Surface Mount Rectifier FUXINSEMI SS54F with Molded Plastic Body and Automated Placement Suitability
Product Overview
The Fuxinsemi SS52F through SS520F series are Surface Mount Schottky Barrier Rectifiers designed for high-efficiency applications. Featuring a metal silicon junction with majority carrier conduction, these rectifiers offer low power loss and high forward surge current capability. Their SMAF molded plastic body with solder-plated terminals ensures suitability for automated placement and high-temperature soldering processes (up to 260C for 10 seconds). These devices are compliant with RoHS 2.0 and Halogen-free standards, making them ideal for various surface-mounted applications.
Product Attributes
- Brand: Fuxinsemi
- Package Type: SMAF (JEDEC)
- Material: Molded plastic body, Solder plated terminals
- Certifications: Underwriters Laboratory Flammability Classification 94V-0, RoHS 2.0 Compliant, Halogen-free Compliant
- Mounting: Surface Mount
- Polarity: Color band denotes cathode end
- Soldering: Solderable per MIL-STD-750, Method 2026
Technical Specifications
| Parameter | Symbol | SS52F | SS54F | SS545F | SS55F | SS56F | SS58F | SS510F | SS515F | SS520F | Units |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM | 20 | 40 | 45 | 50 | 60 | 80 | 100 | 150 | 200 | V |
| Maximum RMS Voltage | VRMS | 14 | 28 | 32 | 35 | 42 | 56 | 70 | 105 | 140 | V |
| Maximum DC Blocking Voltage | VDC | 20 | 40 | 45 | 50 | 60 | 80 | 100 | 150 | 200 | V |
| Maximum Average Forward Rectified Current (at TL, Fig. 1) | I(AV) | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | A |
| Peak Forward Surge Current (8.3ms single half sine-wave) | IFSM | 120.0 | 120.0 | 120.0 | 120.0 | 120.0 | 120.0 | 120.0 | 120.0 | 120.0 | A |
| Maximum Instantaneous Forward Voltage (at 5.0A) | VF | 0.55 | 0.55 | 0.55 | 0.55 | 0.55 | 0.55 | 0.55 | 0.95 | 0.95 | V |
| Maximum DC Reverse Current (at TA=25C, rated DC blocking voltage) | IR | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | mA |
| Maximum DC Reverse Current (at TA=100C, rated DC blocking voltage) | IR | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | mA |
| Typical Junction Capacitance (Note 1) | CJ | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | pF |
| Typical Thermal Resistance (Note 2) | RJA | 60 | 60 | 60 | 60 | 60 | 60 | 60 | 60 | 60 | C/W |
| Operating Junction Temperature Range | TJ | -55 to +150 | -55 to +150 | -55 to +150 | -55 to +150 | -55 to +150 | -55 to +150 | -55 to +150 | -55 to +150 | -55 to +150 | C |
| Storage Temperature Range | TSTG | -55 to +125 | -55 to +125 | -55 to +125 | -55 to +125 | -55 to +125 | -55 to +125 | -55 to +125 | -55 to +125 | -55 to +125 | C |
Package Dimensions (SMAF)
| Dimension | Inches | (Millimeters) |
|---|---|---|
| Length | 0.189 - 0.173 | (4.80 - 4.40) |
| Width | 0.126 - 0.141 | (3.20 - 3.60) |
| Height | 0.094 - 0.110 | (2.40 - 2.80) |
| Terminal Width | 0.049 - 0.065 | (1.25 - 1.65) |
| Terminal Length | 0.047 - 0.053 | (1.20 - 1.35) |
| Lead Thickness | 0.004 - 0.012 | (0.10 - 0.30) |
Marking Code
| Model | Marking Code |
|---|---|
| SS52F | SS52 |
| SS54F | SS54 |
| SS545F | SS545 |
| SS55F | SS55 |
| SS56F | SS56 |
| SS58F | SS58 |
| SS510F | SS510 |
| SS515F | SS515 |
| SS520F | SS520 |
Soldering Profile
Reflow Soldering Condition:
- Average ramp-up rate (Tsmin to Tsmax): < 3C/sec
- Preheat:
- Temperature (Tsmin): 150C
- Temperature (Tsmax): 200C
- Time (tsmin to tsmax): 60-120 sec
- Ramp-up Rate (Tsmax to Tp): < 3C/sec
- Time maintained above:
- Temperature (TL): 217C
- Time (tL): 60-260 sec
- Peak Temperature (Tp): 255C (0/+5C)
- Time within 5C of actual peak temperature (tp): 10-30 sec
- Ramp-down Rate: < 6C/sec
- Time 25C to Peak Temperature: < 6 minutes
Storage Environment: Temperature = 5~40C, Humidity = 55%25%
2011091106_FUXINSEMI-SS54F_C915624.pdf
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