n channel mosfet huashuo hsu4094 featuring advanced trench technology for power management in smps and dc dc converters

Key Attributes
Model Number: HSU4094
Product Custom Attributes
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
114A
Operating Temperature -:
-55℃~+150℃
RDS(on):
3.2mΩ@10V,20A
Gate Threshold Voltage (Vgs(th)):
1.7V
Reverse Transfer Capacitance (Crss@Vds):
71pF@20V
Number:
1 N-channel
Input Capacitance(Ciss):
2.65nF@20V
Pd - Power Dissipation:
74W
Gate Charge(Qg):
22.7nC@4.5V
Mfr. Part #:
HSU4094
Package:
TO-252-2
Product Description

Product Overview

The HSU4094 is a fast-switching N-channel MOSFET designed for high-current applications. Featuring advanced trench technology, it offers low gate charge and high current capability, making it suitable for synchronous rectification in SMPS, DC/DC converters, and Or-ing circuits. This MOSFET is 100% UIS and EAS tested, RoHS and Halogen-Free compliant, and guaranteed for 100% EAS.

Product Attributes

  • Brand: HS-Semi
  • Technology: Advanced Trench Technology
  • Certifications: RoHS and Halogen-Free Compliant
  • Testing: 100% UIS Tested, 100% EAS Guaranteed

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 40 V
VGS Gate-Source Voltage ±20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1,6 114 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1,6 72 A
IDM Pulsed Drain Current2 240 A
EAS Single Pulse Avalanche Energy3 145 mJ
IAS Avalanche Current 54 A
PD@TC=25 Total Power Dissipation4 74 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient1 --- 55 /W
RJC Thermal Resistance Junction-Case1 --- 1.7 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 40 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=20A 2.5 3.2 m
VGS=4.5V , ID=15A 3.8 5.3 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 1.7 2.2 V
IDSS Drain-Source Leakage Current VDS=32V , VGS=0V , TJ=25 --- 1 uA
VDS=32V , VGS=0V , TJ=55 --- 5 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- ±100 nA
gfs Forward Transconductance VDS=5V , ID=20A 75 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 1.5 ---
Qg Total Gate Charge (4.5V) VDS=20V , VGS=4.5V , ID=20A 22.7 --- nC
Qgs Gate-Source Charge 7.5 --- nC
Qgd Gate-Drain Charge 5.5 --- nC
Td(on) Turn-On Delay Time VDD=20V , VGS=10V , RG=3, ID=20A 10 --- ns
Tr Rise Time 5 --- ns
Td(off) Turn-Off Delay Time 33 --- ns
Tf Fall Time 6.5 --- ns
Ciss Input Capacitance VDS=20V , VGS=0V , f=1MHz 2650 --- pF
Coss Output Capacitance 899 --- pF
Crss Reverse Transfer Capacitance 71 --- pF
Diode Characteristics
IS Continuous Source Current1,6 VG=VD=0V , Force Current --- 114 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- 1 V
Ordering Information
Part Number Package code Packaging
HSU4094 TO252-2 2500/Tape&Reel

Notes:

  • 1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
  • 2. The data tested by pulsed, pulse width ≤ 300us, duty cycle ≤ 2%.
  • 3. The EAS data shows Max. rating. The test condition is VDD=25V, VGS=10V, L=0.5mH, IAS=54A.
  • 4. The power dissipation is limited by 150 junction temperature.
  • 5. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.
  • 6. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.

2410121656_HUASHUO-HSU4094_C701004.pdf

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