N Channel Enhancement Mode MOSFET HUAYI HYG023N04NR1P with Low RDS ON and RoHS Compliant Green Device

Key Attributes
Model Number: HYG023N04NR1P
Product Custom Attributes
Drain To Source Voltage:
45V
Current - Continuous Drain(Id):
179A
Operating Temperature -:
-55℃~+175℃
RDS(on):
2.2mΩ@10V,40A
Gate Threshold Voltage (Vgs(th)):
4V
Reverse Transfer Capacitance (Crss@Vds):
533pF
Number:
1 N-channel
Pd - Power Dissipation:
167W
Input Capacitance(Ciss):
3.466nF
Gate Charge(Qg):
82.5nC@32V
Mfr. Part #:
HYG023N04NR1P
Package:
TO-220FB-3L
Product Description

HYG023N04NR1P/B N-Channel Enhancement Mode MOSFET

The HYG023N04NR1P/B is an N-Channel Enhancement Mode MOSFET designed for switching applications, including Li-battery protection. It offers high performance with a low RDS(ON) of 2.2m(typ.) at VGS = 10V, 45V/179A rating, and 100% avalanche tested for reliability and ruggedness. Lead-free and green devices are available, compliant with RoHS standards.

Product Attributes

  • Brand: Hymexa
  • Model: HYG023N04NR1P/B
  • Certifications: RoHS Compliant, Lead-Free, Green Devices Available

Technical Specifications

Parameter Test Conditions HYG023N04NR1 Unit Min Typ. Max
Absolute Maximum Ratings
VDSS Drain-Source Voltage V - - 45
VGSS Gate-Source Voltage V - - 25
TJ Junction Temperature Range C -55 - 175
TSTG Storage Temperature Range C -55 - 175
ID Continuous Drain Current (Tc=25C) A - - 179
ID Continuous Drain Current (Tc=100C) A - - 126
IDM Pulsed Drain Current (Tc=25C) A - - 532
PD Maximum Power Dissipation (Tc=25C) W - - 167
PD Maximum Power Dissipation (Tc=100C) W - - 83
RJC Thermal Resistance, Junction-to-Case C/W - 0.9 -
RJA Thermal Resistance, Junction-to-Ambient C/W - 62.5 -
EAS Single Pulsed-Avalanche Energy (L=0.3mH) mJ - 441 -
Static Characteristics
BVDSS Drain-Source Breakdown Voltage (VGS=0V, IDS= 250A) V 45 - -
IDSS Drain-to-Source Leakage Current (VDS=45V,VGS=0V) A - - 1
IDSS Drain-to-Source Leakage Current (TJ=125C) A - - 5
VGS(th) Gate Threshold Voltage (VDS=VGS, IDS= 250A) V 2 2.8 4
IGSS Gate-Source Leakage Current (VGS=25V,VDS=0V) nA - - 100
RDS(ON) Drain-Source On-State Resistance (VGS= 10V,IDS= 40A) m - 2.2 2.7
Diode Characteristics
VSD Diode Forward Voltage (ISD=40A,VGS=0V) V - 0.8 1.0
trr Reverse Recovery Time (ISD=20A,dISD/dt=100A/s) ns - 27 -
Qrr Reverse Recovery Charge nC - 25 -
Dynamic Characteristics
RG Gate Resistance (VGS=0V,VDS=0V,F=1MHz) - 0.8 -
Ciss Input Capacitance (VGS=0V, VDS= 25V, Frequency=1.0MHz) pF - 3466 -
Coss Output Capacitance pF - 626 -
Crss Reverse Transfer Capacitance pF - 533 -
td(ON) Turn-on Delay Time (VDD= 20V,RG=4, IDS=20A,VGS=10V) ns - 17 -
Tr Turn-on Rise Time ns - 59 -
td(OFF) Turn-off Delay Time ns - 40 -
Tf Turn-off Fall Time ns - 56 -
Gate Charge Characteristics
Qg Total Gate Charge (VDS = 32V, VGS= 10V, IDs= 20A) nC - 82.5 -
Qgs Gate-Source Charge nC - 13.8 -
Qgd Gate-Drain Charge nC - 40.9 -

2409302230_HUAYI-HYG023N04NR1P_C4555913.pdf

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