Dual N channel 100V fast switching MOSFET HUASHUO HSBB0210 with low Rds on and super low gate charge

Key Attributes
Model Number: HSBB0210
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
2.8A
RDS(on):
130mΩ@4.5V,2A
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.3V
Reverse Transfer Capacitance (Crss@Vds):
2.5pF@50V
Number:
2 N-Channel
Pd - Power Dissipation:
1.5W
Input Capacitance(Ciss):
180pF@50V
Gate Charge(Qg):
3.5nC@10V
Mfr. Part #:
HSBB0210
Package:
PRPAK3x3-8L
Product Description

Product Overview

The HSBB0210 is a dual N-channel 100V fast switching MOSFET featuring advanced trench MOS technology. It offers low Rds(on) and super low gate charge, making it suitable for hard switching and high-speed circuit applications. This device is 100% EAS guaranteed and available in a green device option. Ideal for portable equipment and battery-powered systems.

Product Attributes

  • Brand: HS
  • Technology: Advanced Trench MOS
  • Device Type: Dual N-CH MOSFET
  • Environmental: Green Device Available
  • EAS Guarantee: 100%

Technical Specifications

Model Parameter Conditions Min. Typ. Max. Units
HSBB0210 Drain-Source Voltage (VDS) 100 V
Gate-Source Voltage (VGS) 20 V
Continuous Drain Current (ID) @ TC=25, VGS @ 10V 8 A
Continuous Drain Current (ID) @ TC=100, VGS @ 10V 5 A
Continuous Drain Current (ID) @ TA=25, VGS @ 10V 2.8 A
Continuous Drain Current (ID) @ TA=70, VGS @ 10V 2.3 A
Pulsed Drain Current (IDM) 24 A
Single Pulse Avalanche Energy (EAS) 0.22 mJ
Avalanche Current (IAS) 2.1 A
Total Power Dissipation (PD) @ TC=25 12.5 W
Total Power Dissipation (PD) @ TA=25 1.5 W
Storage Temperature Range (TSTG) -55 150
Operating Junction Temperature Range (TJ) -55 150
HSBB0210 Thermal Resistance Junction-ambient (RJA) --- 85 /W
Thermal Resistance Junction-Case (RJC) --- 10 /W
Drain-Source Breakdown Voltage (BVDSS) VGS=0V , ID=250uA 100 --- --- V
Static Drain-Source On-Resistance (RDS(ON)) VGS=10V , ID=2A --- 89 100 m
VGS=4.5V , ID=2A --- 113 130 m
Gate Threshold Voltage (VGS(th)) VGS=VDS , ID =250uA 1.2 1.6 2.3 V
Drain-Source Leakage Current (IDSS) VDS=80V , VGS=0V , TJ=25 --- --- 1 uA
Drain-Source Leakage Current (IDSS) VDS=80V , VGS=0V , TJ=55 --- --- 5 uA
Gate-Source Leakage Current (IGSS) VGS=20V , VDS=0V --- --- 100 nA
Gate Resistance (Rg) VDS=0V , VGS=0V , f=1MHz --- 5 ---
Total Gate Charge (Qg) VDS=50V , VGS=10V , ID=2A --- 3.5 --- nC
Gate-Source Charge (Qgs) --- 0.7 ---
Gate-Drain Charge (Qgd) --- 0.9 ---
Turn-On Delay Time (Td(on)) VDD=50V , VGS=10V , RG=3 ID=1A --- 4.8 --- ns
Rise Time (Tr) --- 19 --- ns
Turn-Off Delay Time (Td(off)) --- 17 --- ns
Fall Time (Tf) --- 6.2 --- ns
Input Capacitance (Ciss) VDS=50V , VGS=0V , f=1MHz --- 180 --- pF
Output Capacitance (Coss) --- 31 --- pF
Reverse Transfer Capacitance (Crss) --- 2.5 --- pF
Continuous Source Current (IS) VG=VD=0V , Force Current --- --- 2.8 A
Diode Forward Voltage (VSD) VGS=0V , IS=1A , TJ=25 --- --- 1.2 V

Applications

  • Portable Equipment
  • Battery Powered Systems
  • Hard Switching and High-Speed Circuit

2410121641_HUASHUO-HSBB0210_C5128202.pdf

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