Miniature surface mount bridge rectifier FUXINSEMI ABS210 with peak forward surge current and construction
Product Overview
The ABS205 THRU ABS210 series are miniature, single-phase, surface mount bridge rectifiers designed for high-reliability applications. These glass-passivated rectifiers offer surge overload ratings up to 50 amperes peak and are ideal for automated replacement due to their space-saving design and reliable low-cost construction. They are suitable for various industrial applications requiring efficient rectification from 50V to 1000V.
Product Attributes
- Brand: FUXINSEMICONDUCTOR
- Construction: Molded plastic technology
- Chip Junctions: Glass passivated
- Flame Retardant: UL94-V0 rated epoxy
- Case Material: Molded plastic, ABS
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Marked on body
- Mounting Position: Any
- Compliance: Lead-free parts meet RoHS requirements. Suffix "-H" indicates Halogen free part.
Technical Specifications
| Model | Maximum Recurrent Peak Reverse Voltage (VRRM) | Maximum RMS Voltage (VRMS) | Maximum DC Blocking Voltage (VDC) | Maximum Average Forward Rectified Current @TJ=25 (I(AV)) | Peak Forward Surge Current 8.3ms Single Half Sine-Wave (IFSM) | Maximum Forward Voltage @ 2.0A DC (VF) | Maximum DC Reverse Current @TJ=25 (IR) | Maximum DC Reverse Current @TJ=125 (IR) | It Rating for Fusing (t<8.3ms) (It) | Typical Junction Capacitance Per Element (CJ) | Typical Thermal Resistance (RJA) | Operating Temperature Range (TJ) | Storage Temperature Range (TSTG) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ABS205 | 50V | 35V | 50V | 2.0A | 50A | 1.1V | 10A | 500A | 15As | 10.37pF | 60/W | -55 to +150 | -55 to +150 |
| ABS21 | 100V | 70V | 100V | ||||||||||
| ABS22 | 200V | 140V | 200V | ||||||||||
| ABS24 | 400V | 280V | 400V | ||||||||||
| ABS26 | 600V | 420V | 600V | ||||||||||
| ABS28 | 800V | 560V | 800V | ||||||||||
| ABS210 | 1000V | 700V | 1000V |
Dimensions:
| Symbol | A | B | C | D |
|---|---|---|---|---|
| Dimensions (inches) | 0.236 (6.0) | 0.024 (0.60) | 0.132 (3.35) | 0.193 (4.90) |
Soldering Profile:
| Parameter | Value | Unit |
|---|---|---|
| Preheat Temperature (Tsmin) | 150 | |
| Preheat Temperature (Tsmax) | 200 | |
| Preheat Time (ts) | 60-120 | sec |
| Ramp-up Rate (Tsmax to TL) | <3 | /sec |
| Temperature Maintained Above TL (TL) | 217 | |
| Time Maintained Above TL (tL) | 60-260 | sec |
| Peak Temperature (TP) | 255 +0/-5 | |
| Time within 5 of Peak Temp (tP) | 10-30 | sec |
| Ramp-down Rate (TP to 25) | <6 | /sec |
2011091105_FUXINSEMI-ABS210_C915620.pdf
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