P channel MOSFET HUASHUO HSU3119 featuring fast switching and operation for power management systems

Key Attributes
Model Number: HSU3119
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
130A
Operating Temperature -:
-55℃~+150℃
RDS(on):
3mΩ@10V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
1.21nF@15V
Number:
1 P-Channel
Input Capacitance(Ciss):
12.7nF@15V
Pd - Power Dissipation:
135W
Gate Charge(Qg):
210nC@10V
Mfr. Part #:
HSU3119
Package:
TO-252-2L
Product Description

Product Overview

The HSU3119 is a P-channel MOSFET featuring high cell density trench technology, designed for excellent RDS(ON) and gate charge, making it suitable for synchronous buck converter applications. This device offers fast switching capabilities and meets RoHS and Green Product requirements, with 100% EAS guaranteed and full function reliability approved. Key advantages include super low gate charge, excellent CdV/dt effect decline, and advanced high cell density trench technology.

Product Attributes

  • Brand: HS-Semi
  • Product Line: P-Ch 30V Fast Switching MOSFETs
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed, Full Function Reliability Approved

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage -30 V
VGS Gate-Source Voltage 20 20 V
ID@TC=25 Continuous Drain Current, VGS @ -10V1,6 -130 A
ID@TC=100 Continuous Drain Current, VGS @ -10V1,6 -81 A
IDM Pulsed Drain Current2 -510 A
EAS Single Pulse Avalanche Energy3 1050 mJ
IAS Avalanche Current -75 A
PD@TC=25 Total Power Dissipation4 135 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient 1(t10S) 20 /W
RJA Thermal Resistance Junction-ambient 1(Steady State) 60 /W
RJC Thermal Resistance Junction-case 1 1.8 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -30 V
RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V , ID=-30A 3.0 m
VGS=-4.5V , ID=-20A 4.2 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -1.0 -2.5 V
IDSS Drain-Source Leakage Current VDS=-30V , VGS=0V , TJ=25 -1 uA
VDS=-30V , VGS=0V , TJ=125 -100 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V 100 nA
Rg Gate resistance VDS=0V , VGS=0V , f=1MHz 1.8
Qg Total Gate Charge (-10V) VDS=-15V , VGS=-10V , ID=-20A 210 nC
Qgs Gate-Source Charge 2.2 nC
Qgd Gate-Drain Charge 3.3 nC
td(on) Turn-On Delay Time VDD=-15V , VGS=-10V , RG=3, ID=-10A 17 ns
tr Rise Time 6 ns
td(off) Turn-Off Delay Time 21 ns
tf Fall Time 39 ns
Ciss Input Capacitance VDS=-15V , VGS=0V , f=1MHz 12700 pF
Coss Output Capacitance 1380 pF
Crss Reverse Transfer Capacitance 1210 pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current -130 A
VSD Diode Forward Voltage2 VGS=0V , IS=-20A , TJ=25 -1.2 V
trr Reverse Recovery Time IF=-20A , di/dt=100A/s , TJ=25 37 nS
Qrr Reverse Recovery Charge 30 nC

2410122017_HUASHUO-HSU3119_C28314522.pdf
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