Power Switching P Channel MOSFET GL GL9Z24A8 Featuring Low Rdson and RoHS Compliant TO 220AB Package

Key Attributes
Model Number: GL9Z24A8
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
15A
RDS(on):
70mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
1V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
110pF
Output Capacitance(Coss):
140pF
Input Capacitance(Ciss):
1.45nF
Pd - Power Dissipation:
45W
Gate Charge(Qg):
25nC@10V
Mfr. Part #:
GL9Z24A8
Package:
TO-220AB-3
Product Description

Product Overview

The GL9Z24A8 is a P-Channel Power MOSFET from Wuxi Guang Lei Electronic Technology Co., LTD, utilizing advanced trench technology for excellent RDS(ON) and low gate charge. Designed for a wide variety of applications, it offers fast switching, low gate charge, low Rdson, low reverse transfer capacitances, and 100% single pulse avalanche energy testing. This MOSFET is suitable for power switching applications, hard switched and high frequency circuits, and uninterruptible power supplies. It is supplied in a RoHS-compliant TO-220AB package.

Product Attributes

  • Brand: GL Silicon
  • Manufacturer: Wuxi Guang Lei Electronic Technology Co., LTD
  • Product Type: P-Channel Power MOSFET
  • Package Type: TO-220AB
  • Certifications: RoHS compliant

Technical Specifications

Symbol Parameter Test Conditions Rating Units
Absolute Maximum Ratings (Tc= 25 unless otherwise specified)
VDSS Drain-to-Source Voltage -60 V
ID Continuous Drain Current -15 A
ID Continuous Drain Current TC = 100 C -10.5 A
IDMa1 Pulsed Drain Current -60 A
VGS Gate-to-Source Voltage 20 V
dv/dta3 Peak Diode Recovery dv/dt 5.0 V/ns
PD Power Dissipation 45 W
TJ, Tstg Operating Junction and Storage Temperature Range -55 to 150
TL Maximum Temperature for Soldering 300
VDSS -60 V
ID -15 A
PD 45 W
RDS(ON) 55 m
Electrical Characteristics (Tc=25 unless otherwise specified)
OFF Characteristics
VDSS Drain to Source Breakdown Voltage VGS=0V, ID=-250A -60 V
BVDSS/TJ Bvdss Temperature Coefficient ID=-250uA, Reference 25 0.15 V/
IDSS Drain to Source Leakage Current VDS=-60,VGS= 0V,Ta=25 -1 A
IDSS VDS=-48V,VGS= 0V,Ta=125 -250 A
IGSS(F) Gate to Source Forward Leakage VGS=+20V 1 A
IGSS(R) Gate to Source Reverse Leakage VGS=-20V -1 A
ON Characteristics
RDS(ON) Drain-to-Source On-Resistance VGS=-10V,ID=-7.5.0A 55 - 70 m
VGS(TH) Gate Threshold Voltage VDS=VGS,ID=-250A -3.0 -1.6 -1.0 V
Dynamic Characteristics
gfs Forward Transconductance VDS=-10V,ID=-7.5A 14 S
Ciss Input Capacitance VGS=0V,VDS=-25V f=1.0MHz 1450 pF
Coss Output Capacitance 140 pF
Crss Reverse Transfer Capacitance 110 pF
Resistive Switching Characteristics
td(ON) Turn-on Delay Time RL=-1.5 ,VDD=-30V VGS=-10V,RG=1.5 7 ns
tr Rise Time 8 ns
td(OFF) Turn-Off Delay Time 65 ns
tf Fall Time 30 ns
Qg Total Gate Charge ID=-7.5A,VDD =-30V VGS=-10V 25 nC
Qgs Gate to Source Charge 4.5 nC
Qgd Gate to Drain (Miller)Charge 7 nC
Source-Drain Diode Characteristics
IS Continuous Source Current (Body Diode) -15 A
ISM Maximum Pulsed Current (Body Diode) -60 A
VSD Diode Forward Voltage IS=-15A,VGS=0V 1.5 V
trr Reverse Recovery Time IS=-15A,Tj=25 dIF/dt=100A/us,VGS=0V 45 ns
Qrr Reverse Recovery Charge Pulse width tp380s,2% 88 nC
RJC Junction-to-Case 2.8 /W
RJA Junction-to-Ambient 62 /W

2108251430_GL-GL9Z24A8_C2886423.pdf

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