Trench Technology N Channel MOSFET HUASHUO HSU28N15 With Super Low Gate Charge And High Cell Density

Key Attributes
Model Number: HSU28N15
Product Custom Attributes
Drain To Source Voltage:
150V
Current - Continuous Drain(Id):
30A
Operating Temperature -:
-55℃~+175℃
RDS(on):
46mΩ@10V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
160pF@25V
Number:
1 N-channel
Pd - Power Dissipation:
115W
Input Capacitance(Ciss):
3.755nF@25V
Gate Charge(Qg):
40nC@4.5V
Mfr. Part #:
HSU28N15
Package:
TO-252-2
Product Description

Product Overview

The HSU28N15 is a high-performance trench N-channel MOSFET featuring extreme high cell density, offering excellent RDS(ON) and gate charge characteristics. It is designed for most synchronous buck converter applications. This MOSFET meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. Key advantages include super low gate charge, green device availability, and excellent Cdv/dt effect decline, leveraging advanced high cell density Trench technology.

Product Attributes

  • Brand: HS-Semi
  • Product Type: N-Channel Fast Switching MOSFET
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS guaranteed, full function reliability approved

Technical Specifications

Model Parameter Conditions Min. Typ. Max. Unit
HSU28N15 Drain-Source Voltage (VDS) 150 V
Gate-Source Voltage (VGS) 20 V
Continuous Drain Current (ID@TC=25) VGS @ 10V 30 A
Continuous Drain Current (ID@TC=100) VGS @ 10V 22 A
Pulsed Drain Current (IDM) 60 A
Single Pulse Avalanche Energy (EAS) 216 mJ
Avalanche Current (IAS) 38 A
Total Power Dissipation (PD@TC=25) 115 W
Storage Temperature Range (TSTG) -55 175
Operating Junction Temperature Range (TJ) -55 175
Thermal Resistance Junction-ambient (RJA) 55 /W
Thermal Resistance Junction-Case (RJC) 1.3 /W
Drain-Source Breakdown Voltage (BVDSS) VGS=0V , ID=250uA 150 V
Static Drain-Source On-Resistance (RDS(ON)) VGS=10V , ID=20A 35 46 m
VGS=4.5V , ID=20A 37 50 m
Gate Threshold Voltage (VGS(th)) VGS=VDS , ID =250uA 1.2 2.5 V
Drain-Source Leakage Current (IDSS) VDS=120V , VGS=0V , TJ=25 1 uA
Gate-Source Leakage Current (IGSS) VGS=20V , VDS=0V 100 nA
Forward Transconductance (gfs) VDS=5V , ID=20A 55 S
Total Gate Charge (Qg) VDS=75V , VGS=4.5V , ID=10A 40 nC
Gate-Source Charge (Qgs) 10 nC
Gate-Drain Charge (Qgd) 21 nC
Turn-On Delay Time (td(on)) VDD=50V , VGS=4.5V , RG=3.3, ID=10A 18 ns
Rise Time (tr) 20 ns
Turn-Off Delay Time (td(off)) 65 ns
Fall Time (tf) 15 ns
Input Capacitance (Ciss) VDS=25V , VGS=0V , f=1MHz 3755 pF
Output Capacitance (Coss) 207 pF
Reverse Transfer Capacitance (Crss) 160 pF
Continuous Source Current (IS) VG=VD=0V , Force Current 30 A
Diode Forward Voltage (VSD) VGS=0V , IS=1A , TJ=25 1.2 V
Reverse Recovery Time (trr) IF=10A , dI/dt=100A/s , TJ=25 35 nS
Reverse Recovery Charge (Qrr) 120 nC
Package Packaging Quantity
TO252-2 Tape&Reel 2500

2410121653_HUASHUO-HSU28N15_C2903560.pdf
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