Gate-Source Leakage Current VDS =0V, VGS =±20V ±100 nA
IDSS Drain-Source Leakage Current VDS =30V, VGS =0V, TJ =25°C 1 μA
IDSS Drain-Source Leakage Current VDS =30V, VGS =0V, TJ =55°C 5 μA
RDS (on) Static Drain-Source On-Resistance VGS =10V, ID =20A 3.2 3.9
RDS (on) Static Drain-Source On-Resistance VGS =4.5V, ID =15A 4.9 6.1
EAS Single Pulse Avalanche Energy VDD =25V, L =0.1mH, IAS =20A (Note 5) 20 mJ
VSD Diode Forward Voltage IS =1A, VGS =0V, TJ =25°C (Note 2) 1.0 V
IS Continuous Source Current (Note 1, 6) 30 A
ISM Pulsed Source Current (Note 2, 6) 60 A
Dynamic Characteristics
Qg Total Gate Charge VDS =15V ID =20A VGS =4.5V (Note 2) 14.7 nC
Qgs Gate-Source Charge 5.8 nC
Qgd Gate-Drain Charge 3.5 nC
td(on) Turn-On Delay Time VDS =15V ID =20A VGS =10V RG =3Ω (Note 2) 7.5 ns
tr Rise Time 20.2 ns
td(off) Turn-Off Delay Time 21.6 ns
tf Fall Time 4.4 ns
CISS Input Capacitance VDS =15V VGS =0V f =1.0MHz 1476 pF
COSS Output Capacitance 556 pF
CRSS Reverse Transfer Capacitance 70 pF
Rg Gate Resistance VDS =0V, VGS =0V, f =1.0MHz 1.65 Ω

Notes:

  • 1. The data tested by surface mounted on a 1 inch² FR-4 board with 2OZ copper.
  • 2. The data tested by pulsed, pulse width ≤ 300μs, duty cycle ≤ 2%.
  • 3. The EAS data shows maximum rating. The test condition is VDD=25V, VGS=10V, L=0.1mH, IAS=55A.
  • 4. The power dissipation is limited by 150 junction temperature.
  • 5. The Min. value is 100% EAS tested guarantee.
  • 6. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.

2412061551_Bruckewell-MSH30N039_C42407732.pdf

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