DC DC Converter P Channel MOSFET High Diode 2309 with Low On Resistance and Trench Technology Design

Key Attributes
Model Number: 2309
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
1.6A
Operating Temperature -:
-55℃~+150℃
RDS(on):
160mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
26pF
Number:
1 P-Channel
Output Capacitance(Coss):
32pF
Input Capacitance(Ciss):
350pF
Pd - Power Dissipation:
700mW
Gate Charge(Qg):
7nC@10V
Mfr. Part #:
2309
Package:
SOT-23
Product Description

Product Overview

This P-Channel MOSFET, designed with Trench Technology, offers low on-resistance (RDS(on)) and low gate charge, making it suitable for DC/DC converters and power management applications. It provides a V(BR)DSS of -60V and a continuous drain current (ID) of -1.6A at 25.

Product Attributes

  • Brand: HIGH DIODE SEMICONDUCTOR
  • Package Type: SOT-23
  • Technology: Trench Technology Power MOSFET
  • Channel Type: P-Channel

Technical Specifications

Parameter Symbol Test Condition Min Type Max Unit
Absolute Maximum Ratings (TA = 25 unless otherwise noted)
Drain - Source Voltage VDS -60 V
Gate - Source Voltage VGS ±20 V
Continuous Drain Current1,5 ID TA = 25 -1.6 A
Pulsed Drain Current2 IDM -8.0 A
Power Dissipation5 PD TA = 25 0.7 W
Thermal Resistance from Junction to Ambient5 RJA 180 /W
Junction Temperature TJ 150
Storage Temperature TSTG -55 +150
Electrical Characteristics (TA=25 unless otherwise noted)
Drain - Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = -250µA -60 V
Zero Gate Voltage Drain Current IDSS VDS = -48V, VGS = 0V -1 µA
Gate - Body Leakage Current IGSS VGS = ±20V, VDS = 0V ±100 nA
Gate Threshold Voltage VGS(th) VDS = VGS, ID = -250µA -1 -1.8 -3.0 V
Drain-source On-resistance RDS(on) VGS = -10V, ID = -1.5A 120 160
VGS = -4.5V, ID = -1.0A 160 240
Forward Transconductance gFS VDS = -10V, ID = -1.5A 2 S
Input Capacitance Ciss VDS = -30V,VGS = 0V, f = 1MHz 350 pF
Output Capacitance Coss VDS = -30V,VGS = 0V, f = 1MHz 32 pF
Reverse Transfer Capacitance Crss VDS = -30V,VGS = 0V, f = 1MHz 26 pF
Gate Resistance Rg VDS = 0V, VGS = 0V, f = 1MHz 5 Ω
Total Gate Charge Qg VDS = -30V, VGS = -10V, ID = -2.0A 7 nC
Gate-source Charge Qgs VDS = -30V, VGS = -10V, ID = -2.0A 2.2 nC
Gate-drain Charge Qgd VDS = -30V, VGS = -10V, ID = -2.0A 3 nC
Turn-on Delay Time td(on) VDD = -30V, VGS = -10V, RL = 15Ω, RG = 3Ω 7 ns
Turn-on Rise Time tr VDD = -30V, VGS = -10V, RL = 15Ω, RG = 3Ω 6 ns
Turn-off Delay Time td(off) VDD = -30V, VGS = -10V, RL = 15Ω, RG = 3Ω 12 ns
Turn-off Fall Time tf VDD = -30V, VGS = -10V, RL = 15Ω, RG = 3Ω 7 ns
Diode Forward Voltage VSD VGS = 0V, IS = -2.0A -1.2 V
Package Outline Dimensions (SOT-23)
Symbol Min (mm) Max (mm) Min (in) Max (in)
A 0.900 1.150 0.035 0.045
A1 0.000 0.100 0.000 0.004
A2 0.900 1.050 0.035 0.041
b 0.300 0.500 0.012 0.020
c 0.080 0.150 0.003 0.006
D 2.800 3.000 0.110 0.118
E 1.200 1.400 0.047 0.055
E1 2.250 2.550 0.089 0.100
b 0.300 0.500 0.012 0.020
e 0.950 TYP 0.037 TYP
e1 1.800 2.000 0.071 0.079
L 0.550 REF 0.022 REF
L1 0.300 0.500 0.012 0.020
θ

2409272232_High-Diode-2309_C22458617.pdf

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