Axial Leaded Epoxy Rectifier FUXINSEMI SF36G with Solderable Leads and Halogen Free RoHS Compliant Option
Product Overview
The SF31G through SF38G series are 3.0A Axial Super Fast Rectifiers designed for through-hole mounting. These leaded epoxy devices feature a glass passivated chip junction structure, providing high current capability and high surge capability. They are ideal for switching mode applications due to their superfast recovery time. The rectifiers are housed in a DO-201AD package with UL94-V0 rated flame retardant properties and axial leads solderable per MIL-STD-202, Method 208. Available in both standard and Halogen-free (suffix "-H") options, these rectifiers meet RoHS requirements.
Product Attributes
- Brand: Fuxin Semiconductor (implied by domain www.fuxinsemi.com)
- Package Type: DO-201AD
- Construction: Leaded Epoxy
- Chip Structure: Glass Passivated
- Flame Retardant Rating: UL94-V0
- Lead Material: Solderable per MIL-STD-202, Method 208
- Polarity Indicator: Color band denotes cathode end
- Mounting Position: Any
- Certifications: RoHS compliant (lead-free parts meet RoHS requirements)
- Halogen-Free Option: Available (Suffix "-H")
Technical Specifications
| Symbol | Description | SF31G | SF32G | SF33G | SF34G | SF35G | SF36G | SF37G | SF38G | Units |
|---|---|---|---|---|---|---|---|---|---|---|
| VRRM | Maximum repetitive peak reverse voltage | 50 | 100 | 150 | 200 | 300 | 400 | 500 | 600 | V |
| VRMS | Maximum RMS voltage | 35 | 70 | 105 | 140 | 210 | 280 | 350 | 420 | V |
| VDC | Maximum DC blocking voltage | 50 | 100 | 150 | 200 | 300 | 400 | 500 | 600 | V |
| I(AV) | Maximum average forward rectified current (0.375" lead length at TA=55C) | 3.0 | A | |||||||
| IFSM | Peak forward surge current (8.3ms single half sine-wave) | 125 | A | |||||||
| VF | Maximum instantaneous forward voltage at 3.0A | 1.25 | V | |||||||
| IR | Maximum DC reverse current (TA=25C at rated DC blocking voltage) | 10.0 | A | |||||||
| IR | Maximum DC reverse current (TA=100C at rated DC blocking voltage) | 100.0 | A | |||||||
| trr | Maximum reverse recovery time (IF=0.5A, IR=1.0A, Irr=0.25A) | 35 | ns | |||||||
| RJA | Typical thermal resistance (0.375" lead length, P.C.B. mounted) | 20.0 | C/W | |||||||
| CJ | Typical junction capacitance (Measured at 1MHz, VR=4.0V D.C.) | 50.0 | pF | |||||||
| TJ,TSTG | Operating junction and storage temperature range | -55 to +150 | C | |||||||
Note 1: Reverse recovery condition IF=0.5A, IR=1.0A, Irr=0.25A.
Note 2: Measured at 1MHz and applied reverse voltage of 4.0V D.C.
Note 3: Thermal resistance from junction to ambient at 0.375"(9.5mm) lead length, P.C.B. mounted.
Mechanical Data:
Case: Molded plastic, DO-201AD
Lead Mounting Position: Any
Dimensions: 0.94(24.0) MIN. length, 0.220(5.6) - 0.197(5.0) DIA. body, 0.051(1.30) - 0.043(1.10) DIA. leads.
Soldering Profile:
Lead-free temperature profile wave-soldering: Preheat Max gradient 2C/s, Peak Max well time 5s, Cool Down Max gradient -4C/s. Peak soldering temperature not to exceed 260C.
2012200038_FUXINSEMI-SF36G_C967625.pdf
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