Power electronics component HXY MOSFET IRG8P50N120KD-EPBF-HXY IGBT designed for motor drives and PTC

Key Attributes
Model Number: IRG8P50N120KD-EPBF-HXY
Product Custom Attributes
Pd - Power Dissipation:
441W
Td(off):
262ns
Td(on):
25ns
Collector-Emitter Breakdown Voltage (Vces):
1.2kV
Reverse Transfer Capacitance (Cres):
93pF
IGBT Type:
FS (Field Stop)
Gate-Emitter Threshold Voltage (Vge(th)@Ic):
4.3V@1mA
Gate Charge(Qg):
346nC@15V
Reverse Recovery Time(trr):
94ns
Switching Energy(Eoff):
2.3mJ
Turn-On Energy (Eon):
1.3mJ
Input Capacitance(Cies):
3.98nF
Pulsed Current- Forward(Ifm):
160A
Output Capacitance(Coes):
157pF
Mfr. Part #:
IRG8P50N120KD-EPBF-HXY
Package:
TO-247
Product Description

Product Overview

The IRG8P50N120KD-EPBF is an Insulated Gate Bipolar Transistor (IGBT) manufactured using advanced Trench and Field Stop (T-FS) technology. This technology enhances performance by reducing conduction losses, improving switching characteristics, and increasing avalanche energy. It is designed for applications such as PTC, motor drives, and On-Board Chargers (OBC).

Product Attributes

  • Brand: HUAXUANYANG HXY ELECTRONICS CO.,LTD
  • Model: IRG8P50N120KD-EPBF
  • Package Type: TO-247
  • Certifications: AEC-Q101 Qualified, Halogen Free and Green Devices Available (RoHS Compliant)
  • Origin: Shenzhen HuaXuanYang Electronics CO.,LTD

Technical Specifications

ParameterValueUnitConditionsMin.Typ.Max.
Absolute Ratings
VCES1200V
IC @TC=25C80A
IC @TC=100C40A
ICM (Pulsed)160Atp limited by TJmax
IF @TC=25C80A
IF @TC=100C40A
IFM (Maximum)160Alimited by TJmax
VGES30V
tSC (Short circuit withstand time)13sVGE=15V, VCC400V, allowed number of short circuits<1000,times between short circuits1.0s,TJ175C
PD @TC=25C441W
TJmax, Tstg55 to 175Operating Junction and Storage Temperature Range
TL (Maximum for Soldering)260
Thermal Characteristics
RJC (IGBT)0.34/WJunction-to-Case
RJC (Diode)0.80/WJunction-to-Case
RJA40/WJunction-to-Ambient
Electrical Characteristics (Static)
VCES (Breakdown Voltage)1200VVGE =0V, IC=1mA
VCE(sat)VVGE =15V, IC =40A1.70 (TJ=25)2.20 (TJ=175)
VGE(TH) (Gate Threshold Voltage)VVCE=VGE,IC=1mA4.35.36.3
VF (Diode Forward Voltage)VIF=40A1.85 (TJ=25)2.25 (TJ=175)
ICES (Collector-Emitter Leakage Current)AVCE=1200V, VGE=0V10
IGES(F) (Gate-Emitter Forward Leakage Current)nAVGE=+20V200
IGES(R) (Gate-Emitter Reverse Leakage Current)nAVGE=-20V-200
Electrical Characteristics (Dynamic)
Cies (Input Capacitance)pFVGE=0V, VCE=25V, f=1.0MHz3980
Coes (Output Capacitance)pF157
Cres (Reverse Transfer Capacitance)pF93
Qg (Gate charge)nCVCC=960V, ICE=40A, VGE=15V346
Qge (Gate-emitter charge)nC2.4
Qgc (Gate-collector charge)nC238
IGBT Switching Characteristics (TJ=25)
td(on) (Turn-on Delay Time)nsIC=40A, VCC=600V, VGE=15V, Rg=5, Inductive Load25
tr (Rise Time)ns28
td(off) (Turn-Off Delay Time)ns262
tf (Fall Time)ns149
Eon (Turn-On Switching Loss)mJ1.30
Eoff (Turn-Off Switching Loss)mJ2.30
Ets (Total Switching Loss)mJ3.60
IGBT Switching Characteristics (TJ=175)
td(on) (Turn-on Delay Time)nsIC=40A, VCC=600V, VGE=15V, Rg=5, Inductive Load26
tr (Rise Time)ns35
td(off) (Turn-Off Delay Time)ns331
tf (Fall Time)ns224
Eon (Turn-On Switching Loss)mJ2.20
Eoff (Turn-Off Switching Loss)mJ3.70
Ets (Total Switching Loss)mJ5.90
Diode Characteristics (TJ=25)
Trr (Reverse Recovery Time)nsIF=40A, VCC=600V, di/dt=200A/s94
Qrr (Reverse Recovery Charge)nC225
Irrm (Reverse Recovery Current)A9.7
Diode Characteristics (TJ=175)
Trr (Reverse Recovery Time)nsIF=40A, VCC=600V, di/dt=200A/s125
Qrr (Reverse Recovery Charge)nC277
Irrm (Reverse Recovery Current)A11.2

2509181737_HXY-MOSFET-IRG8P50N120KD-EPBF-HXY_C49003396.pdf

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