N Channel Power MOSFET Hangzhou Silan Microelectronics SVF20NE50PN for AC DC and DC DC Power Applications

Key Attributes
Model Number: SVF20NE50PN
Product Custom Attributes
Drain To Source Voltage:
500V
Current - Continuous Drain(Id):
20A
RDS(on):
180mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
12.03pF
Output Capacitance(Coss):
425pF
Input Capacitance(Ciss):
3.504nF
Pd - Power Dissipation:
252W
Gate Charge(Qg):
58.38nC@10V
Mfr. Part #:
SVF20NE50PN
Package:
TO-3P-3
Product Description

Product Overview

The SVF20NE50PN is an N-channel enhancement mode power MOS field effect transistor utilizing Silan's proprietary F-CellTM structure VDMOS technology. It features an improved planar stripe cell and guard ring terminal designed to minimize on-state resistance, enhance switching performance, and provide superior high-energy pulse withstand capability in avalanche and commutation modes. This device is widely applied in AC-DC power supplies, DC-DC converters, and H-bridge PWM motor drivers.

Product Attributes

  • Brand: Silan Microelectronics
  • Part Number: SVF20NE50PN
  • Package: TO-3P
  • Marking: 20NE50
  • Material: Pb free
  • Packing: Tube

Technical Specifications

CharacteristicsSymbolTest conditionsMin.Typ.Max.Unit
Drain-Source Breakdown VoltageBVDSSVGS=0V, ID=250A500----V
Drain-Source Leakage CurrentIDSSVDS=500V, VGS=0V----1.0A
Gate-Source Leakage CurrentIGSSVGS=25V, VDS=0V----100A
Gate Threshold VoltageVGS(th)VGS= VDS, ID=250A2.0--4.0V
On State ResistanceRDS(on)VGS=10V, ID=10.0A--0.180.27
Input CapacitanceCissVDS=25V, VGS=0V, f=1.0MHZ--3504.0--pF
Output CapacitanceCossVDS=25V, VGS=0V, f=1.0MHZ--425.0--pF
Reverse Transfer CapacitanceCrssVDS=25V, VGS=0V, f=1.0MHZ--12.03--pF
Turn-on Delay Timetd(on)VDD=250V, RG=25, ID=20.0A--80.67--ns
Turn-on Rise TimetrVDD=250V, RG=25, ID=20.0A--150.67--ns
Turn-off Delay Timetd(off)VDD=250V, RG=25, ID=20.0A--198.67--ns
Turn-off Fall TimetfVDD=250V, RG=25, ID=20.0A--112.0--ns
Total Gate ChargeQgVDD=400V,VGS=10V, ID=20.0A--58.38--nC
Gate-Source ChargeQgsVDD=400V,VGS=10V, ID=20.0A--16.89--nC
Gate-Drain ChargeQgdVDD=400V,VGS=10V, ID=20.0A--18.33--nC
Source CurrentIS------20.0A
Pulsed Source CurrentISM------80.0A
Diode Forward VoltageVSDIS=20.0A,VGS=0V----1.3V
Reverse Recovery TimeTrrIS=20.0A,VGS=0V, dIF/dt=100A/S--577.53--ns
Reverse Recovery ChargeQrrIS=20.0A,VGS=0V, dIF/dt=100A/S--7.78--C
Drain-Source VoltageVDS------500V
Gate-Source VoltageVGS------30V
Drain CurrentIDTC=25C----20.0A
Drain CurrentIDTC=100C----12.6A
Drain Current PulsedIDM------80.0A
Power DissipationPDTC=25C----252W
Power Dissipation Derate--above 25C----2.02W/C
Single Pulsed Avalanche EnergyEASL=30mH, IAS=11.60A, VDD=165V, RG=25, starting TJ=25C--2812--mJ
Operation Junction Temperature RangeTJ---55--+150C
Storage Temperature RangeTstg---55--+150C
Thermal Resistance, Junction-to-CaseRJC----0.50--C/W
Thermal Resistance, Junction-to-AmbientRJA----50--C/W

2501091110_Hangzhou-Silan-Microelectronics-SVF20NE50PN_C2897710.pdf

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