Molded plastic body rectifier diode ChipNobo E1J with solderable terminals and 94V 0 flammability rating
Product Overview
This product is a rectifier diode, designed for use in printed circuit boards and suitable for residential and commercial equipment. It features a glass-passivated junction chip, low reverse leakage, and high forward surge current capability. The plastic package carries an Underwriters Laboratory Flammability Classification 94V-0. It is ideal for applications requiring high temperature soldering, guaranteed up to 250C for 10 seconds at terminals.
Product Attributes
- Brand: ChipNobo
- Package: SOD123FL
- Case: Molded plastic body
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Polarity symbol marking on body
- Mounting Position: Any
- Material: Glass passivated junction chip
- Flammability Classification: Underwriters Laboratory 94V-0
Technical Specifications
| Symbol | Unit | Parameter | Value |
|---|---|---|---|
| VRRM | V | Maximum repetitive peak reverse voltage | 55 to +150 |
| VRMS | V | Maximum RMS voltage | 35.0 |
| VDC | V | Maximum DC blocking voltage | 500 |
| I(AV) | A | Maximum average forward rectified current at TL=100C (Single phase half-wave 60Hz, resistive or inductive load) | 1.0 |
| IFSM | A | Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load | 35.0 |
| VF | V | Maximum instantaneous forward voltage at 1.0A | 1.0 |
| IR | A | Maximum DC reverse current at rated DC blocking voltage | 5.0 (TA=25C), 85.0 (TA=125C) |
| CJ | pF | Typical junction capacitance (Note 2) | 7.0 |
| TJ,TSTG | C | Operating junction and storage temperature range | -55 to +150 |
| RqJA | C/W | Typical thermal resistance | 600 (for capacitive load current derate by 20%) |
| Trr | ns | Maximum reverse recovery time (Note 1) | 35 |
| Weight | ounce, grams | 0.0007 ounce, 0.02 grams |
Note 1: Reverse recovery time test condition: IF=0.5A, IR=1.0A, Irr=0.25A
Note 2: Measured at 1MHz and applied reverse voltage of 4.0V D.C.
Soldering Information: High temperature soldering guaranteed 250C/10 seconds at terminals. Recommended reflow methods: IR, vapor phase oven, hot air oven, wave solder. The device can be exposed to a maximum temperature of 265C for 10 seconds. Devices can be cleaned using standard industry methods and solvents.
Dimensions:
| Symbol | Unit (inch) | Unit (mm) |
|---|---|---|
| A | 0.122 | 3.10 |
| B | 0.048 | 1.2 |
| C | 0.167 | 4.25 |
| D | 0.045 | 1.15 |
| E | 0.077 | 1.95 |
| F | 0.122 | 3.10 |
Package Information:
| Package | Reel Size | QTY/Reel | Box Size (mm) | QTY/Box | Carton Size (mm) | QTY/Carton |
|---|---|---|---|---|---|---|
| SOD123FL | 7' | 3 (Kpcs) | 380*200*200 | 15 (Kpcs) | 150 (Kpcs) |
Website: http://www.chipnobo.com
2507091655_ChipNobo-E1J_C42459012.pdf
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