Fast switching P channel MOSFET HUASHUO HSP3119 30V with low RDS ON and power management performance

Key Attributes
Model Number: HSP3119
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
150A
RDS(on):
3mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
1.21nF
Number:
1 P-Channel
Output Capacitance(Coss):
1.38nF
Pd - Power Dissipation:
200W
Input Capacitance(Ciss):
12.7nF
Gate Charge(Qg):
210nC@10V
Mfr. Part #:
HSP3119
Package:
TO-220
Product Description

Product Overview

The HSP3119 is a P-channel, 30V fast-switching MOSFET featuring high cell density trench technology. It offers excellent RDS(ON) and gate charge characteristics, making it ideal for synchronous buck converter applications. This device meets RoHS and Green Product requirements, is 100% EAS guaranteed, and offers excellent Cdv/dt effect decline. It is designed for high-efficiency power management solutions.

Product Attributes

  • Brand: HS-Semi
  • Product Series: HSP3119
  • Technology: Advanced high cell density Trench technology
  • Channel Type: P-Channel
  • Voltage Rating: 30V
  • Switching Speed: Fast Switching
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed, Full function reliability approved

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage -30 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ -10V1,6 -150 A
ID@TC=100 Continuous Drain Current, VGS @ -10V1,6 -95 A
IDM Pulsed Drain Current2 -510 A
EAS Single Pulse Avalanche Energy3 1050 mJ
IAS Avalanche Current -75 A
PD@TC=25 Total Power Dissipation4 200 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient1 (Steady State) 62 /W
RJC Thermal Resistance Junction-case1 0.81 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -30 V
RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V , ID=-30A 2.7 3.0 m
VGS=-4.5V , ID=-20A 3.5 4.2 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -1.0 -2.5 V
IDSS Drain-Source Leakage Current VDS=-30V , VGS=0V , TJ=25 -1 uA
VDS=-30V , VGS=0V , TJ=125 -100 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V 100 nA
Rg Gate resistance VDS=0V , VGS=0V , f=1MHz 1.8
Qg Total Gate Charge (-10V) VDD=-15V , VGS=-10V , ID=-20A 210 nC
Qgs Gate-Source Charge 2.2
Qgd Gate-Drain Charge 3.3
Td(on) Turn-On Delay Time VDD=-15V , VGS=-10V , RG=3, ID=-10A 17 ns
Tr Rise Time 6
Td(off) Turn-Off Delay Time 21 ns
Tf Fall Time 39
Ciss Input Capacitance VDS=-15V , VGS=0V , f=1MHz 12700 pF
Coss Output Capacitance 1380
Crss Reverse Transfer Capacitance 1210
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current -150 A
VSD Diode Forward Voltage2 VGS=0V , IS=-20A , TJ=25 -1.2 V
trr Reverse Recovery Time IF=-20A , di/dt=100A/s , TJ=25 37 nS
Qrr Reverse Recovery Charge 30 nC

2410122016_HUASHUO-HSP3119_C22359262.pdf
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