surface mount rectifier FUXINSEMI SS56B with metal silicon junction and high forward surge current capability
Product Overview
The SS52B through SS520B series are surface mount Schottky barrier rectifiers designed for high-efficiency applications. Featuring a metal silicon junction and majority carrier conduction, these rectifiers offer low power loss and high forward surge current capability. They are ideal for automated placement due to built-in strain relief and are housed in a JEDEC DO-214AC molded plastic body with solder-plated terminals. Compliant with RoHS 2.0, these rectifiers are suitable for surface mounting and can withstand high temperature soldering.
Product Attributes
- Package Type: JEDEC DO-214AC (SMB)
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Flammability Classification: Underwriters Laboratory 94V-0
- Compliance: RoHS 2.0
- Construction: Metal silicon junction, majority carrier conduction
- Features: Built-in strain relief, ideal for automated placement, high forward surge current capability, high temperature soldering guaranteed (260C/10 seconds at terminals)
Technical Specifications
| Symbol | Description | SS52B | SS53B | SS54B | SS55B | SS56B | SS58B | SS510B | SS515B | SS520B | Units |
|---|---|---|---|---|---|---|---|---|---|---|---|
| VRRM | Maximum repetitive peak reverse voltage | 20 | 30 | 40 | 50 | 60 | 80 | 100 | 150 | 200 | V |
| VRMS | Maximum RMS voltage | 14 | 21 | 28 | 35 | 42 | 56 | 70 | 105 | 140 | V |
| VDC | Maximum DC blocking voltage | 20 | 30 | 40 | 50 | 60 | 80 | 100 | 150 | 200 | V |
| I(AV) | Maximum average forward rectified current at TL (Fig. 1) | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | A |
| IFSM | Peak forward surge current 8.3ms single half sine-wave | 150.0 | 150.0 | 150.0 | 150.0 | 150.0 | 150.0 | 150.0 | 150.0 | 150.0 | A |
| VF | Maximum instantaneous forward voltage at 5.0A | 0.55 | 0.55 | 0.55 | 0.70 | 0.70 | 0.85 | 0.95 | 0.95 | 0.95 | V |
| IR | Maximum DC reverse current TA=25C at rated DC blocking voltage | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | mA |
| IR | Maximum DC reverse current TA=100C at rated DC blocking voltage | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | mA |
| CJ | Typical junction capacitance (NOTE 1) | 50 | pF | ||||||||
| RJA | Typical thermal resistance (NOTE 2) | 10.0 | C/W | ||||||||
| TJ, TSTG | Operating junction temperature range / Storage temperature range | -55 to +150 | C | ||||||||
Dimensions (SMB/DO-214AA):
- Package Body: 0.183(4.65) x 0.155(3.94) inches (mm)
- Height: 0.086(2.20) x 0.071(1.80) inches (mm)
- Lead Width: 0.060(1.52) x 0.030(0.76) inches (mm)
- Overall Width: 0.219(5.56) x 0.202(5.14) inches (mm)
- Lead Length: 0.012(0.305) x 0.006(0.152) inches (mm)
- Terminal Pad: 0.008(0.203) MAX inches (mm)
- Overall Length: 0.096(2.45) x 0.081(2.05) inches (mm)
Marking Code:
- SS52B: SS52
- SS53B: SS53
- SS54B: SS54
- SS55B: SS55
- SS56B: SS56
- SS58B: SS58
- SS510B: SS510
- SS515B: SS515
- SS520B: SS520
Soldering Condition:
- Reflow soldering: 10~30 seconds
- Preheat Temperature (Tsmin to Tsmax): 150C to 200C
- Time (tsmin to tsmax): 60~120 seconds
- Time maintained above Temperature (TL): 217C
- Time (tL): 60~260 seconds
- Peak Temperature (TP): 255C +0/-5C
- Time within 5C of actual Peak Temperature (tp): 10~30 seconds
Notes:
- 1. Measured at 1MHz and applied reverse voltage of 4.0V D.C.
- 2. P.C.B. mounted with 2.0x2.0 (5.0x5.0cm) copper pad areas.
2304140030_FUXINSEMI-SS56B_C842794.pdf
Our mission is to offer "High Quality" & "Good Service" & "Fast Delivery" to help our clients to gain more profits.