switching P channel MOSFET Hangzhou Silan Microelectronics SVD9Z24NT for power amplifier applications

Key Attributes
Model Number: SVD9Z24NT
Product Custom Attributes
Drain To Source Voltage:
55V
Current - Continuous Drain(Id):
12A
Operating Temperature -:
-55℃~+175℃
RDS(on):
175mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
30pF
Number:
1 P-Channel
Output Capacitance(Coss):
135pF
Input Capacitance(Ciss):
447pF
Pd - Power Dissipation:
45W
Gate Charge(Qg):
13nC@10V
Mfr. Part #:
SVD9Z24NT
Package:
TO-220
Product Description

Product Overview

The SVD9Z24NT is a P-channel enhancement mode power MOS field-effect transistor manufactured using Silan's planar VDMOS process. Engineered for minimal on-state resistance and superior switching performance, it excels in high-energy pulse handling in avalanche and commutation modes. This device is ideal for push-pull amplifiers, high-side switching circuits, and CMOS power amplifiers.

Product Attributes

  • Brand: Silan Microelectronics
  • Origin: HANGZHOU SILAN MICROELECTRONICS CO.,LTD
  • Hazardous Substance Control: Pb free
  • Packing Type: Tube

Technical Specifications

CharacteristicsSymbolRatingsUnitTest ConditionsMin.Typ.Max.
ABSOLUTE MAXIMUM RATINGS
Drain-Source VoltageVDS-55V(TC=25C unless otherwise noted)
Gate-Source VoltageVGS20V(TC=25C unless otherwise noted)
Drain Current TC=25CID-12A(TC=25C unless otherwise noted)
Drain Current TC=100CID-8.5A(TC=25C unless otherwise noted)
Drain Current PulsedIDM-48A(TC=25C unless otherwise noted)
Power Dissipation(TC=25C)PD45W(TC=25C unless otherwise noted)
Derate above 25C0.36W/C(TC=25C unless otherwise noted)
Single Pulsed Avalanche Energy (Note 1)EAS106mJ(TC=25C unless otherwise noted)
Operation Junction Temperature RangeTJ-55+175C(TC=25C unless otherwise noted)
Storage Temperature RangeTstg-55+175C(TC=25C unless otherwise noted)
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-CaseRJC2.78C/W
Thermal Resistance, Junction-to-AmbientRJA62.5C/W
ELECTRICAL CHARACTERISTICS
Drain -Source Breakdown VoltageBVDSS-55VVGS=0V, ID=-250A
Drain-Source Leakage CurrentIDSS-25AVDS=-55V, VGS=0V
Gate-Source Leakage CurrentIGSS100nAVGS=20V, VDS=0V
Gate Threshold VoltageVGS(th)-2.0VVGS=VDS, ID=-250A-4.0
Static Drain-Source On State ResistanceRDS(on)175mVGS=-10V, ID=-7.2A
Input CapacitanceCiss447pFVDS=-25V, VGS=0V, f=1.0MHz
Output CapacitanceCoss135pFVDS=-25V, VGS=0V, f=1.0MHz
Reverse Transfer CapacitanceCrss30pFVDS=-25V, VGS=0V, f=1.0MHz
Turn-on Delay Timetd(on)8.47nsVDD=-28V,VGS=-10V, RG=24,ID=-7.2A (Note 2,3)
Turn-on Rise Timetr41.2nsVDD=-28V,VGS=-10V, RG=24,ID=-7.2A (Note 2,3)
Turn-off Delay Timetd(off)30nsVDD=-28V,VGS=-10V, RG=24,ID=-7.2A (Note 2,3)
Turn-off Fall Timetf20.2nsVDD=-28V,VGS=-10V, RG=24,ID=-7.2A (Note 2,3)
Total Gate ChargeQg13nCVDS=-44V,VGS=-10V, ID=-7.2A (Note 2,3)
Gate-Source ChargeQgs3.25nCVDS=-44V,VGS=-10V, ID=-7.2A (Note 2,3)
Gate-Drain ChargeQg5.3nCVDS=-44V,VGS=-10V, ID=-7.2A (Note 2,3)
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Continuous Source CurrentIS-12A
Pulsed Source CurrentISM-48A
Diode Forward VoltageVSD-1.6VIS=-7.2A, VGS=0V
Reverse Recovery TimeTrr50.5nsIS=-7.2A, VGS=0V, dIF/dt=100A/s (Note 2)
Reverse Recovery ChargeQrr0.11CIS=-7.2A, VGS=0V, dIF/dt=100A/s (Note 2)

2501091110_Hangzhou-Silan-Microelectronics-SVD9Z24NT_C2761788.pdf

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