N Channel Power MOSFET Hangzhou Silan Microelectronics SVF20NE50PN for AC DC and DC DC Power Applications
Product Overview
The SVF20NE50PN is an N-channel enhancement mode power MOS field effect transistor utilizing Silan's proprietary F-CellTM structure VDMOS technology. It features an improved planar stripe cell and guard ring terminal designed to minimize on-state resistance, enhance switching performance, and provide superior high-energy pulse withstand capability in avalanche and commutation modes. This device is widely applied in AC-DC power supplies, DC-DC converters, and H-bridge PWM motor drivers.
Product Attributes
- Brand: Silan Microelectronics
- Part Number: SVF20NE50PN
- Package: TO-3P
- Marking: 20NE50
- Material: Pb free
- Packing: Tube
Technical Specifications
| Characteristics | Symbol | Test conditions | Min. | Typ. | Max. | Unit |
| Drain-Source Breakdown Voltage | BVDSS | VGS=0V, ID=250A | 500 | -- | -- | V |
| Drain-Source Leakage Current | IDSS | VDS=500V, VGS=0V | -- | -- | 1.0 | A |
| Gate-Source Leakage Current | IGSS | VGS=25V, VDS=0V | -- | -- | 100 | A |
| Gate Threshold Voltage | VGS(th) | VGS= VDS, ID=250A | 2.0 | -- | 4.0 | V |
| On State Resistance | RDS(on) | VGS=10V, ID=10.0A | -- | 0.18 | 0.27 | |
| Input Capacitance | Ciss | VDS=25V, VGS=0V, f=1.0MHZ | -- | 3504.0 | -- | pF |
| Output Capacitance | Coss | VDS=25V, VGS=0V, f=1.0MHZ | -- | 425.0 | -- | pF |
| Reverse Transfer Capacitance | Crss | VDS=25V, VGS=0V, f=1.0MHZ | -- | 12.03 | -- | pF |
| Turn-on Delay Time | td(on) | VDD=250V, RG=25, ID=20.0A | -- | 80.67 | -- | ns |
| Turn-on Rise Time | tr | VDD=250V, RG=25, ID=20.0A | -- | 150.67 | -- | ns |
| Turn-off Delay Time | td(off) | VDD=250V, RG=25, ID=20.0A | -- | 198.67 | -- | ns |
| Turn-off Fall Time | tf | VDD=250V, RG=25, ID=20.0A | -- | 112.0 | -- | ns |
| Total Gate Charge | Qg | VDD=400V,VGS=10V, ID=20.0A | -- | 58.38 | -- | nC |
| Gate-Source Charge | Qgs | VDD=400V,VGS=10V, ID=20.0A | -- | 16.89 | -- | nC |
| Gate-Drain Charge | Qgd | VDD=400V,VGS=10V, ID=20.0A | -- | 18.33 | -- | nC |
| Source Current | IS | -- | -- | -- | 20.0 | A |
| Pulsed Source Current | ISM | -- | -- | -- | 80.0 | A |
| Diode Forward Voltage | VSD | IS=20.0A,VGS=0V | -- | -- | 1.3 | V |
| Reverse Recovery Time | Trr | IS=20.0A,VGS=0V, dIF/dt=100A/S | -- | 577.53 | -- | ns |
| Reverse Recovery Charge | Qrr | IS=20.0A,VGS=0V, dIF/dt=100A/S | -- | 7.78 | -- | C |
| Drain-Source Voltage | VDS | -- | -- | -- | 500 | V |
| Gate-Source Voltage | VGS | -- | -- | -- | 30 | V |
| Drain Current | ID | TC=25C | -- | -- | 20.0 | A |
| Drain Current | ID | TC=100C | -- | -- | 12.6 | A |
| Drain Current Pulsed | IDM | -- | -- | -- | 80.0 | A |
| Power Dissipation | PD | TC=25C | -- | -- | 252 | W |
| Power Dissipation Derate | -- | above 25C | -- | -- | 2.02 | W/C |
| Single Pulsed Avalanche Energy | EAS | L=30mH, IAS=11.60A, VDD=165V, RG=25, starting TJ=25C | -- | 2812 | -- | mJ |
| Operation Junction Temperature Range | TJ | -- | -55 | -- | +150 | C |
| Storage Temperature Range | Tstg | -- | -55 | -- | +150 | C |
| Thermal Resistance, Junction-to-Case | RJC | -- | -- | 0.50 | -- | C/W |
| Thermal Resistance, Junction-to-Ambient | RJA | -- | -- | 50 | -- | C/W |
2501091110_Hangzhou-Silan-Microelectronics-SVF20NE50PN_C2897710.pdf
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