P Channel MOSFET HSK2P25 Fast Switching Device with Low Gate Charge and Performance in Load Switches
HSK2P25 P-Ch 250V Fast Switching MOSFETs
The HSK2P25 is a high cell density trenched P-channel MOSFET designed for excellent RDS(ON) and efficiency in small power switching and load switch applications. It features super low gate charge, excellent Cdv/dt effect decline, and is built with advanced high cell density Trench technology. This device meets RoHS and Green Product requirements with full function reliability approval. Available in Green Device.
Product Attributes
- Brand: HS-Semi
- Product Type: P-Channel MOSFET
- Switching Speed: Fast Switching
- Certifications: RoHS, Green Product
Technical Specifications
| Symbol | Parameter | Conditions | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| Absolute Maximum Ratings | ||||||
| VDS | Drain-Source Voltage | -250 | V | |||
| VGS | Gate-Source Voltage | ±20 | V | |||
| ID@TC=25 | Continuous Drain Current, VGS @ -10V1 | -2.0 | A | |||
| ID@TC=70 | Continuous Drain Current, VGS @ -10V1 | -1.0 | A | |||
| ID@TA=25 | Continuous Drain Current, VGS @ -10V1 | -0.4 | A | |||
| ID@TA=70 | Continuous Drain Current, VGS @ -10V1 | -0.3 | A | |||
| IDM | Pulsed Drain Current2 | -1.2 | A | |||
| PD@TA=25 | Total Power Dissipation3 | 1.0 | W | |||
| TSTG | Storage Temperature Range | -55 | 150 | |||
| TJ | Operating Junction Temperature Range | -55 | 150 | |||
| Thermal Data | ||||||
| RJA | Thermal Resistance Junction-ambient1 | 130 | /W | |||
| RJC | Thermal Resistance Junction-Case1 | 50 | /W | |||
| Electrical Characteristics (TJ=25 , unless otherwise noted) | ||||||
| BVDSS | Drain-Source Breakdown Voltage | VGS=0V , ID=-250uA | -250 | V | ||
| RDS(ON) | Static Drain-Source On-Resistance2 | VGS=-10V , ID=-0.3A | 3.3 | 4 | ||
| VGS(th) | Gate Threshold Voltage | VGS=VDS , ID =-250uA | -2.0 | -3.0 | -4.0 | V |
| IDSS | Drain-Source Leakage Current | VDS=-200V , VGS=0V , TJ=25 | 1 | uA | ||
| IDSS | Drain-Source Leakage Current | VDS=-200V , VGS=0V , TJ=55 | 10 | uA | ||
| IGSS | Gate-Source Leakage Current | VGS=±20V , VDS=0V | ±100 | nA | ||
| gfs | Forward Transconductance | VDS=-5V , ID=-0.8A | 1.5 | S | ||
| Qg | Total Gate Charge | VDS=-100V , VGS=-4.5V , ID=-0.3A | 8.9 | nC | ||
| Qgs | Gate-Source Charge | 1.5 | nC | |||
| Qgd | Gate-Drain Charge | 1.8 | nC | |||
| td(on) | Turn-On Delay Time | VDD=-100V , VGS=-10V , RG=6 , ID=-0.3A | 1.9 | ns | ||
| tr | Rise Time | 1.6 | ns | |||
| td(off) | Turn-Off Delay Time | 22 | ns | |||
| tf | Fall Time | 10.5 | ns | |||
| Ciss | Input Capacitance | VDS=-100V , VGS=0V , f=1MHz | 500 | pF | ||
| Coss | Output Capacitance | 39 | pF | |||
| Crss | Reverse Transfer Capacitance | 20 | pF | |||
| Diode Characteristics | ||||||
| IS | Continuous Source Current1,4 | VG=VD=0V , Force Current | -0.3 | A | ||
| ISM | Pulsed Source Current2,4 | -1.2 | A | |||
| VSD | Diode Forward Voltage2 | VGS=0V , IS=-1A , TJ=25 | -1.3 | V | ||
Ordering Information
| Part Number | Package Code | Packaging |
|---|---|---|
| HSK2P25 | SOT-89 | 1000/Tape&Reel |
Notes:
- 1 The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
- 2 The data tested by pulsed, pulse width ≤300us, duty cycle ≤2%.
- 3 The power dissipation is limited by 150 junction temperature.
- 4 The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.
2410122026_HUASHUO-HSK2P25_C22359224.pdf
Our mission is to offer "High Quality" & "Good Service" & "Fast Delivery" to help our clients to gain more profits.