synchronous buck converter MOSFET HUASHUO HSBB3052 with excellent CdV dt effect and low gate charge

Key Attributes
Model Number: HSBB3052
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
30A
Operating Temperature -:
-55℃~+150℃
RDS(on):
6.3mΩ@10V,20A
Gate Threshold Voltage (Vgs(th)):
2.5V
Reverse Transfer Capacitance (Crss@Vds):
41pF
Number:
1 N-channel
Input Capacitance(Ciss):
814pF
Pd - Power Dissipation:
24W
Gate Charge(Qg):
8nC@4.5V
Mfr. Part #:
HSBB3052
Package:
PRPAK3x3-8L
Product Description

Product Overview

The HSBB3052 is a high cell density trenched N-channel MOSFET designed for excellent RDS(ON) and gate charge, making it ideal for synchronous buck converter applications. This device meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approved. It offers super low gate charge and excellent CdV/dt effect decline due to its advanced high cell density trench technology.

Product Attributes

  • Brand: HS-Semi
  • Certifications: RoHS, Green Product
  • Technology: Advanced high cell density Trench

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 30 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1 30 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1 24 A
ID@TA=25 Continuous Drain Current, VGS @ 10V1 20 A
ID@TA=70 Continuous Drain Current, VGS @ 10V1 15 A
IDM Pulsed Drain Current2 100 A
EAS Single Pulse Avalanche Energy3 28.8 mJ
IAS Avalanche Current 24 A
PD@TC=25 Total Power Dissipation4 24 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient1 --- 60 /W
RJC Thermal Resistance Junction-Case1 --- 5.2 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 30 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=30A 5 6.3 m
VGS=4.5V , ID=15A 6.9 9 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 --- 2.5 V
IDSS Drain-Source Leakage Current VDS=24V , VGS=0V , TJ=25 --- 1 uA
VDS=24V , VGS=0V , TJ=55 --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- 100 nA
gfs Forward Transconductance VDS=5V , ID=30A 43 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 1.7 ---
Qg Total Gate Charge (4.5V) VDS=15V , VGS=4.5V , ID=15A 8 --- nC
Qgs Gate-Source Charge 2.4 --- nC
Qgd Gate-Drain Charge 3.2 --- nC
Td(on) Turn-On Delay Time VDD=15V , VGS=10V , RG=3.3 ID=15A 7.1 --- ns
Tr Rise Time 40 --- ns
Td(off) Turn-Off Delay Time 15 --- ns
Tf Fall Time 6 --- ns
Ciss Input Capacitance VDS=15V , VGS=0V , f=1MHz 814 --- pF
Coss Output Capacitance 498 --- pF
Crss Reverse Transfer Capacitance 41 --- pF
Diode Characteristics
IS Continuous Source Current1,6 VG=VD=0V , Force Current --- 24 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- 1 V
trr Reverse Recovery Time IF=15A , di/dt=100A/s , TJ=25 34 --- nS
Qrr Reverse Recovery Charge 15 --- nC

2409291036_HUASHUO-HSBB3052_C508824.pdf
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