SiC Power MOSFET HXY MOSFET DMWS120H100SM4-HXY 1200V 32A N Channel Enhancement Mode Device

Key Attributes
Model Number: DMWS120H100SM4-HXY
Product Custom Attributes
Drain To Source Voltage:
1.2kV
Current - Continuous Drain(Id):
32A
Operating Temperature -:
-40℃~+175℃
RDS(on):
90mΩ
Gate Threshold Voltage (Vgs(th)):
3.6V
Reverse Transfer Capacitance (Crss@Vds):
2pF
Pd - Power Dissipation:
136W
Output Capacitance(Coss):
58pF
Input Capacitance(Ciss):
1.39nF
Gate Charge(Qg):
53nC
Mfr. Part #:
DMWS120H100SM4-HXY
Package:
TO-247-4L
Product Description

Product Overview

This 3rd generation SiC Power MOSFET, the DMWS120H100SM4 from HUAXUANYANG ELECTRONICS CO.,LTD, offers high performance with a 1200V drain-source voltage and low on-resistance. It features high-speed switching capabilities, a fast intrinsic diode with low reverse recovery, and an optimized package with a separate driver source pin for improved system efficiency and power density. Applications include renewable energy systems, EV battery chargers, high voltage DC/DC converters, and switch mode power supplies.

Product Attributes

  • Brand: HUAXUANYANG ELECTRONICS CO.,LTD
  • Model: DMWS120H100SM4
  • Material: SiC (Silicon Carbide)
  • Technology: N-Channel Enhancement Mode
  • Package: TO-247H-4L
  • Certifications: Halogen free, RoHS compliant

Technical Specifications

ParameterValueUnitTest ConditionsNotes
Drain - Source Voltage (VDSmax)1200VVGS = 0 V, ID = 100 A
Gate - Source Voltage (VGSmax, dynamic)-8/+19VAC (f >1 Hz)Note: 1
Gate - Source Voltage (VGSop, static)-4/+15VStaticNote: 2
Continuous Drain Current (ID)32AVGS = 15 V, TC = 25CFig. 19
Pulsed Drain Current (ID(pulse))80APulse width tP limited by TjmaxFig. 22
Power Dissipation (PD)136WTC=25C, TJ = 175 CFig. 20
Operating Junction and Storage Temperature (TJ, Tstg)-40 to +175C
Solder Temperature (TL)260C1.6mm (0.063) from case for 10s
Drain-Source Breakdown Voltage (V(BR)DSS)1200VVGS = 0 V, ID = 100 A
Gate Threshold Voltage (VGS(th))1.8 / 2.5 / 3.6VVDS = VGS, ID = 5 mAFig. 11
Zero Gate Voltage Drain Current (IDSS)1 / 50AVDS = 1200 V, VGS = 0 V
Gate-Source Leakage Current (IGSS)10 / 250nAVGS = 15 V, VDS = 0 V
Drain-Source On-State Resistance (RDS(on))75 / 90mVGS = 15 V, ID = 20 AFig. 4, 5, 6
Transconductance (gfs)12 / 13SVDS= 20 V, IDS= 20 AFig. 7
Input Capacitance (Ciss)1390pFVGS = 0 V, VDS = 1000 V f = 1 MHz VAC = 25 mVFig. 17, 18
Output Capacitance (Coss)58pFVGS = 0 V, VDS = 1000 V f = 1 MHz VAC = 25 mVFig. 17, 18
Reverse Transfer Capacitance (Crss)2pFVGS = 0 V, VDS = 1000 V f = 1 MHz VAC = 25 mVFig. 17, 18
Stored Energy (Eoss)33JFig. 16
Turn-On Switching Energy (EON)270JVDS = 800 V, VGS = -4 V/15 V, ID = 20A, RG(ext) = 0 , L= 156 H, TJ = 150CFig. 26, 29
Turn-Off Switching Energy (EOFF)77JVDS = 800 V, VGS = -4 V/15 V, ID = 20A, RG(ext) = 0 , L= 156 H, TJ = 150CFig. 26, 29
Turn-On Delay Time (td(on))30nsVDD = 800 V, VGS = -4 V/15 V ID = 20 A, RG(ext) = 0 , Timing relative to VDSInductive loadFig. 27, 28
Rise Time (tr)14nsVDD = 800 V, VGS = -4 V/15 V ID = 20 A, RG(ext) = 0 , Timing relative to VDSInductive loadFig. 27, 28
Turn-Off Delay Time (td(off))38nsVDD = 800 V, VGS = -4 V/15 V ID = 20 A, RG(ext) = 0 , Timing relative to VDSInductive loadFig. 27, 28
Fall Time (tf)10nsVDD = 800 V, VGS = -4 V/15 V ID = 20 A, RG(ext) = 0 , Timing relative to VDSInductive loadFig. 27, 28
Internal Gate Resistance (RG(int))9.0f = 1 MHz, VAC = 25 mV
Gate to Source Charge (Qgs)17nCVDS = 800 V, VGS = -4 V/15 V ID = 20 APer IEC60747-8-4 pg 21 Fig. 12
Gate to Drain Charge (Qgd)18nCVDS = 800 V, VGS = -4 V/15 V ID = 20 APer IEC60747-8-4 pg 21 Fig. 12
Total Gate Charge (Qg)53nCVDS = 800 V, VGS = -4 V/15 V ID = 20 APer IEC60747-8-4 pg 21 Fig. 12
Diode Forward Voltage (VSD)4.5 / 4.0VVGS = -4 V, ISD = 10 AFig. 8, 9, 10
Continuous Diode Forward Current (IS)26AVGS = -4 V, TJ = 25 CNote 1
Diode pulse Current (IS, pulse)80AVGS = -4 V, pulse width tP limited by TjmaxNote 1
Reverse Recover time (trr)20nsVGS = -4 V, ISD = 20 A, VR = 800 V dif/dt = 3600 A/s, TJ = 150 CNote 1
Reverse Recovery Charge (Qrr)254nCVGS = -4 V, ISD = 20 A, VR = 800 V dif/dt = 3600 A/s, TJ = 150 CNote 1
Peak Reverse Recovery Current (Irrm)18AVGS = -4 V, ISD = 20 A, VR = 800 V dif/dt = 3600 A/s, TJ = 150 CNote 1
Thermal Resistance Junction to Case (RJC)1.1C/WFig. 21
Thermal Resistance Junction to Ambient (RJA)40C/W

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