P Channel MOSFET HSK2P25 Fast Switching Device with Low Gate Charge and Performance in Load Switches

Key Attributes
Model Number: HSK2P25
Product Custom Attributes
Drain To Source Voltage:
250V
Current - Continuous Drain(Id):
2A
Operating Temperature -:
-55℃~+150℃
RDS(on):
4Ω@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
20pF@100V
Number:
1 P-Channel
Pd - Power Dissipation:
1W
Input Capacitance(Ciss):
500pF@100V
Gate Charge(Qg):
8.9nC@4.5V
Mfr. Part #:
HSK2P25
Package:
SOT-89
Product Description

HSK2P25 P-Ch 250V Fast Switching MOSFETs

The HSK2P25 is a high cell density trenched P-channel MOSFET designed for excellent RDS(ON) and efficiency in small power switching and load switch applications. It features super low gate charge, excellent Cdv/dt effect decline, and is built with advanced high cell density Trench technology. This device meets RoHS and Green Product requirements with full function reliability approval. Available in Green Device.

Product Attributes

  • Brand: HS-Semi
  • Product Type: P-Channel MOSFET
  • Switching Speed: Fast Switching
  • Certifications: RoHS, Green Product

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage -250 V
VGS Gate-Source Voltage ±20 V
ID@TC=25 Continuous Drain Current, VGS @ -10V1 -2.0 A
ID@TC=70 Continuous Drain Current, VGS @ -10V1 -1.0 A
ID@TA=25 Continuous Drain Current, VGS @ -10V1 -0.4 A
ID@TA=70 Continuous Drain Current, VGS @ -10V1 -0.3 A
IDM Pulsed Drain Current2 -1.2 A
PD@TA=25 Total Power Dissipation3 1.0 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient1 130 /W
RJC Thermal Resistance Junction-Case1 50 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -250 V
RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V , ID=-0.3A 3.3 4
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -2.0 -3.0 -4.0 V
IDSS Drain-Source Leakage Current VDS=-200V , VGS=0V , TJ=25 1 uA
IDSS Drain-Source Leakage Current VDS=-200V , VGS=0V , TJ=55 10 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V ±100 nA
gfs Forward Transconductance VDS=-5V , ID=-0.8A 1.5 S
Qg Total Gate Charge VDS=-100V , VGS=-4.5V , ID=-0.3A 8.9 nC
Qgs Gate-Source Charge 1.5 nC
Qgd Gate-Drain Charge 1.8 nC
td(on) Turn-On Delay Time VDD=-100V , VGS=-10V , RG=6 , ID=-0.3A 1.9 ns
tr Rise Time 1.6 ns
td(off) Turn-Off Delay Time 22 ns
tf Fall Time 10.5 ns
Ciss Input Capacitance VDS=-100V , VGS=0V , f=1MHz 500 pF
Coss Output Capacitance 39 pF
Crss Reverse Transfer Capacitance 20 pF
Diode Characteristics
IS Continuous Source Current1,4 VG=VD=0V , Force Current -0.3 A
ISM Pulsed Source Current2,4 -1.2 A
VSD Diode Forward Voltage2 VGS=0V , IS=-1A , TJ=25 -1.3 V

Ordering Information

Part Number Package Code Packaging
HSK2P25 SOT-89 1000/Tape&Reel

Notes:

  • 1 The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
  • 2 The data tested by pulsed, pulse width ≤300us, duty cycle ≤2%.
  • 3 The power dissipation is limited by 150 junction temperature.
  • 4 The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.

2410122026_HUASHUO-HSK2P25_C22359224.pdf
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