Surface Mount Rectifier FUXINSEMI SS54F with Molded Plastic Body and Automated Placement Suitability

Key Attributes
Model Number: SS54F
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
120A
Reverse Leakage Current (Ir):
-
Voltage - DC Reverse (Vr) (Max):
40V
Diode Configuration:
Independent
Voltage - Forward(Vf@If):
550mV@5A
Current - Rectified:
5A
Mfr. Part #:
SS54F
Package:
SMAF(DO-214AD)
Product Description

Product Overview

The Fuxinsemi SS52F through SS520F series are Surface Mount Schottky Barrier Rectifiers designed for high-efficiency applications. Featuring a metal silicon junction with majority carrier conduction, these rectifiers offer low power loss and high forward surge current capability. Their SMAF molded plastic body with solder-plated terminals ensures suitability for automated placement and high-temperature soldering processes (up to 260C for 10 seconds). These devices are compliant with RoHS 2.0 and Halogen-free standards, making them ideal for various surface-mounted applications.

Product Attributes

  • Brand: Fuxinsemi
  • Package Type: SMAF (JEDEC)
  • Material: Molded plastic body, Solder plated terminals
  • Certifications: Underwriters Laboratory Flammability Classification 94V-0, RoHS 2.0 Compliant, Halogen-free Compliant
  • Mounting: Surface Mount
  • Polarity: Color band denotes cathode end
  • Soldering: Solderable per MIL-STD-750, Method 2026

Technical Specifications

Parameter Symbol SS52F SS54F SS545F SS55F SS56F SS58F SS510F SS515F SS520F Units
Maximum Repetitive Peak Reverse Voltage VRRM 20 40 45 50 60 80 100 150 200 V
Maximum RMS Voltage VRMS 14 28 32 35 42 56 70 105 140 V
Maximum DC Blocking Voltage VDC 20 40 45 50 60 80 100 150 200 V
Maximum Average Forward Rectified Current (at TL, Fig. 1) I(AV) 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 A
Peak Forward Surge Current (8.3ms single half sine-wave) IFSM 120.0 120.0 120.0 120.0 120.0 120.0 120.0 120.0 120.0 A
Maximum Instantaneous Forward Voltage (at 5.0A) VF 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.95 0.95 V
Maximum DC Reverse Current (at TA=25C, rated DC blocking voltage) IR 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 mA
Maximum DC Reverse Current (at TA=100C, rated DC blocking voltage) IR 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 mA
Typical Junction Capacitance (Note 1) CJ 30 30 30 30 30 30 30 30 30 pF
Typical Thermal Resistance (Note 2) RJA 60 60 60 60 60 60 60 60 60 C/W
Operating Junction Temperature Range TJ -55 to +150 -55 to +150 -55 to +150 -55 to +150 -55 to +150 -55 to +150 -55 to +150 -55 to +150 -55 to +150 C
Storage Temperature Range TSTG -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 C

Package Dimensions (SMAF)

Dimension Inches (Millimeters)
Length 0.189 - 0.173 (4.80 - 4.40)
Width 0.126 - 0.141 (3.20 - 3.60)
Height 0.094 - 0.110 (2.40 - 2.80)
Terminal Width 0.049 - 0.065 (1.25 - 1.65)
Terminal Length 0.047 - 0.053 (1.20 - 1.35)
Lead Thickness 0.004 - 0.012 (0.10 - 0.30)

Marking Code

Model Marking Code
SS52F SS52
SS54F SS54
SS545F SS545
SS55F SS55
SS56F SS56
SS58F SS58
SS510F SS510
SS515F SS515
SS520F SS520

Soldering Profile

Reflow Soldering Condition:

  • Average ramp-up rate (Tsmin to Tsmax): < 3C/sec
  • Preheat:
    • Temperature (Tsmin): 150C
    • Temperature (Tsmax): 200C
    • Time (tsmin to tsmax): 60-120 sec
  • Ramp-up Rate (Tsmax to Tp): < 3C/sec
  • Time maintained above:
    • Temperature (TL): 217C
    • Time (tL): 60-260 sec
  • Peak Temperature (Tp): 255C (0/+5C)
  • Time within 5C of actual peak temperature (tp): 10-30 sec
  • Ramp-down Rate: < 6C/sec
  • Time 25C to Peak Temperature: < 6 minutes

Storage Environment: Temperature = 5~40C, Humidity = 55%25%


2011091106_FUXINSEMI-SS54F_C915624.pdf

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