planar die zener diode CBI MMSZ5232B featuring compact surface mount package for assembly processes
Product Overview
This series of Zener diodes features a planar die construction and an ultra-small surface mount package, making them ideally suited for automated assembly processes. Designed for general purpose, medium current applications, these diodes offer a reliable voltage regulation solution.
Product Attributes
- Brand: Heyuan China Base Electronics Technology Co., Ltd.
- Package Type: SOD-123
- Construction: Planar Die
- Assembly Suitability: Automated Assembly Processes
Technical Specifications
| Type Number Code | Nominal Zener Voltage (V) | Minimum Zener Voltage (V) | Maximum Zener Voltage (V) | Test Current (mA) | Maximum Zener Impedance () @ IZT | Maximum Reverse Current (A) @ VR | Forward Voltage (V) @ IF = 10mA |
|---|---|---|---|---|---|---|---|
| MMSZ5221B | 2.4 | 2.28 | 2.52 | 20 | 30 | 0.25 | 1.0 |
| MMSZ5223B | 2.7 | 2.57 | 2.84 | 20 | 30 | 0.25 | 1.0 |
| MMSZ5225B | 3.0 | 2.85 | 3.15 | 20 | 30 | 0.25 | 1.0 |
| MMSZ5226B | 3.3 | 3.14 | 3.47 | 20 | 28 | 0.25 | 1.0 |
| MMSZ5227B | 3.6 | 3.42 | 3.78 | 20 | 24 | 0.25 | 1.0 |
| MMSZ5228B | 3.9 | 3.71 | 4.10 | 20 | 23 | 0.25 | 1.0 |
| MMSZ5229B | 4.3 | 4.09 | 4.52 | 20 | 22 | 0.25 | 1.0 |
| MMSZ5230B | 4.7 | 4.47 | 4.94 | 20 | 19 | 0.25 | 2.0 |
| MMSZ5231B | 5.1 | 4.85 | 5.36 | 20 | 17 | 0.25 | 2.0 |
| MMSZ5232B | 5.6 | 5.32 | 5.88 | 20 | 11 | 0.25 | 3.0 |
| MMSZ5233B | 6.0 | 5.70 | 6.30 | 20 | 7 | 0.25 | 3.5 |
| MMSZ5234B | 6.2 | 5.89 | 6.51 | 20 | 7 | 0.25 | 4.0 |
| MMSZ5235B | 6.8 | 6.46 | 7.14 | 20 | 5 | 0.25 | 5.0 |
| MMSZ5236B | 7.5 | 7.13 | 7.88 | 20 | 6 | 0.25 | 6.0 |
| MMSZ5237B | 8.2 | 7.79 | 8.61 | 20 | 8 | 0.25 | 6.5 |
| MMSZ5238B | 8.7 | 8.27 | 9.14 | 20 | 8 | 0.25 | 6.5 |
| MMSZ5239B | 9.1 | 8.65 | 9.56 | 20 | 10 | 0.25 | 7.0 |
| MMSZ5240B | 10 | 9.50 | 10.50 | 20 | 17 | 0.25 | 8.0 |
| MMSZ5241B | 11 | 10.45 | 11.55 | 20 | 22 | 0.25 | 8.4 |
| MMSZ5242B | 12 | 11.40 | 12.60 | 20 | 30 | 0.25 | 9.1 |
| MMSZ5243B | 13 | 12.35 | 13.65 | 9.5 | 13 | 0.25 | 9.9 |
| MMSZ5244B | 14 | 13.30 | 14.70 | 9.0 | 15 | 0.25 | 10 |
| MMSZ5245B | 15 | 14.25 | 15.75 | 8.5 | 16 | 0.25 | 11 |
| MMSZ5246B | 16 | 15.20 | 16.80 | 7.8 | 17 | 0.25 | 12 |
| MMSZ5248B | 18 | 17.10 | 18.90 | 7.0 | 21 | 0.25 | 14 |
| MMSZ5250B | 20 | 19.00 | 21.00 | 6.2 | 25 | 0.25 | 15 |
| MMSZ5251B | 22 | 20.90 | 23.10 | 5.6 | 29 | 0.25 | 17 |
| MMSZ5252B | 24 | 22.80 | 25.20 | 5.2 | 33 | 0.25 | 18 |
| MMSZ5253B | 25 | 23.75 | 26.25 | 5.0 | 35 | 0.25 | 19 |
| MMSZ5254B | 27 | 25.65 | 28.35 | 5.0 | 41 | 0.25 | 21 |
| MMSZ5255B | 28 | 26.60 | 29.40 | 4.5 | 44 | 0.25 | 21 |
| MMSZ5256B | 30 | 28.50 | 31.50 | 4.2 | 49 | 0.25 | 23 |
| MMSZ5257B | 33 | 31.35 | 34.65 | 3.8 | 58 | 0.25 | 25 |
| MMSZ5258B | 36 | 34.20 | 37.80 | 3.4 | 70 | 0.25 | 27 |
| MMSZ5259B | 39 | 37.05 | 40.95 | 3.2 | 80 | 0.25 | 30 |
Maximum Ratings
| Characteristic | Symbol | Value | Unit | Notes |
|---|---|---|---|---|
| Forward Voltage | VF | 0.9 | V | @ IF = 10mA (Note 2) |
| Power Dissipation | Pd | 350 | mW | (Note 1) |
| Thermal Resistance, Junction to Ambient Air | RJA | 357 | /W | |
| Operating and Storage Temperature Range | Tj,TSTG | -65 to +150 |
Notes:
- 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm.
- 2. Tested with pulses, Tp1.0ms.
Package Outline
Plastic surface mounted package; 2 leads
| Symbol | Dimension in Millimeters | Min | Max |
|---|---|---|---|
| A | 0.95 | 1.15 | |
| A1 | 0.01 | 0.100 | |
| B | 1.55 | 1.65 | |
| bp | 0.50 | 0.70 | |
| C | 0.09 | 0.150 | |
| E | 2.60 | 2.70 | |
| HE | 3.45 | 3.85 | |
| Lp | 0.20 | 0.45 | |
| 0 | 5 |
2410121317_CBI-MMSZ5232B_C21714198.pdf
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