Super Junction Power MOSFET 650V N Channel HUAKE HCH65R180 for High Frequency Switching Applications

Key Attributes
Model Number: HCH65R180
Product Custom Attributes
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
20A
Operating Temperature -:
-55℃~+150℃
RDS(on):
210mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
4pF
Number:
1 N-channel
Output Capacitance(Coss):
67pF
Input Capacitance(Ciss):
1.17nF
Pd - Power Dissipation:
185W
Gate Charge(Qg):
39nC@10V
Mfr. Part #:
HCH65R180
Package:
TO-262
Product Description

HCH65R180 650V N-Channel Super Junction Power MOSFET

The HCH65R180 is a 650V N-Channel Super Junction Power MOSFET from HUAKE semiconductors, designed for high-frequency switching applications. It features low gate charge, low Crss, 100% avalanche tested, fast switching, and improved dv/dt capability, making it suitable for High Frequency Switching Mode Power Supplies and Active Power Factor Correction.

Product Attributes

  • Brand: HUAKE semiconductors
  • Product Series: HCH65R180
  • Channel Type: N-Channel
  • Technology: Super Junction Power MOSFET

Technical Specifications

Symbol Parameter Test Conditions Min Typ Max Unit
Absolute Maximum Ratings
VDSS Drain-Source Voltage 650 V
ID Drain Current - Continuous (Tc=25C) 20.0* A
ID Drain Current - Continuous (Tc=100C) 12.6* A
IDM Drain Current - Pulsed (Note1) 80* A
VGSS Gate-Source Voltage 30 V
EAS Single Pulsed Avalanche Energy (Limit Reference Value) (Note2) 550 mJ
IAR Avalanche Current (Note1) 10.0 A
EAR Repetitive Avalanche Energy (Note1) 7.5 mJ
dv/dt Peak Diode Recovery dv/dt (Note3) 8.5 V/ns
PD Power Dissipation(TC =25C) 185 W
-Derate above 25C 1.48 W/C
Tj Operating Junction Temperature 150 C
Tstg Storage Temperature Range -55 +150 C
Thermal Characteristics
RJC Thermal Resistance, Junction to Case 0.68 C/W
RJA Thermal Resistance, Junction to Ambient 62.5 C/W
Electrical Characteristics
Off Characteristics
BVDSS Drain-source Breakdown Voltage VGS=0V ,ID=250A 650 -- -- V
BVDSS /TJ Breakdown Voltage Temperature Coefficient ID=250A (Referenced to 25C) -- 0.62 -- V/C
IDSS Zero Gate Voltage Drain Current VDS=650V,VGS=0V -- -- 1 A
VDS=520V,TC=125C -- -- 10 A
IGSSF Gate-Body Leakage Current,Forward VGS=+30V, VDS=0V -- -- 100 nA
IGSSR Gate-Body Leakage Current,Reverse VGS=-30V, VDS=0V -- -- -100 nA
On Characteristics
VGS(th) Gate Threshold Voltage VDS= VGS, ID=250A 2.0 -- 4.0 V
RDS(on) Static Drain-Source On-Resistance VGS=10 V, ID=10A -- 180 210 m
gFS Forward Transconductance VDS=20 V, ID=10A (Note4) -- 13.5 -- S
Dynamic Characteristics
Ciss Input Capacitance VDS=100V,VGS=0V, f=1.0MHz -- 1170 -- pF
Coss Output Capacitance -- 67 -- pF
Crss Reverse Transfer Capacitance -- 4.0 -- pF
Switching Characteristics
td(on) Turn-On Delay Time VDD = 325 V, ID = 20 A, RG = 25 (Note4,5) -- 20 -- ns
tr Turn-On Rise Time -- 59 -- ns
td(off) Turn-Off Delay Time -- 105 -- ns
tf Turn-Off Fall Time -- 41 -- ns
Qg Total Gate Charge VDS = 520 V, ID =20 A, VGS = 10 V (Note4,5) -- 39 -- nC
Qgs Gate-Source Charge -- 9.5 -- nC
Qgd Gate-Drain Charge -- 19 -- nC
Drain-Source Diode Characteristics and Maximum Ratings
IS Maximum Continuous Drain-Source Diode Forward Current -- -- 20 A
ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 80 A
VSD Drain-Source Diode Forward Voltage VGS =0V,IS=20.0A -- -- 1.4 V
trr Reverse Recovery Time VGS =0V, IS=20.0A, d IF/dt=100A/s (Note4) -- 425 -- ns
Qrr Reverse Recovery Charge -- 6.2 -- C

Notes:
1. Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature.
2. L = 10mH, IAS =10.0A, VDD = 100V, RG = 25 , Starting TJ = 25C.
3. ISD20.0A, di/dt200A/s, VDDBVDSS, Starting TJ = 25C.
4. Pulse Test : Pulse Width 300 s, Duty Cycle2%.
5. Essentially Independent of Operating Temperature.

Mechanical Data (TO-262)

SYMBOL min nom max SYMBOL min nom max
A 4.32 4.52 4.72 D1 7.40REF
A1 2.44 2.64 2.84 E 9.88 10.13 10.38
b 0.70 0.80 0.90 E1 7.02 8.02 9.02
b1 0.28 0.38 0.48 e 2.54REF
b2 0.90 1.00 1.10 L 12.60 13.10 13.60
b3 1.18 1.28 1.38 L1 1.30 1.50 1.70
c 0.30 0.38 0.46 L2 2.90 3.20 3.50
c1 1.17 1.27 1.37 H 1.08 1.28 1.48
D 8.70 9.05 9.40 1 2 - 7

(Precautions):
1. When designing circuits, do not exceed the maximum rated values of the device, otherwise it will affect the reliability of the whole machine.
2. MOSFET products are electrostatic sensitive devices. When using, pay attention to anti-static protection measures, such as wearing anti-static wristbands, grounding equipment, etc.
3. If a heatsink is to be installed, pay attention to controlling the torque and the flatness of the heatsink.
4. This specification is produced by HUAKE Company and may be changed irregularly without prior notice.
5. If you have any questions, please contact our sales representative in time.

(Version History):
1. : V1.0, : 2022-12-20, :


2410121937_HUAKE-HCH65R180_C19725818.pdf

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