N Channel 100 Volt MOSFET Bruckewell MSO100N019 featuring low RDS ON and gate charge for synchronous buck

Key Attributes
Model Number: MSO100N019
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
330A
Operating Temperature -:
-55℃~+175℃
RDS(on):
1.9mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
386pF@50V
Number:
1 N-channel
Pd - Power Dissipation:
333W
Input Capacitance(Ciss):
13.362nF@50V
Gate Charge(Qg):
212nC@10V
Mfr. Part #:
MSO100N019
Package:
TOLL
Product Description

Product Overview

The MSO100N019 is a high-performance N-Channel 100-V (D-S) MOSFET featuring extreme high cell density. It offers excellent RDS(ON) and gate charge, making it ideal for synchronous buck converter applications. This device meets RoHS and Green Product requirements, is 100% EAS guaranteed, and has full function reliability approval. Key benefits include super low gate charge and excellent Cdv/dt effect decline.

Product Attributes

  • Brand: Bruckewell Technology Corporation
  • Product Line: MSO Series
  • Certifications: RoHS Compliant, Green Device Available
  • Package Type: TOLL
  • Packing: 2,000/Reel

Technical Specifications

Symbol Parameter Test Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage 100 V
VGS Gate-Source Voltage ±20 V
ID Continuous Drain Current1 (TC =25°C) 330 A
(TC =100°C) 225 A
IDM Pulsed Drain Current1,2 1000 A
IAS Single Pulse Avalanche Current, L =1.0mH3 40 A
EAS Single Pulse Avalanche Energy, L =1.0mH3 800 mJ
PD Power Dissipation4 (TC =25°C) 333 W
TJ/TSTG Operating Junction and Storage Temperature -55 +175 °C
Thermal Resistance Ratings
RθJA Maximum Junction-to-Ambient1 40 °C/W
RθJC Maximum Junction-to-Case1 0.45 °C/W
Electrical Characteristics (TJ=25°C unless otherwise specified)
VGS (th) Gate Threshold Voltage VDS =VGS, ID =250μA 2.0 - 4.0 V
BVDSS Drain-Source Breakdown Voltage VGS =0V, ID =250μA 100 - - V
gfs Forward Transconductance VDS =5V, ID =20A - 75 - S
IGSS Gate-Source Leakage Current VDS =0V, VGS =±20V - - ±100 nA
IDSS Drain-Source Leakage Current VDS =80V, VGS =0V, TJ =25°C - - 1 μA
VDS =80V, VGS =0V, TJ =100°C - - 100 μA
RDS (on) Static Drain-Source On-Resistance2 VGS =10V, ID =90A - 1.6 1.9
EAS Single Pulse Avalanche Energy5 VDD =50V, L =1mH, IAS =30A 450 - - mJ
VSD Diode Forward Voltage2 IS =1A, VGS =0V, TJ =25°C - - 1.2 V
IS Continuous Source Current1,6 VG=VD=0V, Force Current - - 100 A
Dynamic Characteristics
Qg Total Gate Charge2 VDS =50V ID =90A VGS =10V -- 212 -- nC
Qgs Gate-Source Charge -- 59 --
Qgd Gate-Drain (Miller) Charge -- 53 --
td(on) Turn-On Delay Time2 VDS =50V ID =20A VGS =10V RG =3Ω -- 47 -- ns
tr Rise Time -- 28 --
td(off) Turn-Off Delay Time -- 79 --
tf Fall Time -- 18 --
CISS Input Capacitance VDS =50V VGS =0V f =1.0MHz -- 13362 -- pF
COSS Output Capacitance -- 1917 --
CRSS Reverse Transfer Capacitance -- 386 --
Rg Gate Resistance VGS =VDS =0V, f =1.0MHz -- 1.0 -- Ω

Notes:
1. Data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. Data tested by pulsed, pulse width ≤ 300μs, duty cycle ≤ 2%.
3. EAS data shows maximum rating. Test condition: VDD=50V, VGS=10V, L=1.0mH, IAS=40A.
4. Power dissipation is limited by 175°C junction temperature.
5. Min. value is 100% EAS tested guarantee.
6. Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.


2412061551_Bruckewell-MSO100N019_C42407747.pdf
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