Glass passivated junction rectifier diode ChipNobo ABS10 ideal for various printed circuit board uses

Key Attributes
Model Number: ABS10
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
30A
Operating Junction Temperature Range:
-55℃~+175℃
Voltage - Forward(Vf@If):
1V@1.0A
Current - Rectified:
1A
Voltage - DC Reverse(Vr):
1kV
Mfr. Part #:
ABS10
Package:
ABS
Product Description

Product Overview

The ABS10 is a rectifier diode designed for printed circuit board applications. It features a glass-passivated junction chip, low reverse leakage, and high forward surge current capability. This product is ideal for printed circuit boards and is suitable for use in residential and commercial equipment. It is designed to withstand high-temperature soldering, guaranteed up to 260C for 10 seconds.

Product Attributes

  • Brand: ChipNobo
  • Flammability Classification: Underwriters Laboratory 94V-0
  • Material: Molded plastic body with solder plated terminals
  • Junction Type: Glass passivated

Technical Specifications

Parameter SYMBOLS UNITS Ratings
Maximum repetitive peak reverse voltage VRRM V 55 to +175
Maximum RMS voltage VRMS V 260
Maximum DC blocking voltage VDC V 200
Maximum average forward rectified current at TL=100 C I(AV) A 1.0
Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load IFSM A 30.0
Maximum instantaneous forward voltage at 1.0A VF V 1.0
Maximum DC reverse current T A =25 C at rated DC blocking voltage IR A 0.0034
Maximum DC reverse current TA=125 C IR A 0.2
Typical junction capacitance (Note 2) CJ pF 16.0
Operating junction and storage temperature range TJ,TSTG C -55 to +175
Typical thermal resistance (Note 1) RqJA C/W 75.0
Rating for fusing (t=8.3ms, Ta=25 C) It A s 3.73
Weight grams 0.098
Weight ounce 0.0034

Note 1: Mounted on glass epoxy PC board with 1.3*1.3mm solder pad.

Note 2: Measured at 1MHz and applied reverse voltage of 4.0V D.C.

Soldering Temperature Profile: The device can be exposed to a maximum temperature of 260C for 10 seconds. Recommended reflow methods include IR, vapor phase oven, hot air oven, and wave solder. Devices can be cleaned using standard industry methods and solvents. If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.

Dimensions:
Carrier Dimensions (mm): A0=5.31, B0=4.0, K0=6.68, D0=8.0, E=1.6, F=2.0, P0=1.55, P1=0.25, P2=1.75, W=12
Package Dimensions (inch): A=0.284, B=0.078, C=0.224, D=0.039, F=0.059
Package Dimensions (mm): A=7.22, B=2.0, C=5.70, D=1.0, F=1.5

Package Information:
Reel Size: 13'
QTY/Reel: 5000 (Kpcs)
Box Size (mm): 338 x 365 x 360
QTY/Box: 10 (Kpcs)
Carton Size (mm): 330
QTY/Carton: 80 (Kpcs)

Marking:
Symbol: ABS10
Explanation: Polarity Symbol (+/-), Product Name (ABS10)


2507091655_ChipNobo-ABS10_C42458961.pdf

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