Surface Mount Fast Recovery Rectifier FUXINSEMI RS1MA 1A 1000V SMA Package High Temperature Soldering
Product Overview
The RS1AA through RS1MA series are 1.0A Surface Mount Fast Recovery Rectifiers designed for high-efficiency applications. These rectifiers feature fast switching speeds, low reverse leakage, and built-in strain relief for automated placement. They are suitable for high forward surge current applications and are guaranteed for high-temperature soldering. Compliant with RoHS Directive 2011/65/EU, these rectifiers utilize a glass passivated chip junction and are housed in a JEDEC DO-214AC molded plastic body.
Product Attributes
- Brand: Fuxinsemi
- Package Type: SMA (DO-214AC)
- Material: JEDEC molded plastic body, Solder plated terminals
- Certifications: Underwriters Laboratory Flammability Classification 94V-0, RoHS Directive 2011/65/EU compliant
- Construction: Glass passivated chip junction
Technical Specifications
| Symbol | Parameter | RS1AA | RS1BA | RS1DA | RS1GA | RS1JA | RS1KA | RS1MA | Unit |
|---|---|---|---|---|---|---|---|---|---|
| VRRM | Repetitive peak reverse voltage | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| VRMS | RMS voltage | 35 | 70 | 140 | 280 | 420 | 560 | 700 | V |
| VR | Continuous reverse voltage | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| VF | Maximum forward voltage @ IF=1.0A | 1.30 | V | ||||||
| trr | Maximum Reverse recovery time (IF=0.5A, IR=1.0A, IRR=0.25A) | 50 | 50 | 50 | 50 | 100 | 200 | 250 | ns |
| IO | Forward rectified current | 1.0 | A | ||||||
| IFSM | Forward surge current (8.3ms single half sine-wave) | 30 | A | ||||||
| IR | Reverse current @ VR = VRRM x 0.8, TJ = 25C | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | A |
| RJA | Thermal resistance Junction to ambient | 75 | C/W | ||||||
| CJ | Diode junction capacitance (f=1MHz, VR=4V) | 15 | pF | ||||||
| TSTG | Storage temperature | -55 to +150 | C | ||||||
| TJ | Operating temperature | -55 to +150 | C | ||||||
Package Dimensions (SMA)
Dimensions in inches and (millimeters)
| Dimension | Min | Max |
|---|---|---|
| A | 0.157 (3.99) | 0.177 (4.50) |
| B | 0.096 (2.45) | 0.108 (2.75) |
| C | 0.060 (1.52) | 0.096 (2.42) |
| D (approx) | 0.030 (0.76) | 0.067 (1.70) |
| E (approx) | 0.006 (0.152) | 0.012 (0.305) |
| F (approx) | 0.078 (1.98) | 0.096 (2.42) |
| G (approx) | 0.051 (1.30) | 0.067 (1.70) |
| H (approx) | 0.188 (4.80) | 0.208 (5.28) |
Soldering Information
High temperature soldering guaranteed: 250 C / 10 seconds at terminals.
Suggested thermal profiles for soldering processes:
| Parameter | Value |
|---|---|
| Preheat Temperature (Tsmin to Tsmax) | 150 - 200 C |
| Preheat Time (ts) | 60 - 120 sec |
| Time maintained above TL (217 C) | 60 - 260 sec |
| Peak Temperature (TP) | 255 C / 5 sec |
| Ramp-down Rate | < 6 C/sec |
| Time 25 C to Peak Temperature | < 6 minutes |
| Average ramp-up rate (Tsmin to Tsmax) | < 3 C/sec |
Marking Code
| Type Number | Marking Code |
|---|---|
| RS1A | RS1A |
| RS1B | RS1B |
| RS1D | RS1D |
| RS1G | RS1G |
| RS1J | RS1J |
| RS1K | RS1K |
| RS1M | RS1M |
2108072030_FUXINSEMI-RS1MA_C2844163.pdf
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