Single N Channel MOSFET HUAYI HYG038N03LR1D Featuring Low RDS ON and Avalanche Tested for Battery Protection

Key Attributes
Model Number: HYG038N03LR1D
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
78A
RDS(on):
6.3mΩ@4.5V
Operating Temperature -:
-55℃~+175℃
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
176pF
Number:
1 N-channel
Output Capacitance(Coss):
213pF
Pd - Power Dissipation:
47W
Input Capacitance(Ciss):
1.466nF
Gate Charge(Qg):
35.5nC@10V
Mfr. Part #:
HYG038N03LR1D
Package:
TO-252-2L
Product Description

Product Overview

The HYG038N03LR1D is a single N-Channel Enhancement Mode MOSFET designed for various applications including load switches and lithium battery protection boards. It offers high performance with a low RDS(ON) of 3.5 m (typ.) at VGS = 10V and 4.9 m (typ.) at VGS = 4.5V. This device is 100% avalanche tested, reliable, and rugged, with halogen-free options available.

Product Attributes

  • Brand: HYG (Huayi Microelectronics Co., Ltd.)
  • Package Type: TO-252-2L
  • Certifications: RoHS compliant, Halogen-Free

Technical Specifications

ParameterTest ConditionsMinTyp.MaxUnit
Absolute Maximum Ratings
Drain-Source Voltage (VDSS)--30V
Gate-Source Voltage (VGSS)--20V
Junction Temperature Range (TJ)-55-175
Storage Temperature Range (TSTG)-55-175
Source Current-Continuous (IS)Tc=25, Mounted on Large Heat Sink--78A
Pulsed Drain Current (IDM)Tc=25--260A
Continuous Drain Current (ID)Tc=25--78A
Continuous Drain Current (ID)Tc=100--55A
Maximum Power Dissipation (PD)Tc=25--47W
Maximum Power Dissipation (PD)Tc=100--23.5W
Thermal Resistance, Junction-to-Case (RJC)-3.2-/W
Thermal Resistance, Junction-to-Ambient (RJA)Surface mounted on FR-4 board-60.0-/W
Single Pulsed-Avalanche Energy (EAS)L=0.3mH-122-mJ
Electrical Characteristics
Drain-Source Breakdown Voltage (BVDSS)VGS=0V, IDS=250A30--V
Drain-to-Source Leakage Current (IDSS)VDS=30V,VGS=0V--1A
Drain-to-Source Leakage Current (IDSS)TJ=125--50A
Gate Threshold Voltage (VGS(th))VDS=VGS, IDS=250A1.01.83.0V
Gate-Source Leakage Current (IGSS)VGS=20V,VDS=0V--100nA
Drain-Source On-State Resistance (RDS(ON))VGS=10V,IDS=20A-3.54.2m
Drain-Source On-State Resistance (RDS(ON))VGS=4.5V,IDS=20A-4.96.3m
Diode Forward Voltage (VSD)ISD=20A,VGS=0V-0.831.2V
Reverse Recovery Time (trr)ISD=20A,dISD/dt=100A/s-12-ns
Reverse Recovery Charge (Qrr)-5-nC
Gate Resistance (RG)VGS=0V,VDS=0V,F=1MHz-2.3-
Input Capacitance (Ciss)VGS=0V, VDS=25V, Frequency=1.0MHz-1466-pF
Output Capacitance (Coss)-213-pF
Reverse Transfer Capacitance (Crss)-176-pF
Turn-on Delay Time (td(ON))VDD=15V,RG=4, IDS=20A,VGS=10V-8-ns
Turn-on Rise Time (Tr)-51-ns
Turn-off Delay Time (td(OFF))-37-ns
Turn-off Fall Time (Tf)-54-ns
Total Gate Charge (Qg)VDS =24V, VGS=10V, ID=20A-35.5-nC
Total Gate Charge (Qg)VGS=4.5V-18.9-nC
Gate-Source Charge (Qgs)-5.5-nC
Gate-Drain Charge (Qgd)-10.9-nC

2410122028_HUAYI-HYG038N03LR1D_C3721022.pdf

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