Surface Mount Fast Recovery Rectifier FUXINSEMI RS1MA 1A 1000V SMA Package High Temperature Soldering

Key Attributes
Model Number: RS1MA
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
30A
Reverse Leakage Current (Ir):
5uA@1kV
Reverse Recovery Time (trr):
500ns
Operating Junction Temperature Range:
-55℃~+150℃@(Tj)
Voltage - DC Reverse (Vr) (Max):
1kV
Diode Configuration:
-
Voltage - Forward(Vf@If):
1.3V@1A
Current - Rectified:
1A
Mfr. Part #:
RS1MA
Package:
SMA(DO-214AC)
Product Description

Product Overview

The RS1AA through RS1MA series are 1.0A Surface Mount Fast Recovery Rectifiers designed for high-efficiency applications. These rectifiers feature fast switching speeds, low reverse leakage, and built-in strain relief for automated placement. They are suitable for high forward surge current applications and are guaranteed for high-temperature soldering. Compliant with RoHS Directive 2011/65/EU, these rectifiers utilize a glass passivated chip junction and are housed in a JEDEC DO-214AC molded plastic body.

Product Attributes

  • Brand: Fuxinsemi
  • Package Type: SMA (DO-214AC)
  • Material: JEDEC molded plastic body, Solder plated terminals
  • Certifications: Underwriters Laboratory Flammability Classification 94V-0, RoHS Directive 2011/65/EU compliant
  • Construction: Glass passivated chip junction

Technical Specifications

Symbol Parameter RS1AA RS1BA RS1DA RS1GA RS1JA RS1KA RS1MA Unit
VRRM Repetitive peak reverse voltage 50 100 200 400 600 800 1000 V
VRMS RMS voltage 35 70 140 280 420 560 700 V
VR Continuous reverse voltage 50 100 200 400 600 800 1000 V
VF Maximum forward voltage @ IF=1.0A 1.30 V
trr Maximum Reverse recovery time (IF=0.5A, IR=1.0A, IRR=0.25A) 50 50 50 50 100 200 250 ns
IO Forward rectified current 1.0 A
IFSM Forward surge current (8.3ms single half sine-wave) 30 A
IR Reverse current @ VR = VRRM x 0.8, TJ = 25C 5.0 5.0 5.0 5.0 5.0 5.0 5.0 A
RJA Thermal resistance Junction to ambient 75 C/W
CJ Diode junction capacitance (f=1MHz, VR=4V) 15 pF
TSTG Storage temperature -55 to +150 C
TJ Operating temperature -55 to +150 C

Package Dimensions (SMA)

Dimensions in inches and (millimeters)

Dimension Min Max
A 0.157 (3.99) 0.177 (4.50)
B 0.096 (2.45) 0.108 (2.75)
C 0.060 (1.52) 0.096 (2.42)
D (approx) 0.030 (0.76) 0.067 (1.70)
E (approx) 0.006 (0.152) 0.012 (0.305)
F (approx) 0.078 (1.98) 0.096 (2.42)
G (approx) 0.051 (1.30) 0.067 (1.70)
H (approx) 0.188 (4.80) 0.208 (5.28)

Soldering Information

High temperature soldering guaranteed: 250 C / 10 seconds at terminals.

Suggested thermal profiles for soldering processes:

Parameter Value
Preheat Temperature (Tsmin to Tsmax) 150 - 200 C
Preheat Time (ts) 60 - 120 sec
Time maintained above TL (217 C) 60 - 260 sec
Peak Temperature (TP) 255 C / 5 sec
Ramp-down Rate < 6 C/sec
Time 25 C to Peak Temperature < 6 minutes
Average ramp-up rate (Tsmin to Tsmax) < 3 C/sec

Marking Code

Type Number Marking Code
RS1A RS1A
RS1B RS1B
RS1D RS1D
RS1G RS1G
RS1J RS1J
RS1K RS1K
RS1M RS1M

2108072030_FUXINSEMI-RS1MA_C2844163.pdf

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