Power management device single n channel enhancement mode mosfet HUAYI HYG082N03LR1C1 rohs compliant

Key Attributes
Model Number: HYG082N03LR1C1
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
32A
Operating Temperature -:
-55℃~+175℃
RDS(on):
13.5mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
1.8V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
65pF
Number:
1 N-channel
Output Capacitance(Coss):
108pF
Input Capacitance(Ciss):
787pF
Pd - Power Dissipation:
21.4W
Gate Charge(Qg):
14.8nC@10V
Mfr. Part #:
HYG082N03LR1C1
Package:
DFN3x3-8L
Product Description

HYG082N03LR1C1 - Single N-Channel Enhancement Mode MOSFET

The HYG082N03LR1C1 is a single N-Channel enhancement mode MOSFET designed for power management and switching applications. It offers high performance with low on-resistance and is 100% avalanche tested for reliability. This device is available in Halogen Free and Green (RoHS Compliant) versions.

Product Attributes

  • Brand: HYG (Huayi Microelectronics)
  • Origin: China
  • Material: Lead-free (RoHS Compliant), Halogen Free
  • Certifications: RoHS Compliant, IPC/JEDEC J-STD-020 MSL Classification

Technical Specifications

ParameterSymbolConditionsMinTyp.MaxUnit
Absolute Maximum Ratings
Drain-Source VoltageVDSSTc=25C Unless Otherwise Noted30V
Gate-Source VoltageVGSS20V
Maximum Junction TemperatureTJ-55175C
Storage Temperature RangeTSTG-55175C
Source Current-Continuous (Body Diode)ISTc=25C, Mounted on Large Heat Sink32A
Pulsed Drain CurrentIDMTc=25C*115A
Continuous Drain CurrentIDTc=25C32A
Continuous Drain CurrentIDTc=100C22.6A
Maximum Power DissipationPDTc=25C21.4W
Maximum Power DissipationPDTc=100C10.7W
Thermal Resistance, Junction-to-CaseRJC7C/W
Thermal Resistance, Junction-to-AmbientRJA**75C/W
Single Pulsed-Avalanche EnergyEAS***12mJ
Electrical Characteristics
Drain-Source Breakdown VoltageBVDSSVGS=0V, IDS=250A30V
Drain-to-Source Leakage CurrentIDSSVDS=30V,VGS=0V1A
Drain-to-Source Leakage CurrentIDSSTJ=125C50A
Gate Threshold VoltageVGS(th)VDS=VGS, IDS=250A11.83V
Gate-Source Leakage CurrentIGSSVGS=20V,VDS=0V100nA
Drain-Source On-State ResistanceRDS(ON)VGS=10V,IDS=10A*7.09.0m
Drain-Source On-State ResistanceRDS(ON)VGS=4.5V,IDS=10A*10.513.5m
Diode Characteristics
Diode Forward VoltageVSDISD=10A,VGS=0V*0.81.2V
Reverse Recovery TimetrrISD=10A,dISD/dt=100A/s9ns
Reverse Recovery ChargeQrr10nC
Dynamic Characteristics
Gate ResistanceRGVGS=0V,VDS=0V, Frequency=1.0MHz2.5
Input CapacitanceCissVGS=0V, VDS=25V, Frequency=1.0MHz787pF
Output CapacitanceCossVGS=0V, VDS=25V, Frequency=1.0MHz108pF
Reverse Transfer CapacitanceCrssVGS=0V, VDS=25V, Frequency=1.0MHz65pF
Turn-on Delay Timetd(ON)VDD=10V,RG=4, IDS=10A,VGS=10V4ns
Turn-on Rise TimeTrVDD=10V,RG=4, IDS=10A,VGS=10V8ns
Turn-off Delay Timetd(OFF)VDD=10V,RG=4, IDS=10A,VGS=10V14ns
Turn-off Fall TimeTfVDD=10V,RG=4, IDS=10A,VGS=10V5ns
Gate Charge Characteristics
Total Gate ChargeQgVDS =24V, VGS=10V, ID=10A14.8nC
Gate-Source ChargeQgsVDS =24V, VGS=10V, ID=10A2.1nC
Gate-Drain ChargeQgdVDS =24V, VGS=10V, ID=10A3.4nC

*Pulse testpulse width 300usduty cycle 2%
**Surface mounted on 1in FR-4 board.
***Limited by TJmax , starting TJ=25C, L = 0.1mH, RG= 25, VGS =10V.


2410121306_HUAYI-HYG082N03LR1C1_C2827246.pdf

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