High Voltage Silicon N Channel MOSFET GL GL5N50A4 with 30V Gate to Source Voltage and TO 252 Package

Key Attributes
Model Number: GL5N50A4
Product Custom Attributes
Drain To Source Voltage:
500V
Current - Continuous Drain(Id):
5A
Operating Temperature -:
-55℃~+150℃
RDS(on):
1.5Ω@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
3.5pF
Number:
1 N-channel
Output Capacitance(Coss):
53pF
Input Capacitance(Ciss):
610pF
Pd - Power Dissipation:
75W
Gate Charge(Qg):
14.5nC@10V
Mfr. Part #:
GL5N50A4
Package:
TO-252
Product Description

Product Overview

The GL5N50A4 is a silicon N-channel Enhanced VDMOSFET manufactured using self-aligned planar technology. This design minimizes conduction losses, enhances switching performance, and improves avalanche energy. It is suitable for various power switching circuits, contributing to system miniaturization and increased efficiency. The device is packaged in a RoHS-compliant TO-252 package.

Product Attributes

  • Brand: GL
  • Material: Silicon N-Channel Power MOSFET
  • Package: TO-252
  • Certification: RoHS standard

Technical Specifications

Symbol Parameter Test Conditions Rating Units
VDSS Drain-to-Source Voltage 500 V
ID Continuous Drain Current (Tc=25) 5 A
ID Continuous Drain Current (TC=100 C) 3.1 A
IDMa1 Pulsed Drain Current 20 A
VGS Gate-to-Source Voltage 30 V
EAsa2 Single Pulse Avalanche Energy 260 mJ
dv/dta3 Peak Diode Recovery dv/dt 5.0 V/ns
PD Power Dissipation 75 W
Derating Factor above 25C 0.6 W/
TJ, Tstg Operating Junction and Storage Temperature Range 55 to 150
TL Maximum Temperature for Soldering 300
RJC Thermal Resistance, Junction-to-Case 1.67 / W
RJA Thermal Resistance, Junction-to-Ambient 100 / W
VDSS Drain to Source Breakdown Voltage VGS=0V,ID=250A 500 V
BVDSS/TJ Bvdss Temperature Coefficient ID=250uA,Reference25 0.6 V/
IDSS Drain to Source Leakage Current VDS=500V, VGS=0V,Ta=25 1.0 A
IDSS Drain to Source Leakage Current VDS=400V, VGS=0V,Ta=125 100 A
IGSS(F) Gate to Source Forward Leakage VGS=+30V 100 nA
IGSS(R) Gate to Source Reverse Leakage VGS=-30V -100 nA
RDS(ON) Drain-to-Source On-Resistance VGS=10V,ID=2.5A 1.2
RDS(ON) Drain-to-Source On-Resistance VGS=10V,ID=2.5A 1.5
VGS(TH) Gate Threshold Voltage VDS=VGS,ID=250A 2.0 V
VGS(TH) Gate Threshold Voltage VDS=VGS,ID=250A 4.0 V
gfs Forward Transconductance VDS=15V,ID=2.5A 4.0 S
Ciss Input Capacitance VGS=0V VDS=25V f=1.0MHz 610 pF
Coss Output Capacitance 53 pF
Crss Reverse Transfer Capacitance 3.5 pF
td(ON) Turn-on Delay Time ID=5A,VDD=250V VGS=10V,Rg=10 14 ns
tr Rise Time 16 ns
td(OFF) Turn-Off Delay Time 32 ns
tf Fall Time 11 ns
Qg Total Gate Charge ID=5A,VDD=250V VGS=10V 14.5 nC
Qgs Gate to Source Charge 3 nC
Qgd Gate to Drain (Miller)Charge 6.5 nC
ISD Continuous Source Current (Body Diode) 5 A
ISM Maximum Pulsed Current (Body Diode) 20 A
VSD Diode Forward Voltage IS=5A,VGS=0V 1.5 V
trr Reverse Recovery Time IS=5A,Tj=25 dIF/dt=100A/s,VGS=0V 310 ns
Qrr Reverse Recovery Charge 1300 nC

2410121611_GL-GL5N50A4_C2980990.pdf

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