FUXINSEMI DB207S miniature bridge rectifier with molded plastic technology and high voltage rating
Product Overview
The Fuxinsemi DB201S through DB207S series are miniature, single-phase, surface-mount bridge rectifiers designed for applications requiring high surge overload capabilities. These devices offer reliable low-cost construction utilizing molded plastic technology and glass-passivated chip junctions, making them ideal for automated replacement and space-saving on printed circuit boards. They meet RoHS requirements and are suitable for a wide range of voltage ratings from 50V to 1000V.
Product Attributes
- Brand: Fuxinsemi
- Construction: Molded plastic technology
- Chip Junctions: Glass passivated
- Flame Retardant: UL94-V0 rated
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Marked on body
- Mounting Position: Any
- Certifications: RoHS compliant (lead-free parts)
- Optional Suffix: "-H" indicates Halogen free part
Technical Specifications
| Characteristic | Symbol | DB201S | DB202S | DB203S | DB204S | DB205S | DB206S | DB207S | Unit |
|---|---|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum RMS Voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | V |
| Maximum DC Blocking Voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum Average Forward Rectified Current @ TA=25 | I(AV) | 2.0 | A | ||||||
| Peak Forward Surge Current 8.3ms Single Half Sine-Wave Super Imposed on Rated Load (JEDEC Method) | IFSM | 60 | A | ||||||
| Maximum Forward Voltage at 2.0A DC | VF | 1.1 | V | ||||||
| Maximum DC Reverse Current @ TJ=25 at Rated DC Blocking Voltage | IR | 500 | A | ||||||
| Maximum DC Reverse Current @ TJ=125 at Rated DC Blocking Voltage | IR | 10 | mA | ||||||
| I2t Rating for Fusing (t<8.3ms) | I2t | 15, 25, 40 | A2s | ||||||
| Typical Junction Capacitance Per Element (Note 1) | CJ | 15 | pF | ||||||
| Typical Thermal Resistance (Note 2) | RJA | 40 | /W | ||||||
| Operating Temperature Range | TJ | -55 to +150 | |||||||
| Storage Temperature Range | TSTG | -55 to +150 | |||||||
Note 1: Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
Note 2: Thermal resistance from junction to ambient mounted on P.C.B with 0.5*0.5"(13*13mm) copper pads.
Package Dimensions (DBS)
| Symbol | Dimension (inches) | Dimension (mm) |
|---|---|---|
| A | .255 | 6.5 |
| B | .335 | 8.5 |
| C | .096 | 2.45 |
| D | .406 | 10.3 |
| E | .013 | .33 |
| F | .060 | 1.5 |
| G | .205 | 5.2 |
| H | .343 | 8.7 |
| I | .047 | 1.20 |
| J | .245 | 6.2 |
| K | .307 | 7.8 |
| L | .089 | 2.25 |
| M | .391 | 10.0 |
| N | .003 | .08 |
| O | .040 | 1.0 |
| P | .197 | 5.0 |
| Q | .319 | 8.1 |
| R | .037 | 0.95 |
Marking Information
| Type Number | Marking |
|---|---|
| DB201S | DB201S |
| DB202S | DB202S |
| DB203S | DB203S |
| DB204S | DB204S |
| DB205S | DB205S |
| DB206S | DB206S |
| DB207S | DB207S |
| Halogen-Free Option | Add "-H" suffix |
Soldering Conditions (Reflow Soldering)
| Parameter | Value | Unit |
|---|---|---|
| Preheat Temperature (Tsmin to Tsmax) | 150 - 200 | C |
| Preheat Time (ts) | 60 - 120 | sec |
| Time maintained above Temperature (TL) | 217 | C |
| Time within 5C of actual Peak Temperature (tp) | 10 - 30 | sec |
| Peak Temperature (TP) | 255 (0/+5) | C |
| Ramp-up Rate (Tsmin to TP) | < 3 | C/sec |
| Ramp-down Rate | < 6 | C/sec |
Storage Environment: Temperature = 5 ~40 C, Humidity = 55%25%.
2011091105_FUXINSEMI-DB207S_C915621.pdf
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