Switching mode power supply N Channel MOSFET HUAKE SMF2N65 650V with low gate charge and fast switching

Key Attributes
Model Number: SMF2N65
Product Custom Attributes
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
2A
Operating Temperature -:
-55℃~+150℃
RDS(on):
4.2Ω@10V,1A
Gate Threshold Voltage (Vgs(th)):
2V
Reverse Transfer Capacitance (Crss@Vds):
5pF@25V
Number:
1 N-channel
Input Capacitance(Ciss):
270pF@25V
Pd - Power Dissipation:
23W
Mfr. Part #:
SMF2N65
Package:
TO-220F
Product Description

Product Overview

The SMF2N65 is a 650V N-Channel MOSFET from HUAKE semiconductors, designed for high-frequency switching mode power supplies and active power factor correction. It offers excellent performance with features such as low gate charge, low Crss, 100% avalanche tested, fast switching, and improved dv/dt capability, making it a reliable choice for demanding power applications.

Product Attributes

  • Brand: HUAKE semiconductors
  • Model: SMF2N65
  • Product Type: N-Channel MOSFET
  • Voltage Rating: 650V
  • Date: 2017.08

Technical Specifications

Symbol Parameter Test Conditions Min Typ Max Unit
Absolute Maximum Ratings
VDSS Drain-Source Voltage 650 V
ID Drain Current - Continuous (Tc=25C) 2.0* A
ID Drain Current - Continuous (Tc=100C) 1.3* A
IDM Drain Current - Pulsed (Note1) 8* A
VGSS Gate-Source Voltage 30 V
EAS Single Pulsed Avalanche Energy (Note2) 120 mJ
IAR Avalanche Current (Note1) 2.0 A
EAR Repetitive Avalanche Energy (Note1) 4.4 mJ
dv/dt Peak Diode Recovery dv/dt (Note3) 4.5 V/ns
PD Power Dissipation(TC =25C) 23 W
-Derate above 25C 0.18 W/C
Tj Operating Junction Temperature 150 C
Tstg Storage Temperature Range -55 +150 C
Thermal Characteristics
RJC Thermal Resistance, Junction to Case 5.5 C /W
RJA Thermal Resistance, Junction to Ambient 62.5 C /W
Electrical Characteristics
BVDSS Drain-source Breakdown Voltage VGS=0V ,ID=250A 650 -- -- V
BVDSS/TJ Breakdown Voltage Temperature Coefficient ID=250A (Referenced to 25C) -- 0.65 -- V/C
IDSS Zero Gate Voltage Drain Current VDS=650V,VGS=0V -- -- 1 A
VDS=520V,TC=125C -- -- 10 A
IGSSF Gate-Body Leakage Current,Forward VGS=+30V, VDS=0V -- -- 100 nA
IGSSR Gate-Body Leakage Current,Reverse VGS=-30V, VDS=0V -- -- -100 nA
VGS(th) Gate Threshold Voltage VDS= VGS, ID=250A 2.0 -- 4.0 V
RDS(on) Static Drain-Source On-Resistance VGS=10 V, ID=1.0A -- 4.2 4.9
gFS Forward Transconductance VDS=40 V, ID=1.0A (Note4) -- 1.9 -- S
Dynamic Characteristics
Ciss Input Capacitance VDS=25V,VGS=0V, f=1.0MHz -- 270 -- pF
Coss Output Capacitance -- 40 -- pF
Crss Reverse Transfer Capacitance -- 5 -- pF
Switching Characteristics
td(on) Turn-On Delay Time VDD = 325 V, ID = 2.0 A, RG = 25 (Note4,5) -- 7 -- ns
tr Turn-On Rise Time -- 23 -- ns
td(off) Turn-Off Delay Time -- 2 -- ns
tf Turn-Off Fall Time -- 24 -- ns
Qg Total Gate Charge VDS = 520 V, ID =2.0 A, VGS = 10 V (Note4,5) -- 9 -- nC
Qgs Gate-Source Charge -- 1.6 -- nC
Qgd Gate-Drain Charge -- 4.3 -- nC
Drain-Source Diode Characteristics and Maximum Ratings
IS Maximum Continuous Drain-Source Diode Forward Current -- -- 2.0 A
ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 8 A
VSD Drain-Source Diode Forward Voltage VGS =0V,IS=2.0A -- -- 1.4 V
trr Reverse Recovery Time VGS =0V, IS=2.0A, d IF/dt=100A/s (Note4) -- 230 -- ns
Qrr Reverse Recovery Charge -- 1.0 -- C

2410122013_HUAKE-SMF2N65_C563581.pdf

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