Metal Silicon Junction Surface Mount Rectifier FUXINSEMI SS56F with Built In Strain Relief and Loss
Product Overview
The SS56F is a Surface Mount Schottky Barrier Rectifier designed for high-efficiency applications. It features a metal silicon junction with majority carrier conduction, resulting in low power loss and high efficiency. Its JEDEC SMAF molded plastic body with solder-plated terminals ensures excellent solderability per MIL-STD-750, Method 2026. This rectifier is ideal for surface mounted applications, offering built-in strain relief for automated placement and high forward surge current capability. It is compliant with RoHS 2.0 and Halogen-free standards, making it suitable for various electronic designs requiring high temperature soldering performance up to 260C for 10 seconds.
Product Attributes
- Brand: Fuxin Semiconductor (implied by www.fuxinsemi.com)
- Model: SS56F
- Package Type: JEDEC SMAF
- Material: Metal silicon junction, majority carrier conduction
- Certifications: RoHS 2.0 Compliant, Halogen-free Compliant, Underwriters Laboratory Flammability Classification 94V-0
- Mounting Type: Surface Mount
- Polarity: Color band denotes cathode end
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Technical Specifications
| Parameter | Symbol | Value | Unit | Conditions |
|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM | 60 | V | |
| Maximum RMS Voltage | VRMS | 42 | V | |
| Maximum DC Blocking Voltage | VDC | 60 | V | |
| Maximum Average Forward Rectified Current | I(AV) | 5.0 | A | At TL (see fig.1) |
| Peak Forward Surge Current | IFSM | 120.0 | A | 8.3ms single half sine-wave superimposed on rated load |
| Maximum Instantaneous Forward Voltage | VF | 0.70 | V | At 5.0A |
| Maximum DC Reverse Current | IR | 0.5 | mA | TA=25C at rated DC blocking voltage |
| Maximum DC Reverse Current | IR | 10.0 | mA | TA=100C at rated DC blocking voltage |
| Typical Junction Capacitance | CJ | 360 | pF | Measured at 1MHz and applied reverse voltage of 4.0V D.C. (NOTE 1) |
| Typical Thermal Resistance | RJA | 60 | C/W | P.C.B. mounted with 2.0x2.0(5.0x5.0cm) copper pad areas (NOTE 2) |
| Operating Junction Temperature Range | TJ | -55 to +150 | C | |
| Storage Temperature Range | TSTG | -55 to +150 | C | |
| Package Dimensions (SMAF) | Length: 0.189-0.173 in. (4.80-4.40 mm), Width: 0.126-0.141 in. (3.20-3.60 mm), Height: 0.094-0.110 in. (2.40-2.80 mm) | |||
| Marking Code | DH |
2411271434_FUXINSEMI-SS56F_C5445746.pdf
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