Dual N Channel MOSFET HUASHUO HSBA4204 with 40V Drain Source Voltage and RoHS Certified Green Product

Key Attributes
Model Number: HSBA4204
Product Custom Attributes
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
30A
Operating Temperature -:
-55℃~+150℃
RDS(on):
20mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
88pF
Number:
2 N-Channel
Output Capacitance(Coss):
120pF
Input Capacitance(Ciss):
1.314nF
Pd - Power Dissipation:
2W
Gate Charge(Qg):
10.7nC@4.5V
Mfr. Part #:
HSBA4204
Package:
PRPAK5x6-8L
Product Description

Product Overview

The HSBA4204 is a dual N-channel MOSFET featuring 40V breakdown voltage and fast switching capabilities. Designed with high cell density trench technology, it offers excellent RDS(ON) and low gate charge, making it ideal for synchronous buck converter applications. This product meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. It provides super low gate charge and excellent CdV/dt effect decline.

Product Attributes

  • Brand: HS-Semi
  • Model: HSBA4204
  • Type: Dual N-Channel MOSFET
  • Certifications: RoHS, Green Product
  • EAS Guaranteed: 100%

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 40 V
VGS Gate-Source Voltage ±20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1 30 A
ID@TC=70 Continuous Drain Current, VGS @ 10V1 20 A
IDM Pulsed Drain Current2 100 A
EAS Single Pulse Avalanche Energy3 31 mJ
IAS Avalanche Current 25 A
PD@TA=25 Total Power Dissipation4 2 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient (Steady State)1 --- --- 62.5 /W
RJC Thermal Resistance Junction-Case1 --- --- 6 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 40 --- --- V
ΔBVDSS/ΔTJ BVDSS Temperature Coefficient Reference to 25 , ID=1mA --- 0.034 --- V/
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=6A --- 11.5 15 m
VGS=4.5V , ID=3A --- 15 20 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.0 --- 2.5 V
ΔVGS(th)/ΔTJ VGS(th) Temperature Coefficient --- -5.64 --- mV/
IDSS Drain-Source Leakage Current VDS=32V , VGS=0V , TJ=25 --- --- 1 uA
VDS=32V , VGS=0V , TJ=55 --- --- 5 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- --- ±100 nA
gfs Forward Transconductance VDS=5V , ID=6A --- 31 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 2.1 ---
Capacitance Ciss Input Capacitance VDS=15V , VGS=0V , f=1MHz --- 1314 --- pF
Coss Output Capacitance --- 120 --- pF
Crss Reverse Transfer Capacitance --- 88 --- pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- --- 30 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- --- 1.2 V
Switching Time (VDD=12V , ID=6A, RG=3.3)
td(on) Turn-On Delay Time VGS=10V --- 8.6 --- ns
tr Rise Time --- 3.4 --- ns
td(off) Turn-Off Delay Time --- 25 --- ns
tf Fall Time --- 2.2 --- ns
Gate Charge (VDS=20V, ID=6A)
Qg Total Gate Charge (4.5V) VGS=4.5V --- 10.7 --- nC
Qgs Gate-Source Charge --- 3.3 --- nC
Qgd Gate-Drain Charge --- 4.2 --- nC

Notes:

  1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
  2. The data tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
  3. The EAS data shows Max. rating. The test condition is VDD=25V, VGS=10V, L=0.1mH, IAS=25A.
  4. The power dissipation is limited by 175 junction temperature.
  5. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.

2410121523_HUASHUO-HSBA4204_C2903569.pdf
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