Dual N Channel MOSFET HUASHUO HSBA6214 Featuring RoHS and Green Device Compliance for Power Systems
Key Attributes
Model Number:
HSBA6214
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
17A
Operating Temperature -:
-55℃~+150℃
RDS(on):
52mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
46pF@15V
Number:
2 N-Channel
Input Capacitance(Ciss):
1.027nF@15V
Pd - Power Dissipation:
2W
Gate Charge(Qg):
19nC@10V
Mfr. Part #:
HSBA6214
Package:
PRPAK5x6-8L
Product Description
Product Overview
The HSBA6214 is a high cell density trenched N-channel MOSFET designed for synchronous buck converter applications. It offers excellent RDS(ON) and gate charge characteristics, meeting RoHS and Green Product requirements. This device is 100% EAS guaranteed with full function reliability approval, making it suitable for applications requiring fast switching and low power loss.Product Attributes
- Brand: HS (implied by "www.hs-semi.cn")
- Product Type: Dual N-Channel MOSFET
- Certifications: RoHS, Green Device Available
- Reliability: 100% EAS Guaranteed, Full function reliability approved
Technical Specifications
| Product Summary | HSBA6214 | ||
|---|---|---|---|
| Symbol | Parameter | Rating | Units |
| Absolute Maximum Ratings | |||
| VDS | Drain-Source Voltage | 60 | V |
| VGS | Gate-Source Voltage | ±20 | V |
| ID@TC=25 | Continuous Drain Current, VGS @ 10V1 | 17 | A |
| ID@TC=70 | Continuous Drain Current, VGS @ 10V1 | 11 | A |
| IDM | Pulsed Drain Current2 | 40 | A |
| EAS | Single Pulse Avalanche Energy3 | 22 | mJ |
| IAS | Avalanche Current | 21 | A |
| PD@TA=25 | Total Power Dissipation4 | 2 | W |
| TSTG | Storage Temperature Range | -55 to 150 | |
| TJ | Operating Junction Temperature Range | -55 to 150 | |
| Thermal Data | |||
| RJA | Thermal Resistance Junction-ambient | --- | 62 /W |
| RJC | Thermal Resistance Junction-Case1 | --- | 5 /W |
| Electrical Characteristics (TJ=25 , unless otherwise noted) | |||
| BVDSS | Drain-Source Breakdown Voltage | 60 | V |
| RDS(ON),typ | On-Resistance, typ. (VGS=10V, ID=15A) | 35 | m |
| ID | Continuous Drain Current (TC=25) | 17 | A |
| VGS(th) | Gate Threshold Voltage (VGS=VDS, ID =250uA) | 1.0 to 2.5 | V |
| IDSS | Drain-Source Leakage Current (VDS=48V, VGS=0V, TJ=25) | --- | 1 uA |
| IGSS | Gate-Source Leakage Current (VGS=±20V, VDS=0V) | --- | ±100 nA |
| Qg | Total Gate Charge (VDS=48V, VGS=10V, ID=15A) | 19 | nC |
| Ciss | Input Capacitance (VDS=15V, VGS=0V, f=1MHz) | 1027 | pF |
| Coss | Output Capacitance | 65 | pF |
| Crss | Reverse Transfer Capacitance | 46 | pF |
| Diode Characteristics | |||
| IS | Continuous Source Current1,5 (VG=VD=0V, Force Current) | --- | 17 A |
| VSD | Diode Forward Voltage (VGS=0V, IS=1A, TJ=25) | --- | 1.2 V |
| trr | Reverse Recovery Time (IF=4A, dI/dt=100A/µs, TJ=25) | --- | 12.1 nS |
| Qrr | Reverse Recovery Charge | --- | 6.7 nC |
2410121653_HUASHUO-HSBA6214_C2828502.pdf
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