FUXINSEMI DB207S miniature bridge rectifier with molded plastic technology and high voltage rating

Key Attributes
Model Number: DB207S
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
60A
Operating Junction Temperature Range:
-55℃~+150℃@(Tj)
Voltage - Forward(Vf@If):
1.1V@2A
Current - Rectified:
2A
Voltage - DC Reverse(Vr):
1kV
Mfr. Part #:
DB207S
Package:
DBS
Product Description

Product Overview

The Fuxinsemi DB201S through DB207S series are miniature, single-phase, surface-mount bridge rectifiers designed for applications requiring high surge overload capabilities. These devices offer reliable low-cost construction utilizing molded plastic technology and glass-passivated chip junctions, making them ideal for automated replacement and space-saving on printed circuit boards. They meet RoHS requirements and are suitable for a wide range of voltage ratings from 50V to 1000V.

Product Attributes

  • Brand: Fuxinsemi
  • Construction: Molded plastic technology
  • Chip Junctions: Glass passivated
  • Flame Retardant: UL94-V0 rated
  • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
  • Polarity: Marked on body
  • Mounting Position: Any
  • Certifications: RoHS compliant (lead-free parts)
  • Optional Suffix: "-H" indicates Halogen free part

Technical Specifications

Characteristic Symbol DB201S DB202S DB203S DB204S DB205S DB206S DB207S Unit
Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V
Maximum Average Forward Rectified Current @ TA=25 I(AV) 2.0 A
Peak Forward Surge Current 8.3ms Single Half Sine-Wave Super Imposed on Rated Load (JEDEC Method) IFSM 60 A
Maximum Forward Voltage at 2.0A DC VF 1.1 V
Maximum DC Reverse Current @ TJ=25 at Rated DC Blocking Voltage IR 500 A
Maximum DC Reverse Current @ TJ=125 at Rated DC Blocking Voltage IR 10 mA
I2t Rating for Fusing (t<8.3ms) I2t 15, 25, 40 A2s
Typical Junction Capacitance Per Element (Note 1) CJ 15 pF
Typical Thermal Resistance (Note 2) RJA 40 /W
Operating Temperature Range TJ -55 to +150
Storage Temperature Range TSTG -55 to +150

Note 1: Measured at 1.0MHz and applied reverse voltage of 4.0V DC.

Note 2: Thermal resistance from junction to ambient mounted on P.C.B with 0.5*0.5"(13*13mm) copper pads.

Package Dimensions (DBS)

Symbol Dimension (inches) Dimension (mm)
A .255 6.5
B .335 8.5
C .096 2.45
D .406 10.3
E .013 .33
F .060 1.5
G .205 5.2
H .343 8.7
I .047 1.20
J .245 6.2
K .307 7.8
L .089 2.25
M .391 10.0
N .003 .08
O .040 1.0
P .197 5.0
Q .319 8.1
R .037 0.95

Marking Information

Type Number Marking
DB201S DB201S
DB202S DB202S
DB203S DB203S
DB204S DB204S
DB205S DB205S
DB206S DB206S
DB207S DB207S
Halogen-Free Option Add "-H" suffix

Soldering Conditions (Reflow Soldering)

Parameter Value Unit
Preheat Temperature (Tsmin to Tsmax) 150 - 200 C
Preheat Time (ts) 60 - 120 sec
Time maintained above Temperature (TL) 217 C
Time within 5C of actual Peak Temperature (tp) 10 - 30 sec
Peak Temperature (TP) 255 (0/+5) C
Ramp-up Rate (Tsmin to TP) < 3 C/sec
Ramp-down Rate < 6 C/sec

Storage Environment: Temperature = 5 ~40 C, Humidity = 55%25%.


2011091105_FUXINSEMI-DB207S_C915621.pdf

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