N Channel MOSFET HUASHUO HSBB6054 Designed for Synchronous Rectifier and DC DC Converter Applications

Key Attributes
Model Number: HSBB6054
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
33A
RDS(on):
8mΩ@10V,12A
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
1.2V
Reverse Transfer Capacitance (Crss@Vds):
25pF@30V
Number:
1 N-channel
Input Capacitance(Ciss):
760pF@30V
Pd - Power Dissipation:
21W
Gate Charge(Qg):
16nC@10V
Mfr. Part #:
HSBB6054
Package:
PRPAK3x3-8L
Product Description

Product Overview

The HSBB6054 is a high-performance N-Channel MOSFET designed for fast switching applications. Featuring advanced trench MOS technology, it offers low gate charge and low RDS(ON) for enhanced efficiency. This device is 100% EAS guaranteed and is available in a green device option. It is ideally suited for motor control, DC/DC converters, and synchronous rectifier applications.

Product Attributes

  • Brand: HS-Semi
  • Technology: Advanced Trench MOS
  • Device Type: N-Ch Fast Switching MOSFET
  • Green Device Available: Yes

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 60 V
VGS Gate-Source Voltage ±20 V
ID@TC=25 Continuous Drain Current1 33 A
ID@TC=100 Continuous Drain Current1 21 A
IDM Pulsed Drain Current2 100 A
EAS Single Pulse Avalanche Energy3 54 mJ
IAS Avalanche Current 33 A
PD@TC=25 Total Power Dissipation4 21 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient1 --- 60 /W
RJC Thermal Resistance Junction-Case1 --- 6 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 60 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=12A 8 12 m
VGS=4.5V , ID=12A 13 18 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 2 2.3 V
IDSS Drain-Source Leakage Current VDS=48V , VGS=0V , TJ=25 --- 1 uA
VDS=48V , VGS=0V , TJ=55 --- 5 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- ±100 nA
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 1.0 ---
Qg Total Gate Charge (10V) VDS=30V , VGS=10V , ID=12A 16 --- nC
Qgs Gate-Source Charge 3.5 --- nC
Qgd Gate-Drain Charge 4.2 --- nC
Td(on) Turn-On Delay Time VDD=30V , VGS=10V , RG=3.3, ID=12A 5.7 --- ns
Tr Rise Time 3.5 --- ns
Td(off) Turn-Off Delay Time 26 --- ns
Tf Fall Time 3.5 --- ns
Ciss Input Capacitance VDS=30V , VGS=0V , f=1MHz 760 --- pF
Coss Output Capacitance 278 --- pF
Crss Reverse Transfer Capacitance 25 --- pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- 33 A
VSD Diode Forward Voltage2 VGS=0V , IS=A , TJ=25 --- 1.2 V
Ordering Information
Part Number Package code Packaging
HSBB6054 PRPAK3*3 3000/Tape&Reel

Notes:
1 The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2 The data tested by pulsed, pulse width ≤ 300us, duty cycle ≤ 2%.
3 The EAS data shows Max. rating. The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=33A.
4 The power dissipation is limited by 150 junction temperature.
5 The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.


2410121655_HUASHUO-HSBB6054_C5341686.pdf

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