Trenched P channel MOSFET HUASHUO HSBA100P03 with RoHS compliance and superior switching performance

Key Attributes
Model Number: HSBA100P03
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
100A
Operating Temperature -:
-55℃~+150℃
RDS(on):
3.3mΩ@10V,30A
Gate Threshold Voltage (Vgs(th)):
1.2V
Reverse Transfer Capacitance (Crss@Vds):
500pF@25V
Number:
1 P-Channel
Input Capacitance(Ciss):
7.9nF@25V
Pd - Power Dissipation:
140W
Gate Charge(Qg):
140nC@10V
Mfr. Part #:
HSBA100P03
Package:
PRPAK5x6-8L
Product Description

Product Overview

The HSBA100P03 is a high cell density trenched P-channel MOSFET designed for excellent RDS(ON) and gate charge, making it ideal for synchronous buck converter applications. This device meets RoHS and Green Product requirements, is 100% EAS guaranteed, and offers full function reliability. It features super low gate charge, excellent Cdv/dt effect decline, and advanced high cell density trench technology, enabling fast switching performance.

Product Attributes

  • Brand: HS-Semi
  • Product Type: P-Channel MOSFET
  • Technology: Trench
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed
  • Package: PRPAK5X6
  • Packaging: 3000/Tape&Reel

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage -30 V
VGS Gate-Source Voltage ±20 V
ID@TC=25 Continuous Drain Current, VGS @ -10V1,6 -100 A
ID@TC=100 Continuous Drain Current, VGS @ -10V1,6 -64 A
IDM Pulsed Drain Current2 -400 A
EAS Single Pulse Avalanche Energy3 310 mJ
IAS Avalanche Current -80 A
PD@TC=25 Total Power Dissipation4 140 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient 1(t≤10S) 20 /W
RJA Thermal Resistance Junction-ambient 1(Steady State) 62 /W
RJC Thermal Resistance Junction-case 1 0.9 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -30 V
RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V , ID=-30A 2.6 3.3
RDS(ON) Static Drain-Source On-Resistance2 VGS=-4.5V , ID=-20A 3.8 5
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -1.2 -2.2 V
IDSS Drain-Source Leakage Current VDS=-24V , VGS=0V , TJ=25 -1 uA
IDSS Drain-Source Leakage Current VDS=-24V , VGS=0V , TJ=55 -5 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V ±100 nA
Qg Total Gate Charge (-10V) VDS=-24V , VGS=-10V , ID=-10A 140 nC
Qgs Gate-Source Charge 22 nC
Qgd Gate-Drain Charge 31 nC
Td(on) Turn-On Delay Time VDD=-15V , VGS=-10V , RG=5Ω, ID=-10A 17 ns
Tr Rise Time 60 ns
Td(off) Turn-Off Delay Time 200 ns
Tf Fall Time 111 ns
Ciss Input Capacitance VDS=-25V , VGS=0V , f=1MHz 7900 pF
Coss Output Capacitance 980 pF
Crss Reverse Transfer Capacitance 500 pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current -100 A
VSD Diode Forward Voltage2 VGS=0V , IS=-1A , TJ=25 -1 V
trr Reverse Recovery Time IF=-20A , di/dt=100A/µs , TJ=25 53 nS
Qrr Reverse Recovery Charge 52 nC

Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
3. The EAS data shows Max. rating. The test condition is VDD=-50V, VGS=-10V, L=0.1mH, IAS=-80A.
4. The power dissipation is limited by 150 junction temperature.
5. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.
6. The maximum current rating is package limited.


2410121656_HUASHUO-HSBA100P03_C701057.pdf
Contact Our Experts And Get A Free Consultation!

Our mission is to offer "High Quality" & "Good Service" & "Fast Delivery" to help our clients to gain more profits.