Industrial surface mount device FUXINSEMI VB40100C-E3-FS optimized for soldering and thermal process management
Key Attributes
Model Number:
VB40100C-E3-FS
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
250A
Reverse Leakage Current (Ir):
100uA@40V
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - DC Reverse (Vr) (Max):
100V
Diode Configuration:
1 Pair Common Cathode
Voltage - Forward(Vf@If):
830mV@20A
Current - Rectified:
40A
Mfr. Part #:
VB40100C-E3-FS
Package:
TO-263(D2PAK)
Product Description
Product Overview
The VB40100C-E3-FS is a component designed for surface-mount device (SMD) applications, with specific recommendations for soldering processes. It is suitable for industrial environments, requiring adherence to defined thermal profiles for optimal performance and reliability.
Product Attributes
- Brand: Fuxin (implied by www.fuxinsemi.com)
Technical Specifications
| Specification | Value |
|---|---|
| Model | VB40100C-E3-FS |
| Soldering Condition (Reflow Soldering) | |
| Average ramp-up rate (Tsmin to Tsmax) | <3 ℃/sec |
| Preheat Temperature Min (Tsmin) | 150 ℃ |
| Preheat Temperature Max (Tsmax) | 200 ℃ |
| Preheat Time (tsmin to tsmax) | 60~120 sec |
| Ramp-up Rate (Tsmax to TL) | <3 ℃/sec |
| Temperature Maintained Above TL | 217 ℃ |
| Time Maintained Above TL (tL) | 60~260 sec |
| Peak Temperature (TP) | 255 ℃ |
| Time within 5 ℃ of Actual Peak Temperature (tP) | 10~30 sec |
| Ramp-down Rate | <6 ℃/sec |
| Time 25 ℃ to Peak Temperature | <6 minutes |
| Storage Environment | |
| Temperature | 5 ℃ ~40 ℃ |
| Humidity | 55%±25% |
2512291555_FUXINSEMI-VB40100C-E3-FS_C7503116.pdf
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