High Cell Density Trench N Channel MOSFET HUASHUO HSL10N06 Suitable for Synchronous Buck Converters

Key Attributes
Model Number: HSL10N06
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
10A
RDS(on):
36mΩ@10V,4A
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
1V
Reverse Transfer Capacitance (Crss@Vds):
46pF@15V
Number:
1 N-channel
Input Capacitance(Ciss):
1.227nF@15V
Pd - Power Dissipation:
31W
Gate Charge(Qg):
25nC@10V
Mfr. Part #:
HSL10N06
Package:
SOT-223
Product Description

Product Overview

The HSL10N06 is a high cell density trenched N-channel MOSFET designed for fast switching applications, particularly in synchronous buck converter circuits. It offers excellent RDS(ON) and gate charge characteristics, meeting RoHS and Green Product requirements. This MOSFET is 100% EAS guaranteed with full function reliability approval, making it suitable for demanding industrial applications.

Product Attributes

  • Brand: HSL
  • Type: N-Channel MOSFET
  • Technology: Trench
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage 60 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1 10 A
ID@TC=70 Continuous Drain Current, VGS @ 10V1 8 A
IDM Pulsed Drain Current2 30 A
IAS Avalanche Current 13 A
PD@TC=25 Total Power Dissipation4 31 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient --- 60 /W
RJC Thermal Resistance Junction-Case1 --- 4 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 60 --- --- V
BVDSS/TJ BVDSS Temperature Coefficient Reference to 25 , ID=1mA --- 0.044 --- V/
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=4A --- 28 36 m
VGS=4.5V , ID=2A --- 38 45 V
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.0 --- 2.5 V
VGS(th) VGS(th) Temperature Coefficient --- -4.8 --- mV/
IDSS Drain-Source Leakage Current VDS=48V , VGS=0V , TJ=25 --- --- 1 uA
VDS=48V , VGS=0V , TJ=55 --- --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- --- 100 nA
gfs Forward Transconductance VDS=5V , ID=5A --- 25.3 --- S
Qg Total Gate Charge (10V) VDS=48V , VGS=10V , ID=5A --- 25 --- nC
Qgs Gate-Source Charge --- 2.9 ---
Qgd Gate-Drain Charge --- 5 ---
td(on) Turn-On Delay Time VDD=30V , VGS=10V , RG=3.3
ID=5A
--- 2.8 --- ns
tr Rise Time --- 17 ---
td(off) Turn-Off Delay Time --- 21.2 ---
tf Fall Time --- 5.6 ---
Ciss Input Capacitance VDS=15V , VGS=0V , f=1MHz --- 1227 --- pF
Coss Output Capacitance --- 69 ---
Crss Reverse Transfer Capacitance --- 46 ---
Diode Characteristics
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- --- 1.2 V
trr Reverse Recovery Time IF=15A , dI/dt=100A/s , TJ=25 --- 12.2 --- nS
Qrr Reverse Recovery Charge --- 6.7 --- nC
Ordering Information
Part Number Package code Packaging
HSL10N06 SOT-223 3000/Tape&Reel

Notes:
1. Data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. Data tested by pulsed, pulse width 300s, duty cycle 2%.
3. EAS data shows Max. rating. Test condition: VDD=48V, VGS=10V, L=0.1mH, IAS=13A.
4. Power dissipation is limited by 150 junction temperature.
5. Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.


2410121531_HUASHUO-HSL10N06_C5128191.pdf
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