60 Volt P Channel MOSFET Bruckewell MS23P11B featuring low gate charge and excellent RDS ON for load switching

Key Attributes
Model Number: MS23P11B
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
1.7A
Operating Temperature -:
-55℃~+150℃
RDS(on):
266mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
38pF
Number:
1 P-Channel
Output Capacitance(Coss):
59pF
Input Capacitance(Ciss):
531pF
Pd - Power Dissipation:
1W
Gate Charge(Qg):
4.6nC@4.5V
Mfr. Part #:
MS23P11B
Package:
SOT-23
Product Description

Product Overview

The MS23P11B is a high-performance P-channel MOSFET featuring advanced trench technology with extreme high cell density. It offers excellent RDS(ON) and low gate charge, making it ideal for various small power switching and load switch applications. This device meets RoHS and Green Product requirements and has undergone full function reliability approval. Key advantages include its advanced high cell density trench technology, super low gate charge, and excellent CdV/dt effect decline. It is available as a Green Device.

Product Attributes

  • Brand: Bruckewell Technology Corporation
  • Product Type: P-Channel MOSFET
  • Voltage Rating: 60-V (D-S)
  • Certifications: RoHS Compliant, Green Device Available

Technical Specifications

Model: MS23P11B

Package Type: SOT-23

Packing: 3,000/Reel

Symbol Parameter Test Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage -60 V
VGS Gate-Source Voltage 20 V
ID Continuous Drain Current1 (TA =25C) -1.7 A
(TA =70C) -1.4 A
IDM Pulsed Drain Current2 (TA =25C) -7 A
PD Power Dissipation3 (TA =25C) 1.0 W
TJ/TSTG Operating Junction and Storage Temperature -55 +150 C
Thermal Resistance Ratings
RJA Maximum Junction-to-Ambient1 125 C/W
Electrical Characteristics (TJ =25C unless otherwise specified)
VGS (th) Gate Threshold Voltage VDS =VGS, ID =-250A -1.0 -2.5 V
BVDSS Drain-Source Breakdown Voltage VGS =0V, ID =-250A -60 V
gfs Forward Transconductance VDS =-5V, ID =-1.5A 5.9 S
IGSS Gate-Source Leakage Current VDS =0V, VGS =20V 100 nA
IDSS Drain-Source Leakage Current VDS =-48V, VGS =0V, TJ =25C -1 A
VDS =-48V, VGS =0V, TJ =55C -5 A
RDS (on) Static Drain-Source On-Resistance2 VGS =-10V, ID =-1.5A 180 m
VGS =-4.5V, ID =-1.0A 266 m
VSD Diode Forward Voltage2 IS =-1.0A, VGS =0V, TJ =25C -1.2 V
IS Continuous Source Current1,4 (Diode) VG =VD =0V, Force Current -1.7 A
ISM Pulsed Source Current2,4 (Diode) -7 A
Dynamic and Switching Characteristics
Qg Total Gate Charge2 VDS =-20V ID =-1.5A VGS =-4.5V 4.6 nC
Qgs Gate-Source Charge 1.4 nC
Qgd Gate-Drain Charge 1.62 nC
td(on) Turn-On Delay Time2 VDS =-15V ID =-1A VGS =-10V RG =3.3 17.4 ns
tr Rise Time 5.4 ns
td(off) Turn-Off Delay Time 37.2 ns
tf Fall Time 2.4 ns
CISS Input Capacitance VDS =-15V VGS =0V f =1.0MHz 531 pF
COSS Output Capacitance 59 pF
CRSS Reverse Transfer Capacitance 38 pF

Notes:

  • 1. Surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
  • 2. The data tested by pulsed, pulse width 300s, duty cycle 2%.
  • 3. The power dissipation is limited by 150 junction temperature.
  • 4. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.

Typical Applications:

  • Motor Drive
  • Power Tools
  • LED Applications

2412061551_Bruckewell-MS23P11B_C42407719.pdf

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