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quality High forward surge current rectifier diode ChipNobo MB10F-GKA-CN with polarity symbol marking on body factory
quality High forward surge current rectifier diode ChipNobo MB10F-GKA-CN with polarity symbol marking on body factory

High forward surge current rectifier diode ChipNobo MB10F-GKA-CN with polarity symbol marking on body

Key Attributes
Model Number: MB10F-GKA-CN
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
35A
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - Forward(Vf@If):
1V@1.0A
Current - Rectified:
1A
Voltage - DC Reverse(Vr):
1kV
Mfr. Part #:
MB10F-GKA-CN
Package:
MBF
Product Description

Product Overview

The MB10F-GKA-CN is a rectifier diode designed for printed circuit board applications. It features a glass-passivated junction chip, low reverse leakage, and high forward surge current capability. This component is ideal for residential and commercial equipment and is guaranteed for high-temperature soldering.

Product Attributes

  • Brand: ChipNobo
  • Model: MB10F-GKA-CN
  • Flammability Classification: Underwriters Laboratory 94V-0
  • Material: Molded plastic body with solder plated terminals
  • Polarity: Polarity symbol marking on body

Technical Specifications

Parameter Symbol Units MB10F-GKA-CN
Maximum Repetitive Peak Reverse Voltage VRRM V 1000
Maximum RMS Voltage VRMS V 700
Maximum DC Blocking Voltage VDC V 1000
Maximum Average Forward Rectified Current at TL=100C I(AV) A 1.0
Peak Forward Surge Current, 8.3ms single half sine-wave superimposed on rated load IFSM A 35.0
Maximum Instantaneous Forward Voltage at 1.0A VF V 1.0
Maximum DC Reverse Current at TA=25C at rated DC blocking voltage IR uA 2.0
Maximum DC Reverse Current at TA=125C at rated DC blocking voltage IR uA 76.0
Typical Junction Capacitance (Note 2) CJ pF 18.0
Operating Junction and Storage Temperature Range TJ,TSTG C -55 to +150
Typical Thermal Resistance (Note 1) RqJA C/W 200
Weight ounces / grams 0.0027 / 0.078
Rating for fusing (t=8.3ms, Ta=25 C) It A s 5.08

Mechanical Data

  • Case: Molded plastic body
  • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
  • Mounting Position: Any

Soldering Information

  • High temperature soldering guaranteed: 260 C/10 seconds at terminals.
  • Recommended reflow methods: IR, vapor phase oven, hot air oven, wave solder.
  • The device can be exposed to a maximum temperature of 260C for 10 seconds.

Dimensions

Symbol Unit (inch) Unit (mm)
A 0.173 4.40
B 0.067 1.70
C 0.049 1.25
D 0.039 1.00
E 0.248 6.30
F 0.173 4.40

Package Information

Package Reel Size QTY/Reel Box Size (mm) QTY/Box (Kpcs) Carton Size (mm) QTY/Carton (Kpcs)
MBF 13' 5000 338*338*10 80 365*365*360 5

Marking

Symbol A B
MB10F MB10F + -

Notes

  1. Mounted on glass epoxy PC board with 1.3*1.3mm solder pad.
  2. Measured at 1MHz and applied reverse voltage of 4.0V D.C.

Additional Information

For additional information, please visit our website http://www.chipnobo.com, or consult your nearest Chipnobo sales office for further assistance.


2507091655_ChipNobo-MB10F-GKA-CN_C42459023.pdf

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