Fast Switching MOSFET HUASHUO HSH100N15 N Channel with 150V Drain Source Voltage and 7.3 Milliohm RDS

Key Attributes
Model Number: HSH100N15
Product Custom Attributes
Drain To Source Voltage:
150V
Current - Continuous Drain(Id):
100A
Operating Temperature -:
-55℃~+150℃
RDS(on):
7.3mΩ@10V,20A
Gate Threshold Voltage (Vgs(th)):
2V
Reverse Transfer Capacitance (Crss@Vds):
9.5pF
Number:
1 N-channel
Pd - Power Dissipation:
178W
Input Capacitance(Ciss):
5.88nF
Gate Charge(Qg):
100nC@10V
Mfr. Part #:
HSH100N15
Package:
TO-263
Product Description

Product Overview

The HSH100N15 is an N-Channel Fast Switching MOSFET designed for high-frequency applications. It features a 150V drain-source voltage, a continuous drain current of up to 100A, and a low on-resistance (RDS(ON)) of typically 7.3m. This MOSFET utilizes advanced high cell density Trench technology, offering super low RDS(ON) and guaranteed 100% EAS. It is suitable for motor drivers, Battery Management Systems (BMS), and high-frequency switching with synchronous rectification. Available as a Green Device.

Product Attributes

  • Brand: HSH
  • Type: N-Channel MOSFET
  • Technology: Fast Switching, Trench Technology
  • Certifications: Green Device Available

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 150 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1,6 100 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1,6 63 A
IDM Pulsed Drain Current2 400 A
EAS Single Pulse Avalanche Energy3 785 mJ
IAS Avalanche Current 56 A
PD@TC=25 Total Power Dissipation4 178 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient --- 50 /W
RJC Thermal Resistance Junction-Case1 --- 0.7 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 150 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=20A 7.3 9 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 2.0 3.0 4.0 V
IDSS Drain-Source Leakage Current VDS=120V , VGS=0V , TJ=25 --- 1 uA
IDSS Drain-Source Leakage Current VDS=120V , VGS=0V , TJ=125 --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- 100 nA
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 1.9 ---
Qg Total Gate Charge (10V) VDS=75V , VGS=10V , ID=20A 100 --- nC
Qgs Gate-Source Charge 25 ---
Qgd Gate-Drain Charge 31 ---
Td(on) Turn-On Delay Time VDD=30V , VGS=10V , RG=3.3, ID=1A 32 --- ns
Tr Rise Time 25 ---
Td(off) Turn-Off Delay Time 98 ---
Tf Fall Time 89 ---
Ciss Input Capacitance VDS=75V , VGS=0V , f=1MHz 5880 --- pF
Coss Output Capacitance 401 ---
Crss Reverse Transfer Capacitance 9.5 ---
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- 100 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- 1.2 V

Notes:
1. Tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. Tested by pulsed, pulse width 300s, duty cycle 2%.
3. EAS data shows Max. rating. Test condition: VDD=50V, VGS=10V, L=0.5mH, IAS=56A.
4. Power dissipation is limited by 150 junction temperature.
5. Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.
6. Package limitation current.


2410121642_HUASHUO-HSH100N15_C5341707.pdf

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