High cell density trenched p channel mosfet HUASHUO HSBB3103 for synchronous buck converter performance

Key Attributes
Model Number: HSBB3103
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
32A
Operating Temperature -:
-55℃~+150℃
RDS(on):
20mΩ@4.5V,10A
Gate Threshold Voltage (Vgs(th)):
2.5V
Reverse Transfer Capacitance (Crss@Vds):
158pF@15V
Number:
1 P-Channel
Input Capacitance(Ciss):
1.345nF@15V
Pd - Power Dissipation:
29W
Gate Charge(Qg):
12.5nC@4.5V
Mfr. Part #:
HSBB3103
Package:
PRPAK3x3-8L
Product Description

Product Overview

The HSBB3103 is a high cell density trenched P-channel MOSFET designed for synchronous buck converter applications. It offers excellent RDS(ON) and gate charge characteristics, contributing to efficient power conversion. This device meets RoHS and Green Product requirements, and is 100% EAS guaranteed with full function reliability approval. Key advantages include a super low gate charge, excellent CdV/dt effect decline, and advanced high cell density Trench technology.

Product Attributes

  • Brand: HS-Semi
  • Product Line: HSBB Series
  • Technology: Trench MOSFET
  • Certifications: RoHS, Green Product
  • Testing: 100% EAS Guaranteed

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage -30 V
VGS Gate-Source Voltage ±25 V
ID@TC=25 Continuous Drain Current, VGS @ -10V1 -32 A
ID@TC=100 Continuous Drain Current, VGS @ -10V1 -20 A
ID@TA=25 Continuous Drain Current, VGS @ -10V1 -12.2 -7.7 A
ID@TA=70 Continuous Drain Current, VGS @ -10V1 -9.8 -6.2 A
IDM Pulsed Drain Current2 -65 A
EAS Single Pulse Avalanche Energy3 72.2 mJ
IAS Avalanche Current -38 A
PD@TC=25 Total Power Dissipation4 29 W
PD@TA=25 Total Power Dissipation4 4.2 1.67 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient1 75 /W
RJA Thermal Resistance Junction-Ambient1 (t ≤10s) 30 /W
RJC Thermal Resistance Junction-Case1 4.32 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -30 V
ΔBVDSS/ΔTJ BVDSS Temperature Coefficient Reference to 25 , ID=-1mA -0.022 V/
RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V , ID=-15A 20 m
RDS(ON) Static Drain-Source On-Resistance2 VGS=-4.5V , ID=-10A 32 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -1.0 -2.5 V
ΔVGS(th)/ΔTJ VGS(th) Temperature Coefficient 4.6 mV/
IDSS Drain-Source Leakage Current VDS=-24V , VGS=0V , TJ=25 -1 µA
IDSS Drain-Source Leakage Current VDS=-24V , VGS=0V , TJ=55 -5 µA
IGSS Gate-Source Leakage Current VGS=±25V , VDS=0V ±100 nA
gfs Forward Transconductance VDS=-5V , ID=-15A 19 S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 13 Ω
Qg Total Gate Charge (-4.5V) VDS=-15V , VGS=-4.5V , ID=-15A 12.5 nC
Qgs Gate-Source Charge 5.4 nC
Qgd Gate-Drain Charge 5 nC
td(on) Turn-On Delay Time VDD=-15V , VGS=-10V , RG=3.3Ω, ID=-15A 4.4 ns
tr Rise Time 11.2 ns
td(off) Turn-Off Delay Time 34 ns
tf Fall Time 18 ns
Ciss Input Capacitance VDS=-15V , VGS=0V , f=1MHz 1345 pF
Coss Output Capacitance 194 pF
Crss Reverse Transfer Capacitance 158 pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current -32 A
ISM Pulsed Source Current2,5 -65 A
VSD Diode Forward Voltage2 VGS=0V , IS=-1A , TJ=25 -1.2 V
trr Reverse Recovery Time IF=-15A , dI/dt=100A/µs , TJ=25 12.4 nS
Qrr Reverse Recovery Charge 5 nC
Ordering Information
Part Number Package code Packaging
HSBB3103 PRPAK3*3 3000/Tape&Reel

2409291134_HUASHUO-HSBB3103_C508818.pdf
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