Power management device single n channel enhancement mode mosfet HUAYI HYG082N03LR1C1 rohs compliant
HYG082N03LR1C1 - Single N-Channel Enhancement Mode MOSFET
The HYG082N03LR1C1 is a single N-Channel enhancement mode MOSFET designed for power management and switching applications. It offers high performance with low on-resistance and is 100% avalanche tested for reliability. This device is available in Halogen Free and Green (RoHS Compliant) versions.
Product Attributes
- Brand: HYG (Huayi Microelectronics)
- Origin: China
- Material: Lead-free (RoHS Compliant), Halogen Free
- Certifications: RoHS Compliant, IPC/JEDEC J-STD-020 MSL Classification
Technical Specifications
| Parameter | Symbol | Conditions | Min | Typ. | Max | Unit |
| Absolute Maximum Ratings | ||||||
| Drain-Source Voltage | VDSS | Tc=25C Unless Otherwise Noted | 30 | V | ||
| Gate-Source Voltage | VGSS | 20 | V | |||
| Maximum Junction Temperature | TJ | -55 | 175 | C | ||
| Storage Temperature Range | TSTG | -55 | 175 | C | ||
| Source Current-Continuous (Body Diode) | IS | Tc=25C, Mounted on Large Heat Sink | 32 | A | ||
| Pulsed Drain Current | IDM | Tc=25C* | 115 | A | ||
| Continuous Drain Current | ID | Tc=25C | 32 | A | ||
| Continuous Drain Current | ID | Tc=100C | 22.6 | A | ||
| Maximum Power Dissipation | PD | Tc=25C | 21.4 | W | ||
| Maximum Power Dissipation | PD | Tc=100C | 10.7 | W | ||
| Thermal Resistance, Junction-to-Case | RJC | 7 | C/W | |||
| Thermal Resistance, Junction-to-Ambient | RJA | ** | 75 | C/W | ||
| Single Pulsed-Avalanche Energy | EAS | *** | 12 | mJ | ||
| Electrical Characteristics | ||||||
| Drain-Source Breakdown Voltage | BVDSS | VGS=0V, IDS=250A | 30 | V | ||
| Drain-to-Source Leakage Current | IDSS | VDS=30V,VGS=0V | 1 | A | ||
| Drain-to-Source Leakage Current | IDSS | TJ=125C | 50 | A | ||
| Gate Threshold Voltage | VGS(th) | VDS=VGS, IDS=250A | 1 | 1.8 | 3 | V |
| Gate-Source Leakage Current | IGSS | VGS=20V,VDS=0V | 100 | nA | ||
| Drain-Source On-State Resistance | RDS(ON) | VGS=10V,IDS=10A* | 7.0 | 9.0 | m | |
| Drain-Source On-State Resistance | RDS(ON) | VGS=4.5V,IDS=10A* | 10.5 | 13.5 | m | |
| Diode Characteristics | ||||||
| Diode Forward Voltage | VSD | ISD=10A,VGS=0V* | 0.8 | 1.2 | V | |
| Reverse Recovery Time | trr | ISD=10A,dISD/dt=100A/s | 9 | ns | ||
| Reverse Recovery Charge | Qrr | 10 | nC | |||
| Dynamic Characteristics | ||||||
| Gate Resistance | RG | VGS=0V,VDS=0V, Frequency=1.0MHz | 2.5 | |||
| Input Capacitance | Ciss | VGS=0V, VDS=25V, Frequency=1.0MHz | 787 | pF | ||
| Output Capacitance | Coss | VGS=0V, VDS=25V, Frequency=1.0MHz | 108 | pF | ||
| Reverse Transfer Capacitance | Crss | VGS=0V, VDS=25V, Frequency=1.0MHz | 65 | pF | ||
| Turn-on Delay Time | td(ON) | VDD=10V,RG=4, IDS=10A,VGS=10V | 4 | ns | ||
| Turn-on Rise Time | Tr | VDD=10V,RG=4, IDS=10A,VGS=10V | 8 | ns | ||
| Turn-off Delay Time | td(OFF) | VDD=10V,RG=4, IDS=10A,VGS=10V | 14 | ns | ||
| Turn-off Fall Time | Tf | VDD=10V,RG=4, IDS=10A,VGS=10V | 5 | ns | ||
| Gate Charge Characteristics | ||||||
| Total Gate Charge | Qg | VDS =24V, VGS=10V, ID=10A | 14.8 | nC | ||
| Gate-Source Charge | Qgs | VDS =24V, VGS=10V, ID=10A | 2.1 | nC | ||
| Gate-Drain Charge | Qgd | VDS =24V, VGS=10V, ID=10A | 3.4 | nC | ||
*Pulse testpulse width 300usduty cycle 2%
**Surface mounted on 1in FR-4 board.
***Limited by TJmax , starting TJ=25C, L = 0.1mH, RG= 25, VGS =10V.
2410121306_HUAYI-HYG082N03LR1C1_C2827246.pdf
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