30V dual N channel MOSFET HUASHUO HSBA3202 with excellent switching performance and RoHS certified design

Key Attributes
Model Number: HSBA3202
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
35A
Operating Temperature -:
-55℃~+150℃@(Tj)
RDS(on):
15mΩ@10V,10A
Gate Threshold Voltage (Vgs(th)):
2.3V
Reverse Transfer Capacitance (Crss@Vds):
57pF@15V
Number:
2 N-Channel
Pd - Power Dissipation:
42W
Input Capacitance(Ciss):
491pF@15V
Gate Charge(Qg):
4.5nC@4.5V
Mfr. Part #:
HSBA3202
Package:
PRPAK5x6-8L
Product Description

Product Overview

The HSBA3202 is a dual N-channel, 30V fast-switching MOSFET featuring high cell density trench technology. It offers excellent RDS(ON) and gate charge, making it suitable for synchronous buck converter applications. This product meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. Key advantages include super low gate charge, excellent CdV/dt effect decline, and advanced high cell density trench technology.

Product Attributes

  • Brand: HS-Semi
  • Product Type: Dual N-Ch Fast Switching MOSFETs
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed, Full Function Reliability Approved

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage 30 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1 35 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1 22 A
IDM Pulsed Drain Current2 70 A
EAS Single Pulse Avalanche Energy3 22.1 mJ
IAS Avalanche Current 20 A
PD@TC=25 Total Power Dissipation4 42 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient --- 62 /W
RJC Thermal Resistance Junction-Case1 --- 3 /W
Product Summary
Model HSBA3202
Type Dual N-Ch 30V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 30 --- --- V
BVDSS/TJ BVDSS Temperature Coefficient Reference to 25 , ID=1mA --- 0.034 --- V/
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=10A --- 15 18 m
VGS=4.5V , ID=10A --- 21 30 V
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 1.7 2.3 V
VGS(th) VGS(th) Temperature Coefficient --- -5.8 --- mV/
IDSS Drain-Source Leakage Current VDS=30V , VGS=0V , TJ=25 --- --- 1 uA
VDS=30V , VGS=0V , TJ=55 --- --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- --- 100 nA
gfs Forward Transconductance VDS=5V , ID=10A --- 12 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 2.5 ---
Qg Total Gate Charge (4.5V) VDS=15V , VGS=4.5V , ID=7A --- 4.6 --- nC
Qgs Gate-Source Charge --- 1.85 --- nC
Qgd Gate-Drain Charge --- 1.6 --- nC
Td(on) Turn-On Delay Time VDD=15V , VGS=10V , RG=3.3, ID=7A --- 7 --- ns
Tr Rise Time --- 13 --- ns
Td(off) Turn-Off Delay Time --- 19 --- ns
Tf Fall Time --- 3.4 --- ns
Ciss Input Capacitance VDS=15V , VGS=0V , f=1MHz --- 491 --- pF
Coss Output Capacitance --- 80 --- pF
Crss Reverse Transfer Capacitance --- 57 --- pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- --- 10 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- --- 1 V

Notes:

  • 1. Tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
  • 2. Tested by pulsed, pulse width 300s, duty cycle 2%.
  • 3. EAS data shows Max. rating. Test condition: VDD=25V, VGS=10V, L=0.1mH, IAS=20A.
  • 4. Power dissipation is limited by 150 junction temperature.
  • 5. Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.

2410121448_HUASHUO-HSBA3202_C7543702.pdf
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