N Channel MOSFET HUASHUO HSBB15N15S Featuring 150V Drain Source Voltage and Trench Technology Design

Key Attributes
Model Number: HSBB15N15S
Product Custom Attributes
Drain To Source Voltage:
150V
Current - Continuous Drain(Id):
15A
Operating Temperature -:
-55℃~+150℃@(Tj)
RDS(on):
35mΩ@10V,10A
Gate Threshold Voltage (Vgs(th)):
2.5V
Reverse Transfer Capacitance (Crss@Vds):
-
Number:
1 N-channel
Pd - Power Dissipation:
45W
Input Capacitance(Ciss):
1.09nF@75V
Gate Charge(Qg):
19nC@4.5V
Mfr. Part #:
HSBB15N15S
Package:
PRPAK3x3-8
Product Description

Product Overview

The HSBB15N15S is a high-performance N-channel MOSFET featuring an N-Ch 150V rating and fast switching capabilities. It utilizes an advanced high cell density Trench technology, offering excellent RDS(ON) and gate charge characteristics, making it ideal for synchronous buck converter applications. This device meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. Key advantages include super low gate charge, excellent Cdv/dt effect decline, and availability as a green device.

Product Attributes

  • Brand: HS-Semi
  • Product Type: N-Channel MOSFET
  • Technology: Trench
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 150 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1 15 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1 9 A
IDM Pulsed Drain Current2 60 A
EAS Single Pulse Avalanche Energy3 53 mJ
IAS Avalanche Current 18 A
PD@TC=25 Total Power Dissipation3 45 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient1 --- 55 /W
RJC Thermal Resistance Junction-Case1 --- 2.8 /W
Product Summary
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 150 --- --- V
RDS(ON),typ Static Drain-Source On-Resistance2 VGS=10V , ID=10A 35 56 m
RDS(ON),typ Static Drain-Source On-Resistance2 VGS=4.5V , ID=10A 41 68 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 --- 2.5 V
IDSS Drain-Source Leakage Current VDS=120V , VGS=0V , TJ=25 --- 1 uA
IDSS Drain-Source Leakage Current VDS=120V , VGS=0V , TJ=55 --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- 100 nA
gfs Forward Transconductance VDS=5V , ID=10A 33 --- S
Qg Total Gate Charge VDS=75V , VGS=4.5V , ID=10A 19 --- nC
Qgs Gate-Source Charge 4.5 ---
Qgd Gate-Drain Charge 2.6 ---
Td(on) Turn-On Delay Time VDD=75V , VGS=10V , RG=3.3 ID=10A 13 --- ns
Tr Rise Time 8.2 --- ns
Td(off) Turn-Off Delay Time 25 --- ns
Tf Fall Time 11 --- ns
Ciss Input Capacitance VDS=75V , VGS=0V , f=1MHz 1090 --- pF
Coss Output Capacitance 93 ---
Crss Reverse Transfer Capacitance 6 ---
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- 15 A
ISM Pulsed Source Current2,5 --- 60 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- 1.2 V
trr Reverse Recovery Time IF=10A , dI/dt=100A/s , TJ=25 37 --- ns
Qrr Reverse Recovery Charge 263 --- nC

Notes:

  • 1 Tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
  • 2 Tested by pulsed, pulse width 300s, duty cycle 2%.
  • 3 EAS data shows Max. rating. Test condition: VDD=25V, VGS=10V, L=0.3mH, IAS=18A.
  • 4 Power dissipation is limited by 150 junction temperature.
  • 5 Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.

Ordering Information:

Part Number Package Code Packaging
HSBB15N15S PRPAK3*3 3000/Tape&Reel

2410121656_HUASHUO-HSBB15N15S_C7543693.pdf

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